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3 Other Function Telecom Interface ICs 9

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
HTMS8101FTB/AF,115 by NXP Semiconductors

HTMS8101FTB/AF,115

NXP Semiconductors

HTMS8101FTB/AF,115 from NXP Semiconductors is a telecom interface IC designed for surface mount applications. It features a quad terminal configuration, operates at peak reflow temps of 260 °C, and utilizes CMOS technology. Ideal for enhancing telecom circuit performance in compact designs.

1

3

PLASTIC/EPOXY

QCCN

LCC3(UNSPEC)

CHIP CARRIER

260

Not Qualified

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

NO LEAD

QUAD

HTMS8201FTB/AF,115 by NXP Semiconductors

HTMS8201FTB/AF,115

NXP Semiconductors

HTMS8201FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC featuring a no-lead design with 3 terminals. It supports peak reflow temps of 260 °C and utilizes CMOS technology for efficient performance. Ideal for surface mount applications in telecom circuits.

1

3

PLASTIC/EPOXY

QCCN

LCC3(UNSPEC)

CHIP CARRIER

260

Not Qualified

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

NO LEAD

QUAD

HTMS1101FTB/AF,115 by NXP Semiconductors

HTMS1101FTB/AF,115

NXP Semiconductors

HTMS1101FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.

R-PDSO-N3

1.45 mm

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

LCC3(UNSPEC)

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

Not Qualified

.5 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

1 mm

HTMS1201FTB/AF,115 by NXP Semiconductors

HTMS1201FTB/AF,115

NXP Semiconductors

HTMS1201FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.

R-PDSO-N3

1.45 mm

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

LCC3(UNSPEC)

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

Not Qualified

.5 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

1 mm

SL2S1502FTBX by NXP Semiconductors

SL2S1502FTBX

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: VSON; Package Shape: RECTANGULAR;

R-PDSO-N3

1.45 mm

1

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

260

.5 mm

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.55 mm

DUAL

1 mm

SL2S2102FTB,115 by NXP Semiconductors

SL2S2102FTB,115

NXP Semiconductors

SL2S2102FTB,115 by NXP Semiconductors is a telecom interface IC with 3 terminals. It operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. This CMOS technology IC is ideal for industrial telecom circuits due to its small outline and thin profile package style.

R-PDSO-N3

e3

1.45 mm

1

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

260

.5 mm

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.55 mm

DUAL

30

1 mm

SL3S1202FTB1,115 by NXP Semiconductors

SL3S1202FTB1,115

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 3; Package Code: BCC; Package Shape: RECTANGULAR;

R-PBCC-B3

e3

1.45 mm

1

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

BCC

LCC3(UNSPEC)

RECTANGULAR

CHIP CARRIER

260

Not Qualified

.5 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

BUTT

.55 mm

BOTTOM

30

1 mm

MMG30271BT1 by NXP Semiconductors

MMG30271BT1

NXP Semiconductors

TELECOM CIRCUIT; Terminal Form: FLAT; No. of Terminals: 3; Package Code: LSOF; Package Shape: RECTANGULAR; JESD-30 Code: R-PSSO-F3;

R-PSSO-F3

4.5 mm

1

1

3

PLASTIC/EPOXY

LSOF

RECTANGULAR

SMALL OUTLINE, LOW PROFILE

260

1.6 mm

5 V

YES

TELECOM CIRCUIT

FLAT

1.5 mm

SINGLE

40

2.5 mm

MMG30301BT1 by NXP Semiconductors

MMG30301BT1

NXP Semiconductors

TELECOM CIRCUIT; Terminal Form: FLAT; No. of Terminals: 3; Package Code: LSOF; Package Shape: RECTANGULAR; No. of Functions: 1;

R-PSSO-F3

4.5 mm

1

1

3

PLASTIC/EPOXY

LSOF

RECTANGULAR

SMALL OUTLINE, LOW PROFILE

260

1.6 mm

5 V

YES

TELECOM CIRCUIT

FLAT

1.5 mm

SINGLE

40

2.5 mm