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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC4020E-1HQ240C by Xilinx

XC4020E-1HQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4020E-2HQ240C by Xilinx

XC4020E-2HQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4020E-2HQ240I by Xilinx

XC4020E-2HQ240I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G240;

FPGA

784

224

224

784

13000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4020E-3HQ240C by Xilinx

XC4020E-3HQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4020E-3HQ240I by Xilinx

XC4020E-3HQ240I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE; Additional Features: MAX USABLE 20000 LOGIC GATES;

FPGA

784

224

224

784

13000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4020E-4HQ240C by Xilinx

XC4020E-4HQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4020E-4HQ240I by Xilinx

XC4020E-4HQ240I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G240;

FPGA

784

224

224

784

13000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Max usable 20000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4025E-2HQ240C by Xilinx

XC4025E-2HQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

1024

256

256

1024

15000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 15000 Gates

Max usable 25000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4025E-3HQ240C by Xilinx

XC4025E-3HQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

1024

256

256

1024

15000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 15000 Gates

Max usable 25000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4025E-3HQ240I by Xilinx

XC4025E-3HQ240I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE; Length: 32 mm;

FPGA

1024

256

256

1024

15000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 15000 Gates

Max usable 25000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4025E-4HQ240C by Xilinx

XC4025E-4HQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

1024

256

256

1024

15000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 15000 Gates

Max usable 25000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4025E-4HQ240I by Xilinx

XC4025E-4HQ240I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 5.5 V;

FPGA

1024

256

256

1024

15000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 15000 Gates

Max usable 25000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4028XLA-09HQ240I by Xilinx

XC4028XLA-09HQ240I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE; No. of Equivalent Gates: 18000;

FPGA

1024

256

256

1024

18000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 18000 Gates

Can also use 50000 gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4036EX-3HQ240C by Xilinx

XC4036EX-3HQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

1296

288

288

1296

22000

166 MHz

CMOS

Field Programmable Gate Arrays

1296 CLBS, 22000 Gates

Max usable 36000 Logic gates

5

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

240

S-PQFP-G240

e0

No

XC4036XLA-09HQ240C by Xilinx

XC4036XLA-09HQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

1296

288

288

1296

22000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

1296 CLBS, 22000 Gates

Can also use 65000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4044XLA-08HQ240C by Xilinx

XC4044XLA-08HQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

1600

320

320

1600

27000

263 MHz

1 ns

CMOS

Field Programmable Gate Arrays

1600 CLBS, 27000 Gates

Can also use 80000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4044XLA-08HQ240I by Xilinx

XC4044XLA-08HQ240I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, HEAT SINK/SLUG, FINE PITCH;

FPGA

1600

320

320

1600

27000

263 MHz

1 ns

CMOS

Field Programmable Gate Arrays

1600 CLBS, 27000 Gates

Can also use 80000 gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

32 mm

32 mm

4.1 mm

HQFP240,1.37SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC4025E-2HQ304C by Xilinx

XC4025E-2HQ304C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 304; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

1024

256

256

1024

15000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 15000 Gates

Max usable 25000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

40 mm

40 mm

4.5 mm

HQFP304,1.7SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

304

S-PQFP-G304

e0

No

XC4036EX-4HQ304C by Xilinx

XC4036EX-4HQ304C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 304; Package Code: HFQFP; Package Shape: SQUARE;

FPGA

1296

288

288

1296

22000

143 MHz

CMOS

Field Programmable Gate Arrays

1296 CLBS, 22000 Gates

Max usable 36000 Logic gates

5

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

40 mm

40 mm

4.5 mm

HQFP304,1.7SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

304

S-PQFP-G304

e0

No

XC4085XLA-08HQ304I by Xilinx

XC4085XLA-08HQ304I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 304; Package Code: HFQFP; Package Shape: SQUARE; Width: 40 mm;

FPGA

7448

256

256

3136

55000

263 MHz

1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Fine Pitch

HFQFP

Square

40 mm

40 mm

4.5 mm

HQFP304,1.7SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

304

S-PQFP-G304

e0

No

XCV100-4CS144C by Xilinx

XCV100-4CS144C

Xilinx

Xilinx XCV100-4CS144C FPGA features 2700 logic cells, 600 CLBs, and 108904 gates. Operating at a max frequency of 250 MHz, it's ideal for applications requiring high-speed processing in electronics and telecommunications industries. With a package style of grid array and thin profile, it offers versatile integration options.

FPGA

2700

94

94

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV100-4CS144I by Xilinx

XCV100-4CS144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.2 mm;

FPGA

2700

94

94

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV50-4CS144I by Xilinx

XCV50-4CS144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 2.625 V;

FPGA

1728

94

94

384

57906

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV50-5CS144C by Xilinx

XCV50-5CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1728

94

94

384

57906

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV50-6CS144C by Xilinx

XCV50-6CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1728

94

94

384

57906

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV100-4BG256C by Xilinx

XCV100-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

180

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV100-4BG256I by Xilinx

XCV100-4BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;

FPGA

2700

180

180

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV100-4FG256C by Xilinx

XCV100-4FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

176

176

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100-4FG256I by Xilinx

XCV100-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B256;

FPGA

2700

176

176

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100-5BG256C by Xilinx

XCV100-5BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

180

600

108904

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV100-5BG256I by Xilinx

XCV100-5BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.5/3.3,2.5;

FPGA

2700

180

180

600

108904

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV100-5FG256C by Xilinx

XCV100-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

176

176

600

108904

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100-5FG256I by Xilinx

XCV100-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Width: 17 mm;

FPGA

2700

176

176

600

108904

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100-6BG256C by Xilinx

XCV100-6BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

180

600

108904

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV100-6FG256C by Xilinx

XCV100-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

176

176

600

108904

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV150-4BG256C by Xilinx

XCV150-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

180

180

864

164674

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV150-4FG256C by Xilinx

XCV150-4FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

176

176

864

164674

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV150-4FG256I by Xilinx

XCV150-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

3888

176

176

864

164674

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV150-5BG256I by Xilinx

XCV150-5BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 164674;

FPGA

3888

180

180

864

164674

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV150-5FG256C by Xilinx

XCV150-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

176

176

864

164674

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV150-5FG256I by Xilinx

XCV150-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 3888;

FPGA

3888

176

176

864

164674

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV150-6BG256C by Xilinx

XCV150-6BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

180

180

864

164674

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV150-6FG256C by Xilinx

XCV150-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

176

176

864

164674

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200-4BG256C by Xilinx

XCV200-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

180

180

1176

236666

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV200-4FG256C by Xilinx

XCV200-4FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

176

176

1176

236666

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200-4FG256I by Xilinx

XCV200-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Width: 17 mm;

FPGA

5292

176

176

1176

236666

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200-5BG256I by Xilinx

XCV200-5BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 180;

FPGA

5292

180

180

1176

236666

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV200-5FG256C by Xilinx

XCV200-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

176

176

1176

236666

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No