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ADSP-BF533SBBCZ400

Analog Devices

ADSP-BF533SBBCZ400 by Analog Devices

ADSP-BF533SBBCZ400 by Analog Devices is a 32-bit DSP with 19-bit address bus, operating at max 40 MHz. Ideal for industrial applications, it features low power mode, barrel shifter, and supports external data bus width of 16 bits.

Median Price

$32.580

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 4,097 parts In-Stock

1+ parts

$32.580

100+ parts

$23.769

1k+ parts

$22.849

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4,097

$32.580

$23.769

$22.849

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DigiKey

USA . 29 parts In-Stock

1+ parts

$37.010

100+ parts

$27.144

1k+ parts

$26.128

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29

$37.010

$27.144

$26.128

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Mouser Electronics

USA . 28 parts In-Stock

1+ parts

$37.010

100+ parts

$27.140

1k+ parts

$26.120

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28

$37.010

$27.140

$26.120

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Arrow

USA . 12 parts In-Stock

1+ parts

-

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$27.520

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12

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$27.520

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Verical

USA . 12 parts In-Stock

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$27.520

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12

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$27.520

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Distributors (In-Stock)

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Vyrian

USA . 7,206 parts In-Stock

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VNN

France . 2,958 parts In-Stock

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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ComSIT Distribution GmbH

Germany . 1,103 parts In-Stock

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1,103

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Digiode

USA . 175 parts In-Stock

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175

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Nova Conductors

Japan . 100 parts In-Stock

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100

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EMSNET

USA . 10 parts In-Stock

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10

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Sensible Micro Corp

USA . 3 parts In-Stock

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3

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

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2

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Distributors (Availability)

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Semicontronic

India . 21 parts In-Stock

1+ parts

$22.150

100+ parts

$21.596

1k+ parts

$21.486

10k+ parts

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21

$22.150

$21.596

$21.486

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Vigor

Singapore . 70 parts In-Stock

1+ parts

$27.390

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70

$27.390

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$32.497

100+ parts

$29.572

1k+ parts

$26.648

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750

$32.497

$29.572

$26.648

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Ampacity Inc.

Singapore . 28 parts In-Stock

1+ parts

$49.890

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28

$49.890

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Corohmni

South Africa . 44 parts In-Stock

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$55.257

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44

$55.257

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Parana Technologies

USA . 1,273 parts In-Stock

1+ parts

$67.626

100+ parts

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$62.892

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1,273

$67.626

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$62.892

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IDEA Electronic Components Group

UK . 307 parts In-Stock

1+ parts

$72.716

100+ parts

$69.080

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307

$72.716

$69.080

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DigiPath Technology Company

USA . 3,132 parts In-Stock

1+ parts

$113.437

100+ parts

$108.899

1k+ parts

-

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$108.899

3,132

$113.437

$108.899

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$108.899

Continental Prestige Electronics

USA . 4,549 parts In-Stock

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4,549

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Microchip USA

USA . 1,381 parts In-Stock

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Argo Parts USA

USA . 565 parts In-Stock

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565

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A-Z Elektronik GmbH

Germany . 132 parts In-Stock

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132

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Corphita

USA . 117 parts In-Stock

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117

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Overview

Unlock the power of cutting-edge technology with the ADSP-BF533SBBCZ400 by Analog Devices. This high-quality Digital Signal Processor boasts top-notch performance and reliability, making it ideal for a wide range of applications. From audio processing to telecommunications, this versatile product delivers exceptional value and benefits to customers seeking optimal efficiency and precision in their projects. Trust Analog Devices, a trusted manufacturer known for excellence in innovation, to elevate your designs to new heights with the ADSP-BF533SBBCZ400.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, ensuring a longer lifespan.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 1.45 V

Allows for efficient power usage and prevents potential damage from excessive voltage.

Address Bus Width: 19

Provides the ability to address a larger memory space, making it suitable for complex processing tasks.

Bit Size: 32

Offers high processing capability for handling complex algorithms and data processing.

Power Supplies (V): 1.2, 2.5/3.3

Versatile power options allow for compatibility with various systems and power sources.

No. of Terminals: 160

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables compact packaging and efficient heat dissipation for improved performance in tight spaces.

Minimum Supply Voltage: 0.8 V

Allows for low-power operation and extended battery life in portable devices.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in harsh environmental conditions or applications with high temperature requirements.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold environments without impacting performance or reliability.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and reliable electrical connections for long-term use.

Terminal Position: BOTTOM

Simplified board layout and soldering process for easier integration into circuit designs.

Maximum Seated Height: 1.7 mm

Low-profile design allows for compact device form factor and efficient heat dissipation.

Width: 12 mm

Compact size for easy integration into various devices and circuit layouts.

Boundary Scan: YES

Facilitates testing and debugging during manufacturing and maintenance processes.

External Data Bus Width: 16

Efficient data transfer between components for improved processing speed and performance.

Maximum Clock Frequency: 40 MHz

High-speed clock frequency for rapid data processing and efficient performance.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized reflow process for reliable soldering and manufacturing efficiency.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes and higher temperature reflow methods.

Internal Bus Architecture: MULTIPLE

Efficient data routing and processing capabilities for handling complex algorithms and tasks.

Length: 12 mm

Compact size for space-constrained applications and efficient circuit board layout.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature and humidity conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral interface options for connecting to various external devices and components.

Technology: CMOS

Low power consumption and high noise immunity for reliable and efficient operation.

Terminal Form: BALL

Simplified soldering process and reliable electrical connections for ease of installation and maintenance.

Nominal Supply Voltage: 1.2 V

Optimal voltage for efficient power usage and performance of the DSP.

Terminal Pitch: 0.8 mm

Fine pitch design for compact layout and high-density integration in circuit boards.

Format: FIXED POINT

Precision processing and accuracy for numerical calculations and data manipulation tasks.

Moisture Sensitivity Level (MSL): 3

Suitable for manufacturing and storage in environments with moderate humidity and moisture.

Speed: 400 rpm

High processing speed for real-time signal processing and data analysis applications.

Low Power Mode: YES

Energy-efficient operation with low power consumption for extended battery life in portable devices.

Barrel Shifter: YES

Efficient data manipulation and processing for complex algorithms and mathematical operations.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-BF533SBBCZ400 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO REQUIRES 3V OR 3.3V SUPPLY

Address Bus Width:

19

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B160

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

160

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA160,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Speed:

400 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.45 V

Minimum Supply Voltage:

.8 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADSP-BF533SBBCZ400 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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