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2S80TE

Analog Devices

2S80TE by Analog Devices

2S80TE by Analog Devices is a BICMOS technology chip carrier with 44 terminals, operating b/w -55 to 125 °C. It features synchro/resolver to digital conversion and supports power supplies of 5/12V. Ideal for military-grade applications requiring precise data acquisition ADCs & DACs in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,947 parts In-Stock

1+ parts

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6,947

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Digiode

USA . 596 parts In-Stock

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596

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 4,694 parts In-Stock

1+ parts

$11.016

100+ parts

-

1k+ parts

$10.245

10k+ parts

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4,694

$11.016

-

$10.245

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IDEA Electronic Components Group

UK . 1,522 parts In-Stock

1+ parts

$11.845

100+ parts

$11.253

1k+ parts

$11.253

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1,522

$11.845

$11.253

$11.253

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DigiPath Technology Company

USA . 403 parts In-Stock

1+ parts

$18.478

100+ parts

$17.739

1k+ parts

-

10k+ parts

$17.739

403

$18.478

$17.739

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$17.739

AZTECH Wire

Italy . 718 parts In-Stock

1+ parts

$19.788

100+ parts

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718

$19.788

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One Stop Electronics

USA . 1,484 parts In-Stock

1+ parts

$28.000

100+ parts

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1,484

$28.000

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Corphita

USA . 965 parts In-Stock

1+ parts

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965

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Northwest PG Solutions

USA . 429 parts In-Stock

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429

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Native Components

USA . 403 parts In-Stock

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403

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Overview

Unleash the power of cutting-edge technology with the 2S80TE by Analog Devices, a top-tier Data Acquisition ADCs & DACs product. Crafted from high-quality ceramic material, this device offers unparalleled precision and reliability in a compact square package. With dual power supplies and military-grade temperature handling, it is ideal for demanding applications in aerospace, defense, and industrial sectors. Elevate your projects to new heights with the unbeatable performance and value that the 2S80TE brings to the table. Experience innovation like never before with Analog Devices.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high reliability, making it suitable for a wide range of operating temperatures.

Surface Mount: YES

Surface mounting capability allows for easy and efficient placement on PCBs, saving space and enhancing manufacturing processes.

Package Shape: SQUARE

Square packages are more compact and facilitate easier placement and mounting on PCBs compared to round or irregularly shaped packages.

Power Supplies (V): 5/12,+-12

Support for multiple power supply voltages offers flexibility in system design and compatibility with various power sources.

No. of Terminals: 44

Having a higher number of terminals allows for more connections and functionality to be integrated into the device.

Package Style (Meter): CHIP CARRIER

Chip carrier packages provide high reliability and protection for the internal components, making them suitable for rugged environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and stability of the device even in extreme environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions without performance degradation.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish offers good solderability and conductivity, ensuring reliable connections in the circuit.

Terminal Position: QUAD

Quad terminal positions provide increased connectivity options and allow for more complex circuit configurations.

Temperature Grade: MILITARY

Military-grade temperature rating ensures high reliability and performance in demanding applications and harsh environments.

Technology: BICMOS

BICMOS technology offers a combination of high-speed performance and low power consumption, making the device suitable for a wide range of applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and is safer for use in electronic devices.

Converter Type: SYNCHRO OR RESOLVER TO DIGITAL CONVERTER

Support for synchro or resolver to digital conversion enables integration into systems requiring precise and accurate data acquisition from these types of sensors.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high density mounting and precise connections on PCBs, facilitating compact and efficient system design.

Technical Specifications

Data Acquisition ADCs & DACs 2S80TE attributes and parameters. Explore more Data Acquisition ADCs & DACs devices from Analog Devices

Converter Specifications

Technology:

BICMOS

Sub-Category:

Position Converters

Electrical Characteristics

Power Supplies:

5/12,±12 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Form:

Terminal Position:

Quad

No. of Terminals:

44

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Terminal Finish:

Tin/Lead

Packaging

Package Body Material:

Ceramic

Package Style:

Chip Carrier

Package Shape:

Package Code:

Package Equivalence Code:

LCC44,.65SQ

Standards and Codes

JESD-30 Code:

S-XQCC-N44

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

2S80TE Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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