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ADSP-BF531SBBCZ400

Analog Devices

ADSP-BF531SBBCZ400 by Analog Devices

ADSP-BF531SBBCZ400 by Analog Devices is a 32-bit DSP with a max clock frequency of 40 MHz. It features an address bus width of 19, external data bus width of 16, and operates at low power mode. Ideal for industrial applications requiring high-speed processing in a compact package.

Median Price

$22.700

Lifecycle Status

Suppliers In-Stock

14

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1k+

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Arrow

USA . 37 parts In-Stock

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$19.630

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Analog Devices Inc

USA . 805 parts In-Stock

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$25.770

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$18.628

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$17.399

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805

$25.770

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DigiKey

USA . 40 parts In-Stock

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$29.280

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$21.270

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$19.911

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$29.280

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Verical

USA . 1,184 parts In-Stock

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$16.710

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Vyrian

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VNN

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Chip Stock

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Digiode

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Next Level Components, LLC

USA . 153 parts In-Stock

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Semtec, LLC

USA . 50 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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LWI Electronics Inc

India . 8 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2 parts In-Stock

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Prism Electronics

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Ampacity Inc.

Singapore . 135 parts In-Stock

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$15.680

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$15.680

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Semicontronic

India . 135 parts In-Stock

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$15.680

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$15.288

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$15.210

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$15.680

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Corohmni

South Africa . 615 parts In-Stock

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$17.010

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Vigor

Singapore . 67 parts In-Stock

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$23.050

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Parana Technologies

USA . 808 parts In-Stock

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$48.442

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$45.051

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IDEA Electronic Components Group

UK . 16 parts In-Stock

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$52.088

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$49.484

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DigiPath Technology Company

USA . 2,573 parts In-Stock

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$81.257

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$78.007

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$78.007

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Continental Prestige Electronics

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Microchip USA

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Assy Fe

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RC Electronics

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A-Z Elektronik GmbH

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Argo Parts USA

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Corphita

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Netroflash

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Overview

Enhance your digital signal processing capabilities with the ADSP-BF531SBBCZ400 by Analog Devices. Crafted with precision and expertise, this DSP offers unparalleled performance in a compact package. Ideal for a wide range of applications, from audio processing to industrial automation, this product delivers reliable and efficient results. With a focus on quality and innovation, Analog Devices ensures that every customer receives the value and benefits they deserve. Upgrade your projects today with the ADSP-BF531SBBCZ400 and experience the advantage of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 1.45 V

The low maximum supply voltage helps in reducing power consumption and extending the product's lifespan.

Address Bus Width: 19

A wider address bus allows for efficient data processing and communication within the device, enhancing overall performance.

Package Shape: SQUARE

The square package shape offers a compact design, optimizing space utilization on the PCB.

Bit Size: 32

With a 32-bit architecture, the product can handle complex algorithms and calculations with high precision and accuracy.

Power Supplies (V): 1.2,2.5/3.3

Support for multiple power supply voltages allows for flexible operation and compatibility with various systems and environments.

No. of Terminals: 160

A high number of terminals enable seamless connectivity and integration of the DSP into diverse electronic systems.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers improved signal integrity, thermal performance, and overall reliability of the product.

Minimum Supply Voltage: 0.8 V

The low minimum supply voltage ensures efficient power usage and operation over a wide range of voltage inputs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for industrial applications with demanding thermal conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in harsh environmental conditions or extreme cold temperatures.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity, corrosion resistance, and solderability for long-term product reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly, improving the overall manufacturing process.

Maximum Seated Height: 1.7 mm

The low profile design with a maximum seated height of 1.7mm saves space and allows for compact product enclosures.

Width: 12 mm

The compact width of 12mm enables easy integration and placement of the DSP in various electronic systems and devices.

Boundary Scan: YES

Boundary scan capability simplifies testing, debugging, and verification of the product during the manufacturing and development process.

External Data Bus Width: 16

A wider external data bus width enhances data transfer speeds and efficiency, leading to improved performance in data-intensive applications.

Maximum Clock Frequency: 40 MHz

With a high maximum clock frequency of 40MHz, the product can process data faster and handle real-time applications effectively.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures the product can withstand the soldering process without damage or degradation.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architectures enable parallel processing and efficient data transfer within the device, enhancing overall performance.

Length: 12 mm

The compact length of 12mm makes the product suitable for applications with space constraints, without compromising on functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature ranges.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances connectivity and compatibility with different electronic devices and systems.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, making it ideal for efficient digital signal processing.

Terminal Form: BALL

The ball terminal form provides secure connections, easy soldering, and reliable electrical contact for stable performance.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures consistent and stable operation of the product within the specified voltage range.

Terminal Pitch: 0.8 mm

The narrow terminal pitch of 0.8mm allows for high-density mounting on the PCB, optimizing space utilization and layout design.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and calculations, providing efficient and accurate processing of digital signals.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product is suitable for surface mount assembly and reflow soldering processes.

Speed: 400 rpm

The high processing speed of 400 rpm enables quick data processing and efficient performance in real-time applications.

Low Power Mode: YES

The low power mode option helps in reducing power consumption and extending the battery life of portable electronic devices.

Barrel Shifter: YES

The presence of a barrel shifter allows for efficient data manipulation and shifting operations, enhancing the product's computational capabilities.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-BF531SBBCZ400 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO REQUIRES 3V OR 3.3V SUPPLY

Address Bus Width:

19

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B160

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

160

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA160,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Speed:

400 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.45 V

Minimum Supply Voltage:

.8 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADSP-BF531SBBCZ400 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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