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ADF5709BEZ-R7

Analog Devices

ADF5709BEZ-R7 by Analog Devices

Analog Devices ADF5709BEZ-R7 is a telecom IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a nominal voltage of 5V. Suitable for telecom circuits, it has a compact size of 3.9x3.9mm and terminal pitch of 0.5mm for surface mount applications.

Median Price

$284.914

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 3,100 parts In-Stock

1+ parts

-

100+ parts

$284.914

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3,100

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$284.914

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 544 parts In-Stock

1+ parts

$288.790

100+ parts

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544

$288.790

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Vyrian

USA . 7,442 parts In-Stock

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7,442

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,273 parts In-Stock

1+ parts

$8.392

100+ parts

-

1k+ parts

$7.805

10k+ parts

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2,273

$8.392

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$7.805

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IDEA Electronic Components Group

UK . 1,103 parts In-Stock

1+ parts

$9.024

100+ parts

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1k+ parts

$8.573

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1,103

$9.024

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$8.573

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DigiPath Technology Company

USA . 1,452 parts In-Stock

1+ parts

$14.077

100+ parts

$13.514

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-

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$13.514

1,452

$14.077

$13.514

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$13.514

AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$15.610

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215

$15.610

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Native Components

USA . 127 parts In-Stock

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$22.420

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127

$22.420

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Northwest PG Solutions

USA . 1,036 parts In-Stock

1+ parts

$24.662

100+ parts

$22.196

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1,036

$24.662

$22.196

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Semicontronic

India . 1,334 parts In-Stock

1+ parts

$242.180

100+ parts

$236.126

1k+ parts

$234.915

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1,334

$242.180

$236.126

$234.915

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Corphita

USA . 290 parts In-Stock

1+ parts

$273.591

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290

$273.591

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QUARKTWIN TECHNOLOGY LTD

USA . 16,750 parts In-Stock

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16,750

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Overview

Experience the unparalleled quality and precision of Analog Devices with the ADF5709BEZ-R7, a cutting-edge telecom interface IC designed to elevate your telecommunications projects to new heights. With a reputation for excellence in the industry, Analog Devices delivers top-of-the-line products that are guaranteed to exceed expectations. The ADF5709BEZ-R7 offers seamless integration, high performance, and reliability, making it the ideal choice for a wide range of applications. Trust Analog Devices to provide you with the tools you need to succeed in the fast-paced world of telecommunications.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity and mechanical strength, making it an ideal choice for telecom applications where heat dissipation is crucial.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly processes, making this product suitable for high-volume manufacturing.

Package Shape: SQUARE

The square shape can help optimize space utilization on a PCB, especially in applications where board real estate is limited.

No. of Terminals: 24

Having 24 terminals allows for a higher level of connectivity and functionality in the telecom interface IC, accommodating various input and output requirements.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides thermal management, compactness, and efficient signal processing for telecom applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high-temperature environments commonly found in telecom equipment without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliable performance even in harsh environmental conditions.

Terminal Position: QUAD

Quad terminal position enhances signal integrity and allows for better routing flexibility during PCB design, improving overall performance.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm contributes to a slimmer and more compact design, suitable for space-constrained telecom applications.

Width: 3.9 mm

The narrow width of 3.9 mm enables the integration of the IC into tight layouts on the PCB, ideal for densely packed telecom systems.

Length: 3.9 mm

The compact length of 3.9 mm further contributes to space-saving designs in telecom equipment, ensuring efficient use of available board space.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint failures and improves the overall reliability of the product in telecom applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this IC type offers optimized performance and functionality tailored to meet the demands of telecommunications systems.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V, this product aligns with industry-standard power requirements for telecom devices, ensuring compatibility and ease of integration.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting, enabling more terminals to be accommodated within a limited PCB area for enhanced connectivity and functionality.

Technical Specifications

Other Function Telecom Interface ICs ADF5709BEZ-R7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-CQCC-N24

Length:

3.9 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3.9 mm

Trade Compliance

ADF5709BEZ-R7 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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