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2S80SE

Analog Devices

2S80SE by Analog Devices

2S80SE by Analog Devices is a BICMOS technology chip carrier with 44 terminals, operating b/w -55 to 125 °C. It features synchro/resolver to digital conversion and supports power supplies of 5/12V. Ideal for military applications requiring high-temperature resistance and precise data acquisition.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,175 parts In-Stock

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5,175

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Digiode

USA . 579 parts In-Stock

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579

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Distributors (Availability)

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Native Components

USA . 697 parts In-Stock

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$0.721

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697

$0.721

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Northwest PG Solutions

USA . 1,353 parts In-Stock

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$0.793

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1,353

$0.793

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AZTECH Wire

Italy . 620 parts In-Stock

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$6.000

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620

$6.000

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One Stop Electronics

USA . 242 parts In-Stock

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$20.000

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242

$20.000

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Parana Technologies

USA . 952 parts In-Stock

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$20.292

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$18.871

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952

$20.292

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$18.871

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IDEA Electronic Components Group

UK . 747 parts In-Stock

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$21.819

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$20.728

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747

$21.819

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$20.728

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DigiPath Technology Company

USA . 2,134 parts In-Stock

1+ parts

$34.038

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$32.676

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$32.676

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$34.038

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$32.676

Corphita

USA . 394 parts In-Stock

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394

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Overview

Discover the unparalleled precision and reliability of the 2S80SE by Analog Devices, a cutting-edge Data Acquisition ADCs & DACs device housed in a durable ceramic package. With a temperature range from -55°C to 125°C, this military-grade converter offers unmatched performance in a compact chip carrier style. Ideal for synchro or resolver to digital conversion, this product ensures seamless integration and accurate data acquisition for all your applications. Elevate your projects with the superior quality and advanced technology of Analog Devices, setting new standards for excellence in the industry.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity, ensuring efficient heat dissipation and reliable operation of the product.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides a compact design, making it ideal for applications where space is limited.

Power Supplies (V): 5/12,+-12

Support for multiple power supply voltages allows for flexibility in different operating environments and integration with various systems.

No. of Terminals: 44

With 44 terminals, this product offers a high level of connectivity and compatibility with a wide range of devices and interfaces.

Package Style (Meter): CHIP CARRIER

Chip carrier package style ensures high reliability and stability in demanding environments, such as military and aerospace applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55°C makes this product suitable for a wide range of industrial and outdoor applications.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish ensures strong solder joints and reliable connections, suitable for rugged and high vibration environments.

Terminal Position: QUAD

Quad terminal position provides high-density packaging and efficient signal routing for enhanced performance and functionality.

Temperature Grade: MILITARY

Military-grade temperature ratings ensure reliable operation in harsh conditions, making this product ideal for defense and aerospace applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption for optimal performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safety for both users and the environment.

Converter Type: SYNCHRO OR RESOLVER TO DIGITAL CONVERTER

Synchro or resolver to digital conversion capability allows for precise and accurate conversion of analog signals to digital format, suitable for precision measurement applications.

Terminal Pitch: 1.27 mm

1.27mm terminal pitch provides compatibility with standard PCB layouts and enables easy integration into existing electronic systems.

Technical Specifications

Data Acquisition ADCs & DACs 2S80SE attributes and parameters. Explore more Data Acquisition ADCs & DACs devices from Analog Devices

Converter Specifications

Technology:

BICMOS

Sub-Category:

Position Converters

Electrical Characteristics

Power Supplies:

5/12,±12 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Form:

Terminal Position:

Quad

No. of Terminals:

44

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Terminal Finish:

Tin/Lead

Packaging

Package Body Material:

Ceramic

Package Style:

Chip Carrier

Package Shape:

Package Code:

Package Equivalence Code:

LCC44,.65SQ

Standards and Codes

JESD-30 Code:

S-XQCC-N44

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

2S80SE Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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