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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6VLX75T-1FF484I by Xilinx

XC6VLX75T-1FF484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6VLX75T-1FF784C by Xilinx

XC6VLX75T-1FF784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX75T-1FFG484C by Xilinx

XC6VLX75T-1FFG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX75T-1FFG484I by Xilinx

XC6VLX75T-1FFG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX75T-1FFG784C by Xilinx

XC6VLX75T-1FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX75T-1FFG784I by Xilinx

XC6VLX75T-1FFG784I

Xilinx

Xilinx XC6VLX75T-1FFG784I FPGA features 74496 logic cells, 360 inputs/outputs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact 29mm square package with grid array style.

FPGA

74496

360

360

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX75T-2FF484C by Xilinx

XC6VLX75T-2FF484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6VLX75T-2FF484I by Xilinx

XC6VLX75T-2FF484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6VLX75T-2FFG484C by Xilinx

XC6VLX75T-2FFG484C

Xilinx

The Xilinx XC6VLX75T-2FFG484C is a CMOS FPGA with 74496 logic cells, 240 inputs/outputs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

74496

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX75T-2FFG484I by Xilinx

XC6VLX75T-2FFG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX75T-2FFG784C by Xilinx

XC6VLX75T-2FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX75T-2FFG784I by Xilinx

XC6VLX75T-2FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX75T-L1FFG484C by Xilinx

XC6VLX75T-L1FFG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VSX315T-1FF1156I by Xilinx

XC6VSX315T-1FF1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VSX315T-1FF1759I by Xilinx

XC6VSX315T-1FF1759I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

720

720

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin Lead

1 mm

1759

S-PBGA-B1759

e0

No

XC6VSX315T-1FFG1156C by Xilinx

XC6VSX315T-1FFG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VSX315T-1FFG1156I by Xilinx

XC6VSX315T-1FFG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VSX315T-1FFG1759C by Xilinx

XC6VSX315T-1FFG1759C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

720

720

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1759

S-PBGA-B1759

e1

No

XC6VSX315T-1FFG1759I by Xilinx

XC6VSX315T-1FFG1759I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

720

720

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1759

S-PBGA-B1759

e1

No

XC6VSX315T-2FF1156I by Xilinx

XC6VSX315T-2FF1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

600

600

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VSX315T-2FF1759C by Xilinx

XC6VSX315T-2FF1759C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

720

720

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin Lead

1 mm

1759

S-PBGA-B1759

e0

No

XC6VSX315T-2FF1759I by Xilinx

XC6VSX315T-2FF1759I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

720

720

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin Lead

1 mm

1759

S-PBGA-B1759

e0

No

XC6VSX315T-2FFG1156C by Xilinx

XC6VSX315T-2FFG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

600

600

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VSX315T-2FFG1156I by Xilinx

XC6VSX315T-2FFG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

600

600

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VSX315T-2FFG1759C by Xilinx

XC6VSX315T-2FFG1759C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

720

720

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1759

S-PBGA-B1759

e1

No

XC6VSX315T-2FFG1759I by Xilinx

XC6VSX315T-2FFG1759I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

720

720

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1759

S-PBGA-B1759

e1

No

XC6VSX315T-L1FFG1759C by Xilinx

XC6VSX315T-L1FFG1759C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

720

720

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1759

S-PBGA-B1759

e1

No

XC6VSX475T-1FF1156I by Xilinx

XC6VSX475T-1FF1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

476160

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VSX475T-1FF1759I by Xilinx

XC6VSX475T-1FF1759I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

476160

840

840

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin Lead

1 mm

1759

S-PBGA-B1759

e0

No

XC6VSX475T-1FFG1156I by Xilinx

XC6VSX475T-1FFG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

476160

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VSX475T-1FFG1759I by Xilinx

XC6VSX475T-1FFG1759I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

476160

840

840

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1759

S-PBGA-B1759

e1

No

XC6VSX475T-2FF1759C by Xilinx

XC6VSX475T-2FF1759C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

476160

840

840

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin Lead

1 mm

1759

S-PBGA-B1759

e0

No

XC6VSX475T-2FFG1156C by Xilinx

XC6VSX475T-2FFG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

476160

600

600

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VSX475T-2FFG1759C by Xilinx

XC6VSX475T-2FFG1759C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

476160

840

840

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1759

S-PBGA-B1759

e1

No

XC6VSX475T-L1FF1156I by Xilinx

XC6VSX475T-L1FF1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

476160

600

600

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VSX475T-L1FF1759I by Xilinx

XC6VSX475T-L1FF1759I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

476160

840

840

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin Lead

1 mm

1759

S-PBGA-B1759

e0

No

XA2S150E-6FT256I by Xilinx

XA2S150E-6FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 182;

FPGA

3888

182

182

864

357 MHz

CMOS

Field Programmable Gate Arrays

864 CLBS

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

AEC-Q100

XA2S150E-6FT256Q by Xilinx

XA2S150E-6FT256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

182

182

864

357 MHz

CMOS

Field Programmable Gate Arrays

864 CLBS

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

AEC-Q100

XA2S200E-6FT256I by Xilinx

XA2S200E-6FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.8;

FPGA

5292

182

182

1176

357 MHz

CMOS

Field Programmable Gate Arrays

1176 CLBS

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

AEC-Q100

XA2S200E-6FT256Q by Xilinx

XA2S200E-6FT256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

182

182

1176

357 MHz

CMOS

Field Programmable Gate Arrays

1176 CLBS

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

AEC-Q100

XA2S300E-6FT256I by Xilinx

XA2S300E-6FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA256,16X16,40;

FPGA

6912

182

182

1536

357 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

AEC-Q100

XA2S300E-6FT256Q by Xilinx

XA2S300E-6FT256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

6912

182

182

1536

357 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

AEC-Q100

XC6SLX100-2FG484C by Xilinx

XC6SLX100-2FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

326

326

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX100-2FG484I by Xilinx

XC6SLX100-2FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

326

326

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX100-2FG676C by Xilinx

XC6SLX100-2FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

480

480

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC6SLX100-2FG676I by Xilinx

XC6SLX100-2FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

480

480

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC6SLX100-2FGG484C by Xilinx

XC6SLX100-2FGG484C

Xilinx

Xilinx XC6SLX100-2FGG484C FPGA features 101261 logic cells, 7911 CLBs, and 326 inputs/outputs. Utilized in applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Ideal for projects demanding versatile programmable ICs in a compact grid array package.

FPGA

101261

326

326

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX100-2FGG484I by Xilinx

XC6SLX100-2FGG484I

Xilinx

Xilinx XC6SLX100-2FGG484I FPGA features 101261 logic cells, 7911 CLBs, and 326 inputs/outputs. Ideal for industrial applications with a max clock frequency of 667 MHz, operating temperature range of -40 to 100 °C, and power supplies at 1.2V and 2.5/3.3V.

FPGA

101261

326

326

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No