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ADSP-21266SKBCZ-2D

Analog Devices

ADSP-21266SKBCZ-2D by Analog Devices

Analog Devices' ADSP-21266SKBCZ-2D is a 32-bit DSP with 16-bit address and data bus width, operating at up to 66.67 MHz clock frequency. It features a low-profile grid array package suitable for commercial temperature grade applications, with 65536 RAM words and floating-point format ideal for digital signal processing tasks.

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1k+

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Vyrian

USA . 2,943 parts In-Stock

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Digiode

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One Stop Electronics

USA . 489 parts In-Stock

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Semicontronic

India . 1,181 parts In-Stock

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$3.900

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$3.880

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AZTECH Wire

Italy . 651 parts In-Stock

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Corohmni

South Africa . 1,882 parts In-Stock

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Parana Technologies

USA . 3,517 parts In-Stock

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IDEA Electronic Components Group

UK . 484 parts In-Stock

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DigiPath Technology Company

USA . 3,517 parts In-Stock

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$98.352

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$94.418

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Component Stockers USA

USA . 289 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Glotronic Ltd.

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Native Components

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Northwest PG Solutions

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Corphita

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Overview

Unleash the power of cutting-edge technology with the ADSP-21266SKBCZ-2D by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-quality Digital Signal Processors that are revolutionizing the way we experience audio and video processing. This product offers unparalleled value and benefits to customers looking to enhance their applications with high-performance capabilities. From advanced multimedia systems to innovative communication devices, the ADSP-21266SKBCZ-2D is the perfect solution for all your digital signal processing needs. Elevate your projects to new heights with this exceptional product from Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides protection and durability for the DSP, ensuring longevity and reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort during manufacturing processes.

Maximum Supply Voltage: 1.26 V

Operating within a low maximum supply voltage of 1.26 V helps in reducing power consumption and heat generation, making the DSP energy-efficient.

Address Bus Width: 16

With a 16-bit address bus width, the DSP can efficiently access memory locations and handle large volumes of data, enhancing its processing capabilities.

Package Shape: SQUARE

The square package shape allows for compact and space-efficient integration of the DSP into electronic devices, making it suitable for applications with limited space.

Bit Size: 32

The 32-bit architecture of the DSP enables high-speed processing of complex algorithms and computations, making it suitable for demanding signal processing tasks.

Power Supplies (V): 1.2,3.3

Supporting multiple power supply voltages (1.2V and 3.3V) allows for versatile compatibility with different system requirements, enhancing the DSP's flexibility in diverse applications.

No. of Terminals: 136

The large number of terminals (136) provides ample connectivity options for interfacing with external components and peripherals, enabling seamless integration into complex electronic systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures high-density mounting and excellent thermal performance, optimizing the overall functionality and reliability of the DSP.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14 V allows for efficient power management and extended battery life in portable devices, improving the overall energy efficiency of the DSP.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the DSP can reliably operate in various environmental conditions without sacrificing performance, ensuring consistent functionality under thermal stress.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0 °C enables the DSP to function reliably in cold environments, expanding its usability in a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides excellent conductivity and resistance to oxidation, ensuring reliable signal transmission and minimizing signal degradation in the DSP.

Terminal Position: BOTTOM

The bottom terminal position allows for secure and stable mounting of the DSP on circuit boards, reducing the risk of damage and ensuring proper electrical connections for optimal performance.

Maximum Seated Height: 1.7 mm

The low maximum seated height of 1.7 mm facilitates compact and slim designs for electronic devices, making the DSP suitable for space-constrained applications.

RAM Words: 65536

The large RAM capacity of 65536 words enables the DSP to efficiently store and access data during processing operations, enhancing its overall performance and responsiveness.

Width: 12 mm

With a width of 12mm, the DSP can be easily integrated into various electronic systems, providing flexibility and compatibility in diverse hardware configurations.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the DSP during manufacturing and maintenance, facilitating quick identification and resolution of potential issues.

External Data Bus Width: 16

The 16-bit external data bus width enables high-speed data transfer between the DSP and external memory or peripherals, enhancing its data processing capabilities and efficiency.

Maximum Clock Frequency: 66.67 MHz

Operating at a maximum clock frequency of 66.67 MHz, the DSP can perform rapid computations and signal processing tasks, making it suitable for real-time applications and high-performance requirements.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable soldering and mounting of the DSP onto circuit boards, maintaining secure connections and overall system integrity.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enables efficient data transfer within the DSP, enhancing its processing speed and performance for complex signal processing tasks and algorithms.

Length: 12 mm

With a length of 12mm, the DSP can be seamlessly integrated into electronic devices without occupying excessive space, allowing for compact and efficient system designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation of the DSP within standard temperature ranges, making it suitable for commercial and industrial applications with moderate temperature variations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor, among others, indicates the versatile functionality and processing capabilities of the DSP for handling various digital signals and tasks in diverse applications.

Technology: CMOS

Utilizing CMOS technology, the DSP offers low power consumption, high speed, and compatibility with a wide range of digital systems, making it an efficient and versatile solution for signal processing applications.

Terminal Form: BALL

The ball terminal form provides secure and reliable electrical connections for the DSP, ensuring stable operation and minimal signal loss during data transmission and processing.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2V, the DSP achieves optimal performance and energy efficiency, making it suitable for battery-powered devices and energy-conscious applications.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high-density mounting of the DSP on circuit boards, optimizing space utilization and enabling compact designs in electronic systems.

Format: FLOATING POINT

Utilizing floating-point format, the DSP can accurately represent and process decimal numbers with high precision and dynamic range, making it ideal for applications requiring complex mathematical computations.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the DSP is suitable for handling standard moisture exposure during manufacturing and operation, ensuring long-term reliability and performance in various environments.

Barrel Shifter: YES

The inclusion of a barrel shifter in the DSP allows for efficient and rapid shifting of binary data and arithmetic operations, enhancing its computational capabilities and flexibility in handling complex algorithms.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21266SKBCZ-2D attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.67 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B136

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

136

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA136,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADSP-21266SKBCZ-2D Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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