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HMC322LP4

Analog Devices

HMC322LP4 by Analog Devices

HMC322LP4 by Analog Devices is a SP8T RF/Microwave switch with 2.9 dB max insertion loss, 20 dB min isolation, and 8000 MHz max operating frequency. It is ideal for applications requiring high-frequency switching in components with -40 to 85 °C operating temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,867 parts In-Stock

1+ parts

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2,867

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Digiode

USA . 114 parts In-Stock

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114

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Prism Electronics

USA . 26 parts In-Stock

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26

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 3,719 parts In-Stock

1+ parts

$1.208

100+ parts

-

1k+ parts

$1.124

10k+ parts

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3,719

$1.208

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$1.124

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IDEA Electronic Components Group

UK . 2,055 parts In-Stock

1+ parts

$1.299

100+ parts

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$1.234

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2,055

$1.299

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$1.234

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DigiPath Technology Company

USA . 1,942 parts In-Stock

1+ parts

$2.026

100+ parts

$1.945

1k+ parts

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1,942

$2.026

$1.945

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AZTECH Wire

Italy . 859 parts In-Stock

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$13.255

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859

$13.255

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One Stop Electronics

USA . 179 parts In-Stock

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$20.000

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179

$20.000

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Semicontronic

India . 1,032 parts In-Stock

1+ parts

$28.000

100+ parts

$27.300

1k+ parts

$27.160

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1,032

$28.000

$27.300

$27.160

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Glotronic Ltd.

UK . 1,890 parts In-Stock

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1,890

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Corphita

USA . 981 parts In-Stock

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981

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Overview

Elevate your RF/Microwave system with the HMC322LP4 by Analog Devices, a top-tier manufacturer known for premium quality components. This SP8T switch offers exceptional performance and reliability, making it ideal for a wide range of applications. With a maximum insertion loss of 2.9 dB and minimum isolation of 20 dB, this component ensures seamless operation even in demanding conditions. Experience the value and benefits of cutting-edge technology with the HMC322LP4, providing unmatched precision and efficiency for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making it suitable for various environments.

Maximum Input Power (CW): 26.02 dBm

Can handle high power input signals without degradation, ensuring reliable performance.

Compression Point (1 dB): 23 dBm

Maintains linearity and signal integrity even at higher power levels.

Construction: COMPONENT

Component-level construction allows for easy integration into existing systems.

Power Supplies (V): -5

Operates efficiently with a low voltage power supply.

No. of Terminals: 24

Provides flexibility in connecting multiple inputs and outputs.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for demanding applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Ensures reliable electrical contacts and solderability.

Maximum Insertion Loss: 2.9 dB

Maintains signal strength and minimizes loss during signal switching.

Nominal On Time: 0.15 us

Provides fast response time for swift signal switching.

Technology: GAAS

Utilizes Gallium Arsenide technology for high-frequency operation and low noise performance.

RF or Microwave Device Type: SP8T

Offers a single-pole eight-throw configuration for versatile signal routing.

Characteristic Impedance: 50 ohm

Matches typical RF system impedance, ensuring signal integrity.

Minimum Isolation: 20 dB

Provides adequate isolation between input and output ports, reducing cross-talk and interference.

Minimum Operating Frequency: 0 MHz

Capable of handling DC signals and lower frequency applications.

Mounting Feature: SURFACE MOUNT

Allows for easy and secure surface mounting on PCBs.

Maximum Operating Frequency: 8000 MHz

Suitable for high-frequency RF and microwave applications.

Port Termination: ABSORPTIVE

Absorbs unwanted signals and reflections, improving overall signal quality.

Technical Specifications

RF/Microwave Switches HMC322LP4 attributes and parameters. Explore more RF/Microwave Switches devices from Analog Devices

Specs

Compression Point (1 dB):

23 dBm

Additional Features:

HIGH ISOLATION

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

26.02 dBm

Maximum Insertion Loss:

2.9 dB

Minimum Isolation:

20 dB

JESD-609 Code:

e0

Mounting Feature:

No. of Functions:

1

No. of Terminals:

24

Nominal On Time:

.15 us

Maximum Operating Frequency:

8000 MHz

Minimum Operating Frequency:

0 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC24,.16SQ,20

Port Termination:

ABSORPTIVE

Power Supplies (V):

-5

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Switches

Technology:

Terminal Finish:

Tin/Lead (Sn/Pb)

Trade Compliance

HMC322LP4 RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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