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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
EPF10K30ABI356-3 by Altera

EPF10K30ABI356-3

Altera

LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 356; Package Code: LBGA; Package Shape: SQUARE;

Loadable PLD

4 Dedicated Inputs, 246 I/O

246

Registered

246

4

1728

246

80 MHz

0.9 ns

CMOS

Field Programmable Gate Arrays

1728 Logic Elements; 216 Labs

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA356,26X26,50

35 mm

35 mm

1.63 mm

Bottom

Ball

356

1.27 mm

Tin Lead

S-PBGA-B356

e0

No

EPM9320ABC356-10 by Altera

EPM9320ABC356-10

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 356; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 168 I/O

Macrocell

320

0

168

144.9 MHz

10.8 ns

CMOS

Programmable Logic Devices

320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA356,26X26,50

35 mm

35 mm

1.63 mm

Bottom

Ball

356

1.27 mm

Tin Lead

S-PBGA-B356

e0

Yes

No

EPM9320BC356-15 by Altera

EPM9320BC356-15

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 356; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 168 I/O

Macrocell

320

0

168

117.6 MHz

16 ns

CMOS

Programmable Logic Devices

320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA356,26X26,50

35 mm

35 mm

1.63 mm

Bottom

Ball

356

1.27 mm

Tin Lead

S-PBGA-B356

e0

Yes

No

EPM7128AFC100-10 by Altera

EPM7128AFC100-10

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 84 I/O

Macrocell

128

0

84

87 MHz

10 ns

CMOS

Programmable Logic Devices

128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA100,10X10,40

11 mm

11 mm

1.7 mm

Bottom

Ball

100

1 mm

Tin Lead

S-PBGA-B100

e0

Yes

No

EPM7128AFC100-6 by Altera

EPM7128AFC100-6

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 84 I/O

Macrocell

128

0

84

144.9 MHz

6 ns

CMOS

Programmable Logic Devices

128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA100,10X10,40

11 mm

11 mm

1.7 mm

Bottom

Ball

100

1 mm

Tin Lead

S-PBGA-B100

e0

Yes

No

XC95216-10BG352C by Xilinx

XC95216-10BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

66.7 MHz

10 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95216-10BG352I by Xilinx

XC95216-10BG352I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

66.7 MHz

10 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.5 V

5.5 V

3.3/5,5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95216-15BG352C by Xilinx

XC95216-15BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

55.6 MHz

15 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95216-15BG352I by Xilinx

XC95216-15BG352I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

55.6 MHz

15 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.5 V

5.5 V

3.3/5,5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95216-20BG352C by Xilinx

XC95216-20BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

50 MHz

20 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95216-20BG352I by Xilinx

XC95216-20BG352I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

50 MHz

20 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.5 V

5.5 V

3.3/5,5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95288-10BG352C by Xilinx

XC95288-10BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

67 MHz

10 ns

CMOS

Programmable Logic Devices

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.7 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95288-15BG352C by Xilinx

XC95288-15BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

55.6 MHz

15 ns

CMOS

Programmable Logic Devices

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.7 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95288-15BG352I by Xilinx

XC95288-15BG352I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

55.6 MHz

15 ns

CMOS

Programmable Logic Devices

288 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.5 V

5.5 V

3.3/5,5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.7 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95288-20BG352C by Xilinx

XC95288-20BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

50 MHz

20 ns

CMOS

Programmable Logic Devices

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.7 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95288-20BG352I by Xilinx

XC95288-20BG352I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

50 MHz

20 ns

CMOS

Programmable Logic Devices

5

4.5 V

5.5 V

3.3/5,5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.7 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XCR3384XL-10FT256I by Xilinx

XCR3384XL-10FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

102 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3384XL-12FT256I by Xilinx

XCR3384XL-12FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

83 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3384XL-7FT256C by Xilinx

XCR3384XL-7FT256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

135 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

CY39100V256B-83BBC by Cypress Semiconductor

CY39100V256B-83BBC

Cypress Semiconductor

CY39100V256B-83BBC by Cypress Semiconductor is a 1536 macrocell LOADABLE PLD with 15ns propagation delay. It operates at 2.5V, has 180 I/O lines, and supports JTAG boundary scan testing. Ideal for applications requiring fast processing speeds and extensive input/output capabilities in commercial-grade environments.

