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AD8285WBCPZ-RL

Analog Devices

AD8285WBCPZ-RL by Analog Devices

AD8285WBCPZ-RL by Analog Devices is a telecom IC with 72 terminals, operating b/w -40 to 105 °C. It features CMOS technology, matte tin finish, and a package style of chip carrier. Ideal for telecom circuits, it has a nominal voltage of 1.8V and terminal pitch of 0.5mm.

Median Price

$16.100

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 22,000 parts In-Stock

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Vyrian

USA . 2,769 parts In-Stock

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2,769

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Digiode

USA . 599 parts In-Stock

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599

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Chip Stock

USA . 139 parts In-Stock

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139

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Distributors (Availability)

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Native Components

USA . 510 parts In-Stock

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$1.301

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510

$1.301

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Northwest PG Solutions

USA . 1,472 parts In-Stock

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$1.432

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Parana Technologies

USA . 1,990 parts In-Stock

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$7.536

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$7.008

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1,990

$7.536

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$7.008

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IDEA Electronic Components Group

UK . 939 parts In-Stock

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$8.103

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$7.698

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939

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DigiPath Technology Company

USA . 1,448 parts In-Stock

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$12.641

100+ parts

$12.135

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$12.135

1,448

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$12.135

AZTECH Wire

Italy . 575 parts In-Stock

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$19.260

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Semicontronic

India . 21,709 parts In-Stock

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$29.790

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$29.045

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$28.896

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$28.896

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QUARKTWIN TECHNOLOGY LTD

USA . 19,465 parts In-Stock

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Corphita

USA . 986 parts In-Stock

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Overview

Unlock the power of seamless communication with the AD8285WBCPZ-RL by Analog Devices. Known for its superior quality and reliability, Analog Devices offers a wide range of telecom interface ICs designed to meet the demands of modern technology. This innovative product is perfect for applications requiring high performance and efficiency. With its advanced features and cutting-edge technology, the AD8285WBCPZ-RL delivers value, benefits, and advantages that exceed expectations. Experience a new level of connectivity with Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a circuit board, saving time and costs in production.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this product suitable for automotive applications where ruggedness is crucial.

Package Shape: SQUARE

The square package shape provides a compact form factor, saving space on the PCB and enabling easier integration into various electronic devices.

No. of Terminals: 72

Having a high number of terminals allows for more connectivity options and versatility in design, making this product suitable for complex telecom interfaces.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance in various applications.

Minimum Operating Temperature: -40 °C

The wide range of operating temperature enables this product to function reliably in both extreme hot and cold environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring secure and long-lasting connections on the circuit board.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers a balance of thermal management, compactness, and performance, making it ideal for telecom applications where space and heat dissipation are important.

Maximum Seated Height: 0.9 mm

With a low seated height, this product offers a slim profile and minimizes the overall height of the device, which is advantageous in applications with space constraints.

Width: 10 mm

The compact width of this product allows for efficient use of board space and enables streamlined and space-saving designs in telecom interface systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures proper solder reflow and component reliability during the assembly process, leading to high-quality finished products.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures proper soldering and thermal stability, making this product suitable for lead-free soldering processes.

Length: 10 mm

The compact length of this product complements its square package shape, providing a well-balanced form factor for optimizing board space and layout efficiency.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product can operate reliably in demanding environments typically found in industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and excellent performance characteristics, making this product energy-efficient and reliable for telecom interfaces.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and enhances environmental sustainability, making this product compliant with current regulations and standards.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC type offers features and functionalities tailored to meet the requirements of telecom interface circuits, ensuring optimized performance.

Nominal Supply Voltage: 1.8 V

With a low nominal supply voltage, this product offers energy efficiency and compatibility with low-power systems, making it suitable for telecom applications that require power saving.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density integration of components on the PCB, enabling compact designs and efficient use of board space in telecom interface systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this product is moisture-resistant during storage and assembly, reducing the risk of damage from moisture exposure and ensuring long-term reliability in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs AD8285WBCPZ-RL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

AD8285WBCPZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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