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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
XC2C384-7FTG256C by Xilinx

XC2C384-7FTG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

112 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC2C512-10FTG256C by Xilinx

XC2C512-10FTG256C

Xilinx

The Xilinx XC2C512-10FTG256C is a 512 macrocell FLASH PLD with 212 I/O lines, operating at up to 91 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for applications requiring fast processing speeds and high I/O capabilities in commercial-grade environments.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC2C512-10FTG256I by Xilinx

XC2C512-10FTG256I

Xilinx

Xilinx XC2C512-10FTG256I is a 512 macrocell FLASH PLD with 212 I/O lines, operating at max 91 MHz. It features a propagation delay of 10 ns and supports JTAG boundary scan testing. Ideal for industrial applications requiring fast processing speeds and extensive I/O capabilities in a compact grid array package.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3384XL-10FTG256I by Xilinx

XCR3384XL-10FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

102 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3384XL-12FTG256C by Xilinx

XCR3384XL-12FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

83 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3384XL-7FTG256C by Xilinx

XCR3384XL-7FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

135 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-10FTG256I by Xilinx

XCR3512XL-10FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-12FTG256C by Xilinx

XCR3512XL-12FTG256C

Xilinx

Xilinx XCR3512XL-12FTG256C is a 512 macrocell EE PLD with 212 I/O lines, operating at max 77 MHz. It features in-system programmability and JTAG boundary scan test for versatile applications in commercial-grade electronics. The device has a low profile grid array package with 256 terminals, suitable for high-speed digital designs requiring fast propagation delay of 12 ns.

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-7FTG256C by Xilinx

XCR3512XL-7FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

135 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-12FTG256I by Xilinx

XCR3512XL-12FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-10FTG256C by Xilinx

XCR3256XL-10FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-10FTG256I by Xilinx

XCR3256XL-10FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-12FTG256C by Xilinx

XCR3256XL-12FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

88 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-12FTG256I by Xilinx

XCR3256XL-12FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

88 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-7FTG256C by Xilinx

XCR3256XL-7FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

154 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No