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ADSP-TS101SAB2-100

Analog Devices

ADSP-TS101SAB2-100 by Analog Devices

Analog Devices' ADSP-TS101SAB2-100 is a 32-bit DSP with 484 terminals, operating at max 100 MHz. Ideal for industrial applications, it features a 64-bit external data bus width and low power mode for efficient processing. With a temp range of -40 to 85 °C, this CMOS technology-based DSP offers high performance in compact square packaging.

Median Price

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Lifecycle Status

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1k+

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Vyrian

USA . 7,309 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 738 parts In-Stock

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$7.584

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Native Components

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Northwest PG Solutions

USA . 1,646 parts In-Stock

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Ampacity Inc.

Singapore . 1,489 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 431 parts In-Stock

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Parana Technologies

USA . 126 parts In-Stock

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IDEA Electronic Components Group

UK . 2,059 parts In-Stock

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Corohmni

South Africa . 1,193 parts In-Stock

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DigiPath Technology Company

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Component Stockers USA

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Vigor

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Perfect Parts

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Microchip USA

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Overview

Unlock the power of digital signal processing with Analog Devices' ADSP-TS101SAB2-100. This top-of-the-line DSP offers unparalleled performance and reliability, making it the go-to choice for a wide range of applications. From audio processing to telecommunications, this versatile processor delivers exceptional results with its advanced technology and innovative design. Trust Analog Devices to provide you with the quality and value you need to take your projects to the next level. Elevate your work with the ADSP-TS101SAB2-100 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easier assembly and space-saving on PCBs.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 32

A wider address bus width allows for larger memory addressing capabilities.

Package Shape: SQUARE

The square package shape makes it easier to integrate the product into compact designs.

Bit Size: 32

The 32-bit architecture provides higher processing capabilities compared to lower bit sizes.

Power Supplies (V): 1.2,3.3

Support for multiple power supply options allows for compatibility with various systems.

No. of Terminals: 484

A higher number of terminals allows for more connectivity options and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style enables high-density mounting and reliability.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in conserving power and improving efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in harsh cold environments.

Terminal Finish: TIN LEAD SILVER

The terminal finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position makes it easier for PCB layout and heat dissipation.

Maximum Seated Height: 2.5 mm

The low profile of the product allows for slim and compact device designs.

RAM Words: 196608

Large RAM capacity enables storing and processing a significant amount of data.

Width: 19 mm

The compact width size enables space-saving integration in different applications.

Boundary Scan: YES

Boundary scan support aids in testing and debugging during the manufacturing process.

External Data Bus Width: 64

A wider external data bus width allows for faster data transfer and processing capabilities.

Maximum Clock Frequency: 100 MHz

The high maximum clock frequency enables faster data processing and overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering and component reliability during assembly.

Peak Reflow Temperature °C: 225

The high peak reflow temperature tolerance ensures durability during the assembly process.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing and communication efficiency within the product.

Length: 19 mm

The compact length size allows for space-efficient placement on a PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type provides additional processing capabilities for various signal processing applications.

Technology: CMOS

CMOS technology offers high-speed performance and low power consumption.

Terminal Form: BALL

Ball terminal form facilitates easier soldering and heat dissipation.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent and reliable operation.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting and space-saving layout designs.

Format: FLOATING POINT

Support for floating-point format enables precise and efficient numerical calculations.

Moisture Sensitivity Level (MSL): 3

MSL 3 level denotes moderate moisture sensitivity protection for reliable operation in various environments.

Low Power Mode: YES

Low power mode option enables energy-efficient operation and extends battery life.

Barrel Shifter: YES

The presence of a barrel shifter enhances data manipulation and processing efficiency.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-TS101SAB2-100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

32

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e0

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

484

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA484,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

225

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

196608

Maximum Seated Height:

2.5 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-TS101SAB2-100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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