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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LFD2NX-17-8MG121C by Lattice Semiconductor

LFD2NX-17-8MG121C

Lattice Semiconductor

LFD2NX-17-8MG121C by Lattice Semiconductor is a 17000 Logic Cells FPGA with FDSOI tech. It has 4250 CLBs, 23 Inputs/Outputs, and operates b/w -40 to 85 °C. Ideal for applications requiring high-density programmable ICs in compact spaces.

FPGA

17000

23

23

4250

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

e1

LFD2NX-17-7MG121I by Lattice Semiconductor

LFD2NX-17-7MG121I

Lattice Semiconductor

LFD2NX-17-7MG121I by Lattice Semiconductor is a 17000 Logic Cells FPGA with FDSOI tech. It operates at 1.05V max, -40 to 100°C temp range, and 0.5mm terminal pitch. Suitable for industrial applications requiring high-density programmable ICs in a compact grid array package style.

FPGA

17000

23

23

4250

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

e1

LFD2NX-17-9MG121C by Lattice Semiconductor

LFD2NX-17-9MG121C

Lattice Semiconductor

Lattice Semiconductor's LFD2NX-17-9MG121C FPGA offers 17000 logic cells, 4250 CLBs, and 23 inputs/outputs. Utilizes FDSOI technology for applications requiring high performance in a compact form factor. Ideal for projects needing a low-power solution with a max supply voltage of 1.05V.

FPGA

17000

23

23

4250

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

e1

LFD2NX-40-8MG121C by Lattice Semiconductor

LFD2NX-40-8MG121C

Lattice Semiconductor

Lattice Semiconductor's LFD2NX-40-8MG121C is a 39000 logic cell FPGA with FDSOI technology. It features 9750 CLBs, 23 inputs/outputs, and operates b/w -40 to 85°C. Ideal for applications requiring high-density programmable ICs in a compact grid array package.

FPGA

39000

23

23

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

e1

LFD2NX-40-7MG121I by Lattice Semiconductor

LFD2NX-40-7MG121I

Lattice Semiconductor

LFD2NX-40-7MG121I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 9750 CLBs, and uses a 0.5 mm terminal pitch. Ideal for industrial applications requiring high-density programmable ICs in a compact grid array package.

FPGA

39000

23

23

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

e1

LIF-MDF6000-6UMG64I by Lattice Semiconductor

LIF-MDF6000-6UMG64I

Lattice Semiconductor

LIF-MDF6000-6UMG64I by Lattice Semiconductor is a 5936 logic cell FPGA with 742 CLBs and 29 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 1.14-1.26V, and features a grid array package for industrial applications.

FPGA

5936

29

29

742

742 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

3.5 mm

3.5 mm

1 mm

BGA64,8X8,16

Bottom

Ball

.4 mm

64

S-PBGA-B64

LIFCL-40-7MG121A by Lattice Semiconductor

LIFCL-40-7MG121A

Lattice Semiconductor

LIFCL-40-7MG121A by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It has 9750 CLBs, operates b/w -40 to 125 °C, and supports automotive applications. The package is a square grid array with 121 ball terminals, 0.5mm pitch, and very thin profile.

FPGA

39000

48

48

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

.5 mm

121

S-PBGA-B121

LCMXO2-4000ZE-1UWG81ITR1K by Lattice Semiconductor

LCMXO2-4000ZE-1UWG81ITR1K

Lattice Semiconductor

LCMXO2-4000ZE-1UWG81ITR1K by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 63 inputs/outputs, 81 terminals, and operates b/w -40 to 85 °C. Ideal for applications requiring a compact GRID ARRAY package with 0.4 mm terminal pitch in electronics design.

FPGA

63

63

1.2

1.14 V

3.6 V

-40 °C (-40 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.797 mm

3.693 mm

.567 mm

BGA81,9X9,16

Bottom

Ball

.4 mm

81

R-PBGA-B81

XCAU10P-2UBVA368I by Xilinx

XCAU10P-2UBVA368I

Xilinx

Xilinx XCAU10P-2UBVA368I FPGA features 96250 logic cells, 5500 CLBs, and 128 inputs/outputs. Ideal for applications requiring high-density programmable ICs in a compact GRID ARRAY package with low supply voltage and wide operating temperature range.

FPGA

96250

128

128

5500

5500 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

11.5 mm

9.5 mm

.692 mm

BGA368,18X22,20

Bottom

Ball

.5 mm

368

R-PBGA-B368

XCAU15P-2UBVA368I by Xilinx

XCAU15P-2UBVA368I

Xilinx

Xilinx XCAU15P-2UBVA368I is a FPGA with 170100 logic cells, 9720 CLBs, and 128 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-density programmable ICs in compact designs.

FPGA

170100

128

128

9720

9720 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

11.5 mm

9.5 mm

.692 mm

BGA368,18X22,20

Bottom

Ball

.5 mm

368

R-PBGA-B368

TI60F225I3 by Efinix

TI60F225I3

Efinix

Efinix TI60F225I3 FPGA features 62016 logic cells, TSMC technology, and 163 inputs/outputs. Ideal for applications requiring low power consumption and high performance in compact designs. Suitable for various industries like telecommunications, automotive, and consumer electronics.

FPGA

62016

163

163

TSMC

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

10 mm

10 mm

1 mm

BGA225,15X15,25

Bottom

Ball

.65 mm

225

S-PBGA-B225