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ADSP-21160NCB-100

Analog Devices

ADSP-21160NCB-100 by Analog Devices

ADSP-21160NCB-100 by Analog Devices is a 32-bit DSP with 131072 RAM words, 64-bit external data bus width, and 50 MHz max clock frequency. Ideal for digital signal processing applications requiring high-speed computation in a compact package.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 6,389 parts In-Stock

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Digiode

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Nova Conductors

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LWI Electronics Inc

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Semicontronic

India . 1,341 parts In-Stock

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$4.875

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$4.850

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Ampacity Inc.

Singapore . 173 parts In-Stock

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AZTECH Wire

Italy . 503 parts In-Stock

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One Stop Electronics

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Aztec Data Supply Inc.

USA . 4,012 parts In-Stock

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Parana Technologies

USA . 1,196 parts In-Stock

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$65.043

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IDEA Electronic Components Group

UK . 1,754 parts In-Stock

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Corohmni

South Africa . 56 parts In-Stock

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DigiPath Technology Company

USA . 1,593 parts In-Stock

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Advanced Electronics

New Zealand . 2,044 parts In-Stock

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Lixinc

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Argo Parts USA

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Vigor

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Continental Prestige Electronics

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Microchip USA

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Bastille Electronics

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Futuretech Components

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Overview

Unleash the power of cutting-edge technology with Analog Devices' ADSP-21160NCB-100 Digital Signal Processor! Designed for peak performance, this DSP offers unparalleled processing capabilities for a wide range of applications. From audio and video processing to telecommunications and industrial automation, this versatile processor delivers superior speed and efficiency. Trust Analog Devices, a renowned leader in semiconductor manufacturing, to provide you with a high-quality product that will elevate your projects to new heights. Upgrade your system today with the ADSP-21160NCB-100 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 2 V

Operates efficiently within a specified voltage range, ensuring stable performance.

Address Bus Width: 32

Wider address bus allows for faster communication between components in the system, improving overall processing speed.

Package Shape: SQUARE

Square shape facilitates easier alignment and placement on the circuit board, optimizing spacing and layout.

Bit Size: 32

32-bit architecture enables higher precision and accuracy in signal processing tasks.

Power Supplies (V): 1.8/2,3.3

Supports multiple power supply options, providing flexibility in design and compatibility with different systems.

No. of Terminals: 400

Having a high number of terminals allows for more connections and functionalities, enhancing the versatility of the DSP.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance and signal integrity, crucial for high-speed processing.

Minimum Supply Voltage: 1.8 V

Operates efficiently even at low voltages, conserving power and minimizing energy consumption.

Terminal Finish: TIN LEAD SILVER

Provides good conductivity and corrosion resistance, ensuring reliable electrical connections over time.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier heat dissipation and soldering during assembly, improving overall reliability.

Maximum Seated Height: 2.49 mm

Low seated height allows for a more compact and space-saving design, beneficial for applications with size constraints.

RAM Words: 131072

Large RAM capacity enables efficient storage and retrieval of data, essential for complex signal processing tasks.

Width: 27 mm

Compact width allows for efficient packaging and placement on the circuit board, optimizing overall system layout.

Boundary Scan: YES

Boundary scan feature enables thorough testing and debugging of the DSP, leading to improved reliability and performance.

External Data Bus Width: 64

Wider data bus facilitates faster data transfer rates between the DSP and external components, enhancing processing speed.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast processing and response times, crucial for real-time signal processing applications.

Peak Reflow Temperature °C: 225

Capable of withstanding high reflow temperatures during manufacturing and rework processes, ensuring robustness and reliability.

Internal Bus Architecture: MULTIPLE

Multiple internal buses improve data flow and processing efficiency within the DSP, enhancing overall performance.

Length: 27 mm

Compact length enables efficient board layout and system integration, saving space and enhancing design flexibility.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows for a wide range of signal processing applications, catering to diverse system requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and reliability.

Terminal Form: BALL

Ball terminal form provides a reliable and secure connection, essential for stable electrical performance and signal integrity.

Nominal Supply Voltage: 1.9 V

Stable supply voltage ensures consistent and reliable operation of the DSP, minimizing errors and disruptions.

Terminal Pitch: 1.27 mm

Optimal terminal pitch allows for easy soldering and assembly, simplifying manufacturing processes and reducing assembly time.

Format: FLOATING POINT

Floating-point format enables high-precision calculations and complex arithmetic operations, essential for demanding signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good moisture resistance, ensuring the DSP's reliability and performance under varying environmental conditions.

Barrel Shifter: YES

Barrel shifter feature enhances data manipulation and processing capabilities, improving efficiency and performance in signal processing algorithms.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21160NCB-100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA400,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

225

Power Supplies (V):

1.8/2,3.3

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

2.49 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

ADSP-21160NCB-100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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