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144 Cellphone ICs 7

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
AD6657ABBCZRL by Analog Devices

AD6657ABBCZRL

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

1.4 mm

Other Telecom ICs

.51 mA

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD6657ABBCZ by Analog Devices

AD6657ABBCZ

Analog Devices

AD6657ABBCZ by Analog Devices is a Cellphone IC with 144 terminals in a square package. It operates at -40 to 85°C, with a supply voltage of 1.8V and max current of 0.51mA. This RF and baseband circuit is ideal for telecom applications due to its low profile, fine pitch design.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

1.4 mm

Other Telecom ICs

.51 mA

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD9361BBCZ-REEL by Analog Devices

AD9361BBCZ-REEL

Analog Devices

AD9361BBCZ-REEL by Analog Devices is a CELLPHONE IC with 144 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for INDUSTRIAL telecom applications. Features include TIN SILVER COPPER finish, 1.3V supply voltage, and RF/BASEBAND circuit type.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

10 mm

AD9361BBCZ by Analog Devices

AD9361BBCZ

Analog Devices

AD9361BBCZ by Analog Devices is a 144-terminal RF and baseband circuit IC with a nominal voltage of 1.3V. It operates in industrial temperature range (-40 to 85°C) and features a low profile, fine pitch grid array package suitable for cellphone applications. The IC is surface mountable, with terminal finish of tin silver copper, making it ideal for compact designs.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

10 mm

AD6657BBCZRL by Analog Devices

AD6657BBCZRL

Analog Devices

AD6657BBCZRL by Analog Devices is a cellphone IC with 144 terminals in a square grid array package. It operates b/w -40 to 85 °C, with a supply voltage of 1.8V for RF and baseband circuits. The low-profile, fine-pitch design makes it suitable for industrial telecom applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

1.4 mm

Other Telecom ICs

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD6657BBCZ by Analog Devices

AD6657BBCZ

Analog Devices

AD6657BBCZ by Analog Devices is a cellphone IC with 144 terminals in a square package. It operates b/w -40 to 85 °C and has a supply voltage of 1.8 V, suitable for RF and baseband circuits in telecom applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8

Not Qualified

1.4 mm

Other Telecom ICs

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

10 mm

AD9361BBCZ-CSL by Analog Devices

AD9361BBCZ-CSL

Analog Devices

AD9361BBCZ-CSL by Analog Devices is a cellphone IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, consuming max 150mA at 1.3V. Ideal for RF and baseband circuits in telecom applications due to its compact size and surface-mount capability.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.7 mm

150 mA

1.3 V

YES

RF AND BASEBAND CIRCUIT

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm