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Part# Info Device Specifications Physical Specifications Material and Finish Thermal Specifications Usage and Compatibility
Part RoHS Manufacturer Description Construction Profile Fin Orientation Packing Method Additional Features Standards Height Width Length Diameter Weight Finish Body Material Composition Color Thermal Resistance Rated Power Device Type Compatible Device
258 by Wakefield Thermal Solutions

258

Wakefield Thermal Solutions

258 by Wakefield Thermal Solutions is a black anodized aluminum heat sink with U profile, measuring 12.7mm x 6.4mm x 8.6mm and weighing 0.82g. Ideal for cooling electronic components in compact devices due to its small size and lightweight design.

U

0.339 in (8.6 mm)

0.252 in (6.4 mm)

0.5 in (12.7 mm)

820 mg

Anodized

Aluminium

Black

Heat Sink

904-27-1-23-2-B-0 by Wakefield Thermal Solutions

904-27-1-23-2-B-0

Wakefield Thermal Solutions

Wakefield Thermal Solutions' 904-27-1-23-2-B-0 heat sink has thermal resistance of 12.93 ohm, elliptical fin orientation, and black anodized finish. It is a clip-profile extruded aluminum alloy device used on ICs for efficient heat dissipation.

Extruded

Clip

Elliptical Fin

0.906 in (23 mm)

1.063 in (27 mm)

1.063 in (27 mm)

Black Anodized

Aluminium Alloy

12.93 Ω

Heat Sink

IC

906-31-2-21-2-B-0 by Wakefield Thermal Solutions

906-31-2-21-2-B-0

Wakefield Thermal Solutions

Wakefield Thermal Solutions' 906-31-2-21-2-B-0 heat sink has a thermal resistance of 12.02 ohm, aluminum alloy construction, and pin fin orientation. It is designed for IC devices to efficiently dissipate heat in various applications.

Extruded

Clip

Pin Fin

0.827 in (21 mm)

1.22 in (31 mm)

1.22 in (31 mm)

Black Anodized

Aluminium Alloy

12.02 Ω

Heat Sink

IC

906-31-2-23-2-B-0 by Wakefield Thermal Solutions

906-31-2-23-2-B-0

Wakefield Thermal Solutions

Wakefield Thermal Solutions' 906-31-2-23-2-B-0 heat sink features a thermal resistance of 12.02 ohm, aluminum alloy construction with black anodized finish, and pin fin orientation. This clip-profiled device, measuring 31mm in width and length, is designed for IC applications.

Extruded

Clip

Pin Fin

0.906 in (23 mm)

1.22 in (31 mm)

1.22 in (31 mm)

Black Anodized

Aluminium Alloy

12.02 Ω

Heat Sink

IC

908-35-2-23-2-B-0 by Wakefield Thermal Solutions

908-35-2-23-2-B-0

Wakefield Thermal Solutions

Wakefield Thermal Solutions' 908-35-2-23-2-B-0 heat sink features a thermal resistance of 10.03 ohm, aluminum alloy construction with black anodized finish, and pin fin orientation. This clip-profiled device is 35mm wide, 12mm high, and used on ICs for effective heat dissipation in various electronic applications.

Extruded

Clip

Pin Fin

0.472 in (12 mm)

1.378 in (35 mm)

1.378 in (35 mm)

Black Anodized

Aluminium Alloy

10.03 Ω

Heat Sink

IC

910-40-1-23-2-B-0 by Wakefield Thermal Solutions

910-40-1-23-2-B-0

Wakefield Thermal Solutions

910-40-1-23-2-B-0 by Wakefield Thermal Solutions is a heat sink with thermal resistance of 9.95 ohm, elliptical fin orientation, and black anodized finish. It is an extruded aluminum alloy device used on ICs for efficient heat dissipation in electronic applications.

Extruded

Clip

Elliptical Fin

0.906 in (23 mm)

1.575 in (40 mm)

1.575 in (40 mm)

Black Anodized

Aluminium Alloy

9.95 Ω

Heat Sink

IC

910-40-2-23-2-B-0 by Wakefield Thermal Solutions

910-40-2-23-2-B-0

Wakefield Thermal Solutions

910-40-2-23-2-B-0 by Wakefield Thermal Solutions is a heat sink with thermal resistance of 9.18 ohm, made of aluminum alloy with black anodized finish. It features pin fin orientation and clip profile, suitable for IC applications due to its 40mm width and 12mm height.

Extruded

Clip

Pin Fin

0.472 in (12 mm)

1.575 in (40 mm)

1.575 in (40 mm)

Black Anodized

Aluminium Alloy

9.18 Ω

Heat Sink

IC