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AD9375BBCZ-REEL

Analog Devices

AD9375BBCZ-REEL by Analog Devices

AD9375BBCZ-REEL by Analog Devices is a network interface IC with 196 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. With a low profile of 1.27mm and fine pitch of 0.8mm, it offers a nominal voltage of 1.3V for seamless integration.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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VNN

France . 2,700 parts In-Stock

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Vyrian

USA . 2,161 parts In-Stock

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Digiode

USA . 444 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Parana Technologies

USA . 1,509 parts In-Stock

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$12.309

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$11.448

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$12.309

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IDEA Electronic Components Group

UK . 1,909 parts In-Stock

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$13.236

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$12.574

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$12.574

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$12.574

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AZTECH Wire

Italy . 521 parts In-Stock

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$15.686

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$16.570

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$16.405

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$15.742

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DigiPath Technology Company

USA . 310 parts In-Stock

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$20.648

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$19.822

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$19.822

310

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$19.822

Semicontronic

India . 1,033 parts In-Stock

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$315.000

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$307.125

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$305.550

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One Stop Electronics

USA . 131 parts In-Stock

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$652.000

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Ampacity Inc.

Singapore . 900 parts In-Stock

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$787.000

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Formix International (Excess)

India . 5,106 parts In-Stock

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Continental Prestige Electronics

USA . 3,502 parts In-Stock

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Argo Parts USA

USA . 2,569 parts In-Stock

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Infinite Electronics LLP (Excess)

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Corphita

USA . 364 parts In-Stock

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364

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Overview

Experience seamless connectivity and superior performance with the AD9375BBCZ-REEL by Analog Devices, a leading manufacturer in network interface solutions. This high-quality interface circuit offers unparalleled reliability and flexibility for a wide range of applications, from telecommunications to industrial networking. With its advanced features and innovative design, this product delivers exceptional value and benefits to customers looking for cutting-edge technology. Say goodbye to connectivity issues and hello to a world of possibilities with the AD9375BBCZ-REEL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, saving time and effort during assembly.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function effectively even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures that the product remains operational even in extremely cold conditions.

Terminal Form: BALL

The ball terminal form provides a reliable connection and ensures signal integrity for efficient data transfer.

Technical Specifications

Network Interfaces AD9375BBCZ-REEL attributes and parameters. Explore more Network Interfaces devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B196

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.27 mm

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

AD9375BBCZ-REEL Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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