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MAX2828ETN+T

Analog Devices

MAX2828ETN+T by Analog Devices

MAX2828ETN+T by Analog Devices is a BICMOS technology telecom IC with 56 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, supports circuits at 2.7V, and has a terminal pitch of 0.5mm. Ideal for network interfaces in industrial applications due to its compact size and surface mount capability.

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MAX2828ETN+T by Analog Devices
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Vyrian

USA . 11,658 parts In-Stock

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Digiode

USA . 2,496 parts In-Stock

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Anansix

USA . 1,938 parts In-Stock

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MARBEL Systems

Belgium . 349 parts In-Stock

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$8.752

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Texas Native Microelectronics

USA . 1,000 parts In-Stock

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$10.060

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$9.658

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$9.356

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$8.853

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$10.060

$9.658

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$8.853

Kenton Components

USA . 3,558 parts In-Stock

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$12.072

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$10.623

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AZTECH Wire

Italy . 626 parts In-Stock

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$13.752

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$19.743

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$17.966

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$16.189

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Qasali Group International

UK . 924 parts In-Stock

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$27.162

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$25.261

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$23.903

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One Stop Electronics

USA . 2,667 parts In-Stock

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$602.000

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Semicontronic

India . 1,046 parts In-Stock

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$952.000

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$928.200

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$923.440

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QUARKTWIN TECHNOLOGY LTD

USA . 9,042 parts In-Stock

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Corphita

USA . 2,887 parts In-Stock

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RC Electronics

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Kepictronics

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Metaverse IC Inc.

Canada . 2,221 parts In-Stock

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Authorized Procurement Solutions

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Overview

Enhance your network interfaces with the MAX2828ETN+T from Analog Devices, a leading manufacturer known for superior quality and reliability. This versatile chip carrier boasts a square package shape with a very thin profile, making it ideal for a wide range of industrial applications. With its support circuit telecom IC type and advanced BICMOS technology, this component offers customers unmatched performance and efficiency. Maximize your system's potential with the MAX2828ETN+T and experience seamless connectivity like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface Mount technology allows for easy installation and saves space on the PCB, making it a convenient choice.

Package Shape: SQUARE

The square package shape helps in uniform heat dissipation and efficient use of PCB space.

No. of Terminals: 56

With a high number of terminals, this network interface can support complex connectivity requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for usage in a wide range of temperature conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and ensures a durable connection.

Width: 8 mm

The compact width of 8 mm enables easy integration into various electronic devices.

Technology: BICMOS

BICMOS technology offers a combination of bipolar and CMOS technologies, providing high performance and low power consumption.

Nominal Supply Voltage: 2.7 V

The low nominal supply voltage of 2.7 V helps in reducing power consumption and heat generation.

Technical Specifications

Network Interfaces MAX2828ETN+T attributes and parameters. Explore more Network Interfaces devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MAX2828ETN+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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