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ADUM3301WBRWZ-RL

Analog Devices

ADUM3301WBRWZ-RL by Analog Devices

ADUM3301WBRWZ-RL by Analog Devices is a CMOS interface IC with 16 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 3V to 5.5V and is AEC-Q100 screened for automotive applications. The package is small outline, surface mountable, with nickel palladium gold finish suitable for various other function interface circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 1,000 parts In-Stock

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Vyrian

USA . 9,916 parts In-Stock

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Digiode

USA . 245 parts In-Stock

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Parana Technologies

USA . 540 parts In-Stock

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$13.112

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$12.194

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$13.112

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IDEA Electronic Components Group

UK . 44 parts In-Stock

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$14.099

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$13.394

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AZTECH Wire

Italy . 1,194 parts In-Stock

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$20.010

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Semicontronic

India . 589 parts In-Stock

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$21.500

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$20.962

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$20.855

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DigiPath Technology Company

USA . 2,246 parts In-Stock

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$21.994

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$21.115

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Corphita

USA . 995 parts In-Stock

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Native Components

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Northwest PG Solutions

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Overview

Enhance your electronic designs with the ADUM3301WBRWZ-RL by Analog Devices. As a reputable manufacturer known for its high-quality products, Analog Devices delivers reliable solutions for various applications in the Other Function Interface ICs category. With a wide operating temperature range and automotive-grade technology, this compact interface circuit offers customers exceptional value and performance. Trust Analog Devices to provide you with the innovative solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient mounting onto a PCB, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for various applications.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, ideal for automotive applications.

Package Shape: RECTANGULAR

Enables easy integration into existing circuit designs and layouts.

No. of Terminals: 16

Provides multiple connection points, allowing for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE

Compact form factor saves space on the PCB while maintaining functionality.

Minimum Supply Voltage: 3 V

Supports low voltage operation, making it energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Can withstand low-temperature environments, ensuring reliable performance in various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures stable electrical connections over time.

Terminal Position: DUAL

Enables multiple connection points for enhanced flexibility in circuit design.

Maximum Seated Height: 2.65 mm

Low profile design allows for installation in compact spaces.

Width: 7.5 mm

Compact width saves space on the PCB and allows for efficient use of board real estate.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand reflow soldering process with a short duration, reducing manufacturing time.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering process, ensuring reliable solder joints.

Length: 10.3 mm

Compact length for efficient PCB layout and space-saving design.

Temperature Grade: AUTOMOTIVE

Designed and tested for automotive applications, ensuring reliability in harsh environments.

Technology: CMOS

Uses CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder joints and easy PCB mounting.

Nominal Supply Voltage: 3.3 V

Optimal supply voltage for stable and efficient operation of the IC.

Terminal Pitch: 1.27 mm

Standard pitch for easy PCB layout and component placement.

Moisture Sensitivity Level (MSL): 3

Designed to withstand standard moisture exposure levels during manufacturing and operation.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other components, making it ideal for communication applications.

Technical Specifications

Other Function Interface ICs ADUM3301WBRWZ-RL attributes and parameters. Explore more Other Function Interface ICs devices from Analog Devices

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ADUM3301WBRWZ-RL Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8543.70.98.60

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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