Loadable PLD

Yes

0 Dedicated Inputs, 180 I/O

Macrocell

1536

0

180

15 ns

CMOS

Programmable Logic Devices

Also operates at 3.3 V nominal supply

2.5

2.3 V

2.7 V

1.5/3.3,2.5/3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

3

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.6 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3512XL-10FT256C by Xilinx

XCR3512XL-10FT256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3512XL-10FT256I by Xilinx

XCR3512XL-10FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3512XL-7FT256C by Xilinx

XCR3512XL-7FT256C

Xilinx

Xilinx XCR3512XL-7FT256C is a 512 macrocell EE PLD with 212 I/O lines, operating at max 135 MHz. It features in-system programmability and JTAG boundary scan testing, suitable for applications requiring fast propagation delay of 7.5 ns and low profile grid array packaging.

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

135 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C512-7FT256I by Xilinx

XC2C512-7FT256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C512-7FTG256I by Xilinx

XC2C512-7FTG256I

Xilinx

XC2C512-7FTG256I by Xilinx is a 512 macrocell FLASH PLD with 212 I/O lines, operating at 119 MHz. It has a propagation delay of 7.5 ns and can handle a max supply voltage of 1.9 V. Ideal for industrial applications requiring high-speed programmable logic devices in compact form factors.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

LC4256V-3FTN256BC by Lattice Semiconductor

LC4256V-3FTN256BC

Lattice Semiconductor

LC4256V-3FTN256BC by Lattice Semiconductor is a 256 macrocell EE PLD with 164 inputs and 160 I/O lines. Featuring a propagation delay of 3 ns, it operates at a max clock frequency of 212 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in a compact grid array package.

EE PLD

Yes

4 Dedicated Inputs, 160 I/O

160

Macrocell

164

256

83

4

160

212 MHz

3 ns

PAD-TYPE

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

90 °C (194 °F)

0 °C (32 °F)

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

S-PBGA-B256

e1

Yes

No

LC4256V-5FTN256AC by Lattice Semiconductor

LC4256V-5FTN256AC

Lattice Semiconductor

LC4256V-5FTN256AC by Lattice Semiconductor is a 3.3V EE PLD with 256 macro cells, 132 inputs, and 128 I/O lines. With a propagation delay of 5ns and max clock frequency of 156MHz, it's ideal for applications requiring fast processing speeds like high-speed data processing and telecommunications systems. The device is surface mountable and features in-system programmability for easy integration into various electronic designs.

EE PLD

Yes

4 Dedicated Inputs, 128 I/O

128

Macrocell

132

256

83

4

128

156 MHz

5 ns

PAD-TYPE

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

90 °C (194 °F)

0 °C (32 °F)

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

S-PBGA-B256

e1

Yes

No

LC4256V-75FTN256AC by Lattice Semiconductor

LC4256V-75FTN256AC

Lattice Semiconductor

LC4256V-75FTN256AC by Lattice Semiconductor is a 3.3V EE PLD with 7.5ns propagation delay, 256 macro cells, and 128 I/O lines. Ideal for applications requiring in-system programmability, it features a max clock frequency of 111MHz and operates b/w 0-90°C.

EE PLD

Yes

4 Dedicated Inputs, 128 I/O

128

Macrocell

132

256

83

4

128

111 MHz

7.5 ns

PAD-TYPE

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

90 °C (194 °F)

0 °C (32 °F)

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

S-PBGA-B256

e1

Yes

No

LC4512V-5FTN256C by Lattice Semiconductor

LC4512V-5FTN256C

Lattice Semiconductor

LC4512V-5FTN256C by Lattice Semiconductor is a 512 macrocell EE PLD with 212 inputs and 208 I/O lines. It has a propagation delay of 5 ns, max clock frequency of 156 MHz, and operates at temperatures from 0 to 90°C. Ideal for applications requiring programmable logic devices in a grid array package style for low-profile designs.

EE PLD

Yes

4 Dedicated Inputs, 208 I/O

208

Macrocell

212

512

83

4

208

156 MHz

5 ns

PAD-TYPE

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

90 °C (194 °F)

0 °C (32 °F)

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

S-PBGA-B256

e1

Yes

No

LC4512V-75FT256C by Lattice Semiconductor

LC4512V-75FT256C

Lattice Semiconductor

LC4512V-75FT256C by Lattice Semiconductor is a 3.3V EE PLD with 512 macro cells, 212 inputs, and 7.5ns propagation delay. Ideal for applications requiring high-speed processing and programmable logic functions in a compact GRID ARRAY package with low profile design.

