Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Heat Sinks ATSEU-077D-C6-R0 attributes and parameters. Explore more Heat Sinks devices from Advanced Thermal Solutions
Device Type:
Advanced Thermal Solutions, Inc. (ATS) has been in business for more than 25 years as a leading-edge engineering and manufacturing company focused on the thermal management of electronics. Founded in 1989 as a consulting company, ATS has evolved into a complete thermal solutions provider and is world-renowned for its portfolio of more than 5,000 high- and ultra-performance heat sinks, its industry-leading liquid cooling solutions, the broadest off-the-shelf heat pipe line on the market, expert consulting and design services, research-quality test equipment, and leading-edge R&D. ATS has established its own manufacturing center in the U.S. and developed strategic partnerships with Asian manufacturers to provide its global customers with complete thermal solutions ready to tackle the industry’s toughest challenges. ATS is committed to providing the electronics industry with innovative, high-quality and cost-effective thermal management and packaging solutions. Our goal is to be our customers’ value-added supplier and success partner for all thermal and packaging needs - analysis, testing and final product.
BAV99
National Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
LM317TG
Texas Instruments
LM317TG by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max output current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount, with a rectangular shape and through-hole terminals for easy installation.
BSS138
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
1N4148WS
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
Philips Components
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
Microsemi
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
CRCW04020000Z0EDHP
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
DP83848IVVX/NOPB
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
576802B04000G
Aavid Thermalloy
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: CLIP; Length: 14.48 mm;
576802B03100G
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Height: 12.7 mm; Width: 14.48 mm; Finish: ANODIZED;
7106DG/TR
HEAT SINK; Body Material: COPPER; Fin Orientation: LONGITUDINAL; Width: 14.99 mm; Thermal Resistance: 15 ohm; Length: 25.91 mm;
423K
WAKEFIELD-VETTE INC
423K by Wakefield-vette is a HEAT SINK measuring 66.7mm (H) x 120.7mm (W) x 140.2mm (L), weighing 530.71g. Constructed using EXTRUDED method, it's ideal for thermal management in various applications like electronics cooling and industrial machinery.
7109DG/TR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Fin Orientation: FOLDEDBACK; Thermal Resistance: 11 ohm; Width: 19.38 mm;
EV-T220-38E
Ohmite Manufacturing
Ohmite Manufacturing's EV-T220-38E heat sink has thermal resistance of 11.4 ohm, height 38.1mm, and width 12.7mm. Ideal for transistors, this aluminum alloy device weighs 18g and is used to dissipate heat efficiently in electronic applications.
258
Wakefield Thermal Solutions
258 by Wakefield Thermal Solutions is a black anodized aluminum heat sink with U profile, measuring 12.7mm x 6.4mm x 8.6mm and weighing 0.82g. Ideal for cooling electronic components in compact devices due to its small size and lightweight design.
322400B00000G
Boyd
Boyd 322400B00000G Heat Sink has Thermal Resistance of 99.99Ω, Height of 5.97mm, and Radial Fin Orientation. Ideal for cooling electronic components in compact devices like laptops and LED displays due to its efficient heat dissipation capabilities.
Boyd's 7109DG/TR heat sink has a thermal resistance of 11 ohm, made of copper with dimensions 25.4mm x 19.38mm x 11.43mm. Ideal for ICs due to folded-back fin orientation and TIN finish, packaged in tape and reel for easy handling during assembly.
568303B00000G
Boyd 568303B00000G Heat Sink has Thermal Resistance of 5.4 ohm, Height 31.75mm, and Width 45.97mm. Ideal for cooling electronic components in compact spaces with high thermal output requirements.
ICKBGA23X23
Fischer Elektronik & Kg
ICKBGA23X23 by Fischer Elektronik & Kg is a 6mm high, 23mm wide and 23mm long heat sink with a black anodized finish. It is designed for use on IC devices.
577102B04000G
Boyd's 577102B04000G Heat Sink has a thermal resistance of 25.9 ohm, U profile, and transverse fin orientation. Ideal for cooling electronic components in compact spaces due to its dimensions (13.21mm x 9.52mm x 19.05mm) and anodized black finish.
SK6875SA
SK6875SA by Fischer Elektronik & Kg is a 33x46x75mm heat sink with thermal resistance of 5.85Ω, ideal for transistors. Featuring anodized finish and extruded construction, it offers efficient heat dissipation in black color with longitudinal fin orientation.
APA501-60-003
Artesyn Embedded Technologies
Artesyn Embedded Technologies' APA501-60-003 heat sink features a PIN FIN ARRAY profile with dimensions of 22.9mm x 57.5mm x 59mm. It is constructed using longitudinal fins and is ideal for thermal management in various electronic applications.
C247-050-2AE
FK245MI247V
7023BG
Boyd's 7023BG Heat Sink has a Thermal Resistance of 4.4 ohm, Height of 44.45mm, and Width of 24.13mm. Ideal for cooling electronic components in compact spaces due to its folded back fin orientation and aluminum body material.
PF527G
Boyd PF527G Heat Sink has 7.4 ohm Thermal Resistance, 25mm Height, and Anodized Black Finish. Ideal for cooling electronic components in various applications due to its aluminum body material and efficient heat dissipation capabilities.
RA-T2X-38E
The Ohmite RA-T2X-38E heat sink is 38.1mm tall, 25mm wide, and weighs 38g. Made of aluminum with an anodized finish, it's ideal for thermal management in various electronic applications due to its omnidirectional fin orientation.
PF433G
Boyd's PF433G heat sink, 19.5mm height, 13mm width, and 12.7mm length, is ideal for transistors with a clip profile and anodized finish. Its aluminum body and transverse fin orientation ensure efficient heat dissipation in electronic devices.
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Advanced Thermal Solutions
Supply Digital Components
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