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BALL Telecom - Switching ICs 19

Telecom - Switching ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) No. of Functions No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
VSC7429XJG-02 by Microchip Technology

VSC7429XJG-02

Microchip Technology

Microchip Technology's VSC7429XJG-02 is an Ethernet switch IC with 672 terminals, operating temperature range of -40 to 125°C. It features a grid array package style and supports a max supply current of 2700mA. Ideal for automotive telecom applications due to its compact size and high performance capabilities.

S-PBGA-B672

e1

27 mm

1

672

125 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA672,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.44 mm

2700 mA

1 V

YES

ETHERNET SWITCH

AUTOMOTIVE

TIN SILVER COPPER

BALL

1 mm

BOTTOM

27 mm

VSC7425XJG-02 by Microchip Technology

VSC7425XJG-02

Microchip Technology

Microchip Technology's VSC7425XJG-02 is an Ethernet switch IC with 672 terminals in a square grid array package. It operates b/w 0-125°C, with a supply voltage of 1V and max current of 2700mA. Ideal for telecom applications requiring high-speed switching in compact designs.

S-PBGA-B672

27 mm

1

672

125 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA672,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.44 mm

2700 mA

1 V

YES

ETHERNET SWITCH

OTHER

BALL

1 mm

BOTTOM

27 mm

VSC7427XJG-02 by Microchip Technology

VSC7427XJG-02

Microchip Technology

VSC7427XJG-02 by Microchip: Ethernet switch IC with 672 terminals, operating temp. range of 0-125°C. Package style: grid array, suitable for telecom applications. Nominal voltage: 1V, max supply current: 2700mA, terminal pitch: 1mm.

S-PBGA-B672

27 mm

1

672

125 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA672,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.44 mm

2700 mA

1 V

YES

ETHERNET SWITCH

OTHER

BALL

1 mm

BOTTOM

27 mm

BCM53115MIPB by Broadcom

BCM53115MIPB

Broadcom

ETHERNET TRANSCEIVER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;

S-PBGA-B484

23 mm

1

484

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.43 mm

1.2 V

YES

CMOS

ETHERNET TRANSCEIVER

BALL

1 mm

BOTTOM

23 mm

BCM53115MKPBG by Broadcom

BCM53115MKPBG

Broadcom

BCM53115MKPBG by Broadcom is a Telecom IC for Ethernet transceiver applications. It operates at 0-70°C with a supply voltage of 1.2V, utilizing CMOS technology. The package is a square grid array measuring 23x23mm with 484 terminals in plastic/epoxy material.

S-PBGA-B484

23 mm

1

484

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.43 mm

1.2 V

YES

CMOS

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

1 mm

BOTTOM

23 mm

VSC7420XJG-02 by Microchip Technology

VSC7420XJG-02

Microchip Technology

VSC7420XJG-02 by Microchip: Ethernet switch IC with 672 terminals, operates at -40 to 125°C. Package style is grid array, surface mountable. Ideal for telecom applications requiring low supply current and nominal voltage of 1V.

S-PBGA-B672

27 mm

1

672

125 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA672,26X26,40

SQUARE

GRID ARRAY

2.44 mm

2 mA

1 V

YES

ETHERNET SWITCH

OTHER

BALL

1 mm

BOTTOM

27 mm

VSC7420XJG-04 by Microchip Technology

VSC7420XJG-04

Microchip Technology

VSC7420XJG-04 by Microchip: Ethernet switch IC with 672 terminals, operates at -40 to 125°C. Package style is grid array, suitable for automotive applications. Nominal voltage of 1V and low supply current of 2mA make it ideal for telecom switching systems.

S-PBGA-B672

27 mm

1

672

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA672,26X26,40

SQUARE

GRID ARRAY

2.44 mm

2 mA

1 V

YES

ETHERNET SWITCH

AUTOMOTIVE

BALL

1 mm

BOTTOM

27 mm

VSC7421XJG-04 by Microchip Technology

VSC7421XJG-04

Microchip Technology

VSC7421XJG-04 by Microchip: Ethernet switch IC with 672 terminals, operates at -40 to 125°C. Package style is grid array, suitable for automotive applications. Nominal voltage of 1V and max supply current of 2.6mA make it ideal for telecom switching in compact setups.

S-PBGA-B672

27 mm

1

672

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA672,26X26,40

SQUARE

GRID ARRAY

2.44 mm

2.6 mA

1 V

YES

ETHERNET SWITCH

AUTOMOTIVE

BALL

1 mm

BOTTOM

27 mm

VSC7422XJG-04 by Microchip Technology

VSC7422XJG-04

Microchip Technology

VSC7422XJG-04 by Microchip: Ethernet switch IC with 672 terminals, operating temp. range -40 to 125°C, and supply current of 2.6mA. Ideal for automotive telecom applications due to its grid array package style and low voltage requirement of 1V.