EE PLD

Yes

4 Dedicated Inputs, 208 I/O

208

Macrocell

212

512

83

4

208

111 MHz

7.5 ns

PAD-TYPE

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

90 °C (194 °F)

0 °C (32 °F)

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

LC4512V-75FTN256C by Lattice Semiconductor

LC4512V-75FTN256C

Lattice Semiconductor

LC4512V-75FTN256C by Lattice Semiconductor is a 512 macrocell EE PLD with 212 inputs and 208 I/O lines. It has a max clock frequency of 111 MHz and can operate at temperatures up to 90°C. This programmable logic device is suitable for applications requiring high-speed data processing and control.

EE PLD

Yes

4 Dedicated Inputs, 208 I/O

208

Macrocell

212

512

83

4

208

111 MHz

7.5 ns

PAD-TYPE

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

90 °C (194 °F)

0 °C (32 °F)

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

S-PBGA-B256

e1

Yes

No

XCR3256XL-10FT256I by Xilinx

XCR3256XL-10FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3256XL-12FT256C by Xilinx

XCR3256XL-12FT256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

88 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3256XL-12FT256I by Xilinx

XCR3256XL-12FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

88 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3256XL-7FT256C by Xilinx

XCR3256XL-7FT256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

154 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3512XL-12FT256I by Xilinx

XCR3512XL-12FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C256-6FT256C by Xilinx

XC2C256-6FT256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 184 I/O

184

Macrocell

184

256

0

184

139 MHz

6 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C512-10FT256C by Xilinx

XC2C512-10FT256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C512-10FT256I by Xilinx

XC2C512-10FT256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C512-7FT256C by Xilinx

XC2C512-7FT256C

Xilinx

XC2C512-7FT256C by Xilinx is a 512 macrocell FLASH PLD with 212 I/O lines, 7.5 ns propagation delay, and 119 MHz max clock frequency. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications systems.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C256-7FT256C by Xilinx

XC2C256-7FT256C

Xilinx

XC2C256-7FT256C by Xilinx is a 256 macrocell FLASH PLD with 184 I/O lines, operating at max 108 MHz. It features a propagation delay of 7.5 ns and supports JTAG boundary scan testing. Ideal for applications requiring high-speed programmable logic devices in commercial temperature environments.

Flash PLD

Yes

0 Dedicated Inputs, 184 I/O

184

Macrocell

184

256

0

184

108 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C256-7FT256I by Xilinx

XC2C256-7FT256I

Xilinx

XC2C256-7FT256I by Xilinx is a 256 Macrocell FLASH PLD with 184 I/O lines, operating at max 108 MHz clock frequency. It uses CMOS technology, has propagation delay of 7.5 ns, and supports JTAG boundary scan test. Ideal for industrial applications requiring programmable logic devices with low profile grid array package style.

Flash PLD

Yes

0 Dedicated Inputs, 184 I/O

184

Macrocell

184

256

0

184

108 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C384-10FT256C by Xilinx

XC2C384-10FT256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C384-10FT256I by Xilinx

XC2C384-10FT256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C384-7FT256C by Xilinx

XC2C384-7FT256C

Xilinx

XC2C384-7FT256C by Xilinx is a 384 macrocell FLASH PLD with 212 I/O lines, operating at 112 MHz. It features a propagation delay of 7.5 ns and can be used in applications requiring programmable logic devices with low profile grid array packaging for high-speed digital designs.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

112 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C256-6FTG256C by Xilinx

XC2C256-6FTG256C

Xilinx

Xilinx XC2C256-6FTG256C is a 256 macrocell FLASH PLD with 184 I/O lines, operating at max 139 MHz clock frequency. It uses CMOS technology with 6 ns propagation delay and supports JTAG boundary scan test. Ideal for applications requiring in-system programmability and low-profile grid array package style.

Flash PLD

Yes

0 Dedicated Inputs, 184 I/O

184

Macrocell

184

256

0

184

139 MHz

6 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC2C384-10FTG256C by Xilinx

XC2C384-10FTG256C

Xilinx

Xilinx XC2C384-10FTG256C is a 384 macrocell FLASH PLD with 212 I/O lines. It operates at max clock freq of 83 MHz, with propagation delay of 10 ns. Ideal for applications requiring in-system programmability and JTAG boundary scan test capabilities.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC2C384-10FTG256I by Xilinx

XC2C384-10FTG256I

Xilinx

Xilinx XC2C384-10FTG256I is a 384 macrocell FLASH PLD with 212 I/O lines. It operates at max clock freq of 83MHz, has propagation delay of 10ns, and supports JTAG boundary scan test. Ideal for industrial applications requiring in-system programmable logic devices with low profile grid array package style.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No