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HMC680LP4

Analog Devices

HMC680LP4 by Analog Devices

Analog Devices' HMC680LP4 is a BICMOS technology telecom IC with 24 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Nominal voltage of 5V makes it ideal for telecom circuit interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,541 parts In-Stock

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3,541

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Digiode

USA . 973 parts In-Stock

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973

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 263 parts In-Stock

1+ parts

$13.927

100+ parts

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263

$13.927

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Parana Technologies

USA . 2,262 parts In-Stock

1+ parts

$15.689

100+ parts

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$14.591

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2,262

$15.689

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$14.591

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IDEA Electronic Components Group

UK . 610 parts In-Stock

1+ parts

$16.870

100+ parts

$16.026

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$16.026

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610

$16.870

$16.026

$16.026

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DigiPath Technology Company

USA . 115 parts In-Stock

1+ parts

$26.317

100+ parts

$25.265

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$25.265

115

$26.317

$25.265

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$25.265

Semicontronic

India . 877 parts In-Stock

1+ parts

$582.000

100+ parts

$567.450

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$564.540

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877

$582.000

$567.450

$564.540

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One Stop Electronics

USA . 1,540 parts In-Stock

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$997.000

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1,540

$997.000

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Corphita

USA . 976 parts In-Stock

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976

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Overview

Elevate your telecom interface systems with the HMC680LP4 by Analog Devices. Crafted with precision and expertise, this chip carrier is designed to optimize performance and reliability in various applications. With a compact square shape and surface mount capability, this product offers convenience and flexibility in installation. From industrial-grade temperature resilience to a nominal supply voltage of 5V, the HMC680LP4 delivers seamless functionality for your telecom circuits. Experience the unmatched value and benefits of Analog Devices' cutting-edge technology with the HMC680LP4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability makes it easy to integrate this IC into a wide range of electronic devices, simplifying the manufacturing process.

No. of Terminals: 24

Having 24 terminals allows for more connectivity options and functionality in telecom applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding telecom environments without overheating.

Technology: BICMOS

The use of BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs HMC680LP4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC680LP4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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