S-PBGA-B672

27 mm

1

672

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA672,26X26,40

SQUARE

GRID ARRAY

2.44 mm

2.6 mA

1 V

YES

ETHERNET SWITCH

AUTOMOTIVE

BALL

1 mm

BOTTOM

27 mm

VSC7423XJG-02 by Microchip Technology

VSC7423XJG-02

Microchip Technology

VSC7423XJG-02 by Microchip Tech is an Ethernet switch IC with 672 terminals in a square grid array package. Operating temp range from -40 to 125°C, suitable for automotive applications. Features include 1V nominal voltage, 2000mA max supply current, and surface mount compatibility.

S-PBGA-B672

27 mm

1

672

125 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA672,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.36 mm

2000 mA

1 V

YES

ETHERNET SWITCH

AUTOMOTIVE

BALL

1 mm

BOTTOM

27 mm

VSC7428XJG-02 by Microchip Technology

VSC7428XJG-02

Microchip Technology

VSC7428XJG-02 by Microchip: Ethernet switch IC with 672 terminals, operating temp -40 to 125°C. Package style grid array, suitable for automotive telecom applications. Nominal voltage 1V, max supply current 2100mA for high-performance networking solutions.

S-PBGA-B672

27 mm

1

672

125 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA672,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.44 mm

2100 mA

1 V

YES

ETHERNET SWITCH

AUTOMOTIVE

BALL

1 mm

BOTTOM

27 mm

VSC7428XJG-12 by Microchip Technology

VSC7428XJG-12

Microchip Technology

VSC7428XJG-12 by Microchip Technology is a telecom switching IC with 1 function. It has a square package and 672 terminals, making it suitable for surface mount applications. With a max operating temperature of 125°C and automotive temperature grade, it is ideal for Ethernet switch applications.

S-PBGA-B672

27 mm

1

672

125 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA672,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.44 mm

2100 mA

1 V

YES

ETHERNET SWITCH

AUTOMOTIVE

BALL

1 mm

BOTTOM

27 mm

VSC7436XMT by Microchip Technology

VSC7436XMT

Microchip Technology

Microchip Technology's VSC7436XMT is an Ethernet switch IC with 324 terminals in a square grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With a nominal voltage of 1V and max supply current of 3300mA, it offers high performance in telecom switching systems.

S-PBGA-B324

19 mm

1

324

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

GRID ARRAY

1.8 mm

3300 mA

1 V

YES

ETHERNET SWITCH

AUTOMOTIVE

BALL

1 mm

BOTTOM

19 mm

VSC7513XKS by Microchip Technology

VSC7513XKS

Microchip Technology

ETHERNET SWITCH; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B256

17 mm

1

256

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

1.8 mm

1800 mA

1 V

YES

ETHERNET SWITCH

AUTOMOTIVE

BALL

1 mm

BOTTOM

17 mm

VSC7424XJG-02 by Microchip Technology

VSC7424XJG-02

Microchip Technology

VSC7424XJG-02 by Microchip: Ethernet switch IC with 672 terminals, operating temp -40 to 125°C. Package style grid array, suitable for telecom applications. Nominal voltage of 1V and max supply current of 2000mA make it ideal for telecom switching systems.

S-PBGA-B672

27 mm

1

672

125 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA672,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.36 mm

2000 mA

1 V

YES

ETHERNET SWITCH

BALL

1 mm

BOTTOM

27 mm

VSC7514XKS by Microchip Technology

VSC7514XKS

Microchip Technology

VSC7514XKS by Microchip: Ethernet switch IC with 256 terminals, operating temp -40 to 125°C. Package style: grid array, surface mountable for automotive telecom applications. Nominal voltage: 1V, max supply current 1800mA.

S-PBGA-B256

17 mm

1

256

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

1.8 mm

1800 mA

1 V

YES

ETHERNET SWITCH

AUTOMOTIVE

BALL

1 mm

BOTTOM

17 mm

BCM56072A0KFSBG by Broadcom

BCM56072A0KFSBG

Broadcom

ETHERNET SWITCH; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 2.768 mm;

S-PBGA-B896

e1

25 mm

1

896

70 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA896,30X30,32

SQUARE

GRID ARRAY, FINE PITCH

2.768 mm

23846.4 mA

.88 V

YES

CMOS

ETHERNET SWITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

25 mm

SJA1110BEL/0Y by NXP Semiconductors

SJA1110BEL/0Y

NXP Semiconductors

ETHERNET SWITCH; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES;

ALSO OPERATES WITH NOMINAL 2.5V AND 3.3V SUPPLY

R-PBGA-B256

3

1

256

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

ISO 26262; AEC-Q100

1.8 V

YES

ETHERNET SWITCH

BALL

BOTTOM

SJA1110CEL/0Y by NXP Semiconductors

SJA1110CEL/0Y

NXP Semiconductors

ETHERNET SWITCH; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

ALSO OPERATES WITH 2.5V AND 3.3V NOMINAL SUPPLY

S-PBGA-B256

14 mm

3

1

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

AEC-Q100; ISO 26262

1.5 mm

1.8 V

YES

ETHERNET SWITCH

BALL

.8 mm

BOTTOM

14 mm