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AD8283WBCPZ-RL

Analog Devices

AD8283WBCPZ-RL by Analog Devices

AD8283WBCPZ-RL by Analog Devices is a telecom IC with 72 terminals, operating at -40 to 105°C. It has a supply voltage of 1.8V, CMOS technology, and low current consumption of 0.19mA. Ideal for telecom circuits, it comes in a square chip carrier package with matte tin finish and AEC-Q100 screening level.

Median Price

$22.014

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 56,000 parts In-Stock

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$22.014

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$22.014

Distributors (In-Stock)

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Digiode

USA . 665 parts In-Stock

1+ parts

$16.264

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665

$16.264

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Vyrian

USA . 8,286 parts In-Stock

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8,286

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Chip Stock

USA . 5,202 parts In-Stock

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5,202

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Distributors (Availability)

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Native Components

USA . 536 parts In-Stock

1+ parts

$1.101

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536

$1.101

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Northwest PG Solutions

USA . 1,937 parts In-Stock

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$1.211

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$1.211

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Parana Technologies

USA . 473 parts In-Stock

1+ parts

$9.589

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$8.918

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473

$9.589

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$8.918

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IDEA Electronic Components Group

UK . 1,758 parts In-Stock

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$10.311

100+ parts

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$9.795

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1,758

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$9.795

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Corphita

USA . 494 parts In-Stock

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$15.408

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494

$15.408

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DigiPath Technology Company

USA . 511 parts In-Stock

1+ parts

$16.085

100+ parts

$15.442

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$15.442

511

$16.085

$15.442

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$15.442

Semicontronic

India . 35,693 parts In-Stock

1+ parts

$18.710

100+ parts

$18.242

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$18.149

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35,693

$18.710

$18.242

$18.149

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AZTECH Wire

Italy . 247 parts In-Stock

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$20.920

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QUARKTWIN TECHNOLOGY LTD

USA . 29,412 parts In-Stock

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Component Stockers USA

USA . 7,895 parts In-Stock

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7,895

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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RC Electronics

USA . 1,657 parts In-Stock

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Overview

Elevate your telecom interface solutions with the AD8283WBCPZ-RL by Analog Devices. Known for their high-quality products, Analog Devices delivers top-notch performance and reliability in every component. This versatile telecom IC is perfect for a wide range of applications, offering customers unmatched value and benefits. With its compact size, low power consumption, and industrial-grade temperature range, this chip carrier with heat sink and very thin profile package style provides the ideal solution for your telecommunications needs. Upgrade your systems today with the AD8283WBCPZ-RL and experience the difference Analog Devices can make in your projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on a PCB, saving space and simplifying assembly process.

Screening Level: AEC-Q100

Ensures the product meets automotive industry standards for reliability and quality.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and can facilitate better heat dissipation.

Power Supplies (V): 1.8/3.3

Supports multiple power supply options, making the product versatile in different applications.

No. of Terminals: 72

High number of terminals provide flexibility for connecting to various components within a circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of package styles offer thermal management solutions and compact design for space-constrained applications.

Maximum Operating Temperature: 105 °C

Wide operating temperature range allows the product to function reliably in harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for long-term reliability.

Maximum Seated Height: 0.9 mm

Low profile design enables the product to be used in slim devices or where height clearance is limited.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Technical Specifications

Other Function Telecom Interface ICs AD8283WBCPZ-RL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC72,.39SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.19 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

AD8283WBCPZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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