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43 Other Function Telecom Interface ICs 7

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
EFR32BG1B232F256GJ43-C0 by Silicon Labs

EFR32BG1B232F256GJ43-C0

Silicon Labs

EFR32BG1B232F256GJ43-C0 by Silicon Labs is a 43-terminal IC with telecom circuit type, operating at -40 to 85°C. It has a nominal voltage of 3.3V and uses ball terminal form. This industrial-grade IC in grid array package is ideal for telecom interface applications.

R-PBGA-B43

3.295 mm

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.4 mm

BOTTOM

3.143 mm

EFR32BG1P332F256GJ43-C0 by Silicon Labs

EFR32BG1P332F256GJ43-C0

Silicon Labs

EFR32BG1P332F256GJ43-C0 by Silicon Labs is a Telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a grid array package style with 43 terminals and tin silver copper finish. Ideal for telecom circuits, it has a very thin profile and fine pitch design for industrial applications.

R-PBGA-B43

e1

3.295 mm

1

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

40

3.143 mm

EFR32BG1V132F256GJ43-C0 by Silicon Labs

EFR32BG1V132F256GJ43-C0

Silicon Labs

EFR32BG1V132F256GJ43-C0 by Silicon Labs is a telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a grid array package style with 43 terminals and 0.4mm pitch, suitable for industrial applications requiring thin profile and fine pitch components.

R-PBGA-B43

3.295 mm

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.4 mm

BOTTOM

3.143 mm

BM23SPKA1NB9-0001AA by Microchip Technology

BM23SPKA1NB9-0001AA

Microchip Technology

BM23SPKA1NB9-0001AA by Microchip Technology is a surface mount telecom interface IC with 43 terminals. It operates at temperatures ranging from -20 to 70 °C and has a seated height of 1.9 mm. This IC is commonly used in telecom circuits with a nominal voltage of 3.7 V.

R-XXMA-N43

29 mm

1

43

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,43LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.2 mm

UNSPECIFIED

15 mm

BM23SPKA1NB9-0B02AA by Microchip Technology

BM23SPKA1NB9-0B02AA

Microchip Technology

BM23SPKA1NB9-0B02AA by Microchip Technology is a telecom IC with 43 terminals, operating at -20 to 70°C. It has a nominal voltage of 3.7V and terminal pitch of 1.2mm. This rectangular surface-mount IC is ideal for telecom circuit applications due to its compact size and commercial temperature grade suitability.

R-XXMA-N43

29 mm

1

43

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,43LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.2 mm

UNSPECIFIED

15 mm

BM23SPKS1NB9-0001AA by Microchip Technology

BM23SPKS1NB9-0001AA

Microchip Technology

BM23SPKS1NB9-0001AA by Microchip is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 43 terminals. It operates b/w -20 to 70 °C and has a seated height of 1.9 mm. This TELECOM CIRCUIT IC has a supply voltage of 3.7 V, making it ideal for telecom interface applications.

R-XXMA-N43

29 mm

1

43

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,43LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.2 mm

UNSPECIFIED

15 mm

BM23SPKS1NB9-0B02AA by Microchip Technology

BM23SPKS1NB9-0B02AA

Microchip Technology

BM23SPKS1NB9-0B02AA by Microchip Technology is a Telecom IC with 43 terminals, operating at -20 to 70°C. It has a rectangular package style, measuring 15mm in width and 29mm in length. Ideal for telecom applications requiring a nominal voltage of 3.7V and terminal pitch of 1.2mm.

R-XXMA-N43

29 mm

1

43

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,43LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.2 mm

UNSPECIFIED

15 mm