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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCV200-5FG256I by Xilinx

XCV200-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn63Pb37);

FPGA

5292

176

176

1176

236666

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200-6FG256C by Xilinx

XCV200-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

176

176

1176

236666

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV50-4BG256C by Xilinx

XCV50-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

180

180

384

57906

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV50-4BG256I by Xilinx

XCV50-4BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

1728

180

180

384

57906

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV50-4FG256C by Xilinx

XCV50-4FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

176

176

384

57906

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV50-4FG256I by Xilinx

XCV50-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 2.5;

FPGA

1728

176

176

384

57906

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV50-5BG256C by Xilinx

XCV50-5BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

180

180

384

57906

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV50-5BG256I by Xilinx

XCV50-5BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

1728

180

180

384

57906

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV50-5FG256C by Xilinx

XCV50-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

176

176

384

57906

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV50-5FG256I by Xilinx

XCV50-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Organization: 384 CLBS, 57906 GATES;

FPGA

1728

176

176

384

57906

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV50-6BG256C by Xilinx

XCV50-6BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

180

180

384

57906

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV50-6FG256C by Xilinx

XCV50-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

176

176

384

57906

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC4010XL-09BG256C by Xilinx

XC4010XL-09BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

217 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Typical gates = 7000-20000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4010XL-2BG256C by Xilinx

XC4010XL-2BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

179 MHz

1.5 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4010XL-2BG256I by Xilinx

XC4010XL-2BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B256;

FPGA

400

160

160

400

7000

179 MHz

1.5 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4010XL-3BG256C by Xilinx

XC4010XL-3BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

166 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4010XL-3BG256I by Xilinx

XC4010XL-3BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 3.6 V;

FPGA

400

160

160

400

7000

166 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4013XL-09BG256C by Xilinx

XC4013XL-09BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

217 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Typical gates = 10000-30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4013XL-1BG256C by Xilinx

XC4013XL-1BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

200 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4013XL-1BG256I by Xilinx

XC4013XL-1BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 3 V;

FPGA

576

192

192

576

10000

200 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4013XL-2BG256C by Xilinx

XC4013XL-2BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

179 MHz

1.5 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4013XL-3BG256C by Xilinx

XC4013XL-3BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

166 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4013XL-3BG256I by Xilinx

XC4013XL-3BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 576;

FPGA

576

192

192

576

10000

166 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4020XL-09BG256C by Xilinx

XC4020XL-09BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

217 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Typical gates = 13000-40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4020XL-1BG256C by Xilinx

XC4020XL-1BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

200 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4020XL-1BG256I by Xilinx

XC4020XL-1BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn63Pb37);

FPGA

784

224

224

784

13000

200 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4020XL-2BG256I by Xilinx

XC4020XL-2BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: 1.5 ns;

FPGA

784

224

224

784

13000

179 MHz

1.5 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4020XL-3BG256C by Xilinx

XC4020XL-3BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

166 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4020XL-3BG256I by Xilinx

XC4020XL-3BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Additional Features: MAX USABLE 20000 LOGIC GATES;

FPGA

784

224

224

784

13000

166 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4028XL-09BG256C by Xilinx

XC4028XL-09BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1024

256

256

1024

18000

217 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 18000 Gates

Typical gates = 18000-50000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4028XL-1BG256I by Xilinx

XC4028XL-1BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn63Pb37);

FPGA

1024

256

256

1024

18000

200 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 18000 Gates

Max usable 28000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4028XL-2BG256I by Xilinx

XC4028XL-2BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 256;

FPGA

1024

256

256

1024

18000

179 MHz

1.5 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 18000 Gates

Max usable 28000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4028XL-3BG256C by Xilinx

XC4028XL-3BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1024

256

256

1024

18000

166 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 18000 Gates

Max usable 28000 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC4028XL-3BG256I by Xilinx

XC4028XL-3BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

1024

256

256

1024

18000

166 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 18000 Gates

Max usable 28000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV150-4BG352C by Xilinx

XCV150-4BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

164674

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV150-4BG352I by Xilinx

XCV150-4BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; No. of CLBs: 864;

FPGA

3888

260

260

864

164674

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV150-5BG352C by Xilinx

XCV150-5BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

164674

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV150-5BG352I by Xilinx

XCV150-5BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 2.5;

FPGA

3888

260

260

864

164674

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV150-6BG352C by Xilinx

XCV150-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

164674

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200-4BG352C by Xilinx

XCV200-4BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

236666

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200-4BG352I by Xilinx

XCV200-4BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

FPGA

5292

260

260

1176

236666

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200-5BG352C by Xilinx

XCV200-5BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

236666

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200-5BG352I by Xilinx

XCV200-5BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 2.625 V;

FPGA

5292

260

260

1176

236666

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200-6BG352C by Xilinx

XCV200-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

236666

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300-4BG352C by Xilinx

XCV300-4BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

260

260

1536

322970

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300-4BG352I by Xilinx

XCV300-4BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;

FPGA

6912

260

260

1536

322970

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300-4BG432C by Xilinx

XCV300-4BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

316

316

1536

322970

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV300-4BG432I by Xilinx

XCV300-4BG432I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .8 ns;

FPGA

6912

316

316

1536

322970

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No