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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2V1000-4FF896I by Xilinx

XC2V1000-4FF896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.5,1.5/3.3,3.3;

FPGA

11520

432

432

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2V1000-5FF896I by Xilinx

XC2V1000-5FF896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V;

FPGA

11520

432

432

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2V1500-4FF896I by Xilinx

XC2V1500-4FF896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

17280

528

528

1920

1500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2V1500-5FF896I by Xilinx

XC2V1500-5FF896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;

FPGA

17280

528

528

1920

1500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2V2000-4FF896I by Xilinx

XC2V2000-4FF896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Organization: 2688 CLBS, 2000000 GATES;

FPGA

24192

624

624

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2V2000-5FF896I by Xilinx

XC2V2000-5FF896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

24192

624

624

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP20-6FF896C by Xilinx

XC2VP20-6FF896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

556

556

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP20-6FF896I by Xilinx

XC2VP20-6FF896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

FPGA

20880

556

556

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP7-6FF896C by Xilinx

XC2VP7-6FF896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP7-6FF896I by Xilinx

XC2VP7-6FF896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 1232;

FPGA

11088

396

396

1232

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP20-5FF896C by Xilinx

XC2VP20-5FF896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

556

556

2320

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP20-5FF896I by Xilinx

XC2VP20-5FF896I

Xilinx

The Xilinx XC2VP20-5FF896I is a FPGA with 20880 logic cells, 2320 CLBs, and 556 inputs/outputs. Operating at a max frequency of 1050 MHz, it's ideal for high-speed applications like signal processing and telecommunications due to its advanced CMOS technology and low combinatorial delay of 0.36 ns per CLB.

FPGA

20880

556

556

2320

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP30-5FF896C by Xilinx

XC2VP30-5FF896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

556

556

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP30-5FF896I by Xilinx

XC2VP30-5FF896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

30816

556

556

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP30-6FF896C by Xilinx

XC2VP30-6FF896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

556

556

3424

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP30-6FF896I by Xilinx

XC2VP30-6FF896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V;

FPGA

30816

556

556

3424

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP30-7FF896C by Xilinx

XC2VP30-7FF896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

556

556

3424

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP7-5FF896C by Xilinx

XC2VP7-5FF896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2V1000-4FFG896C by Xilinx

XC2V1000-4FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

1280

1000000

650 MHz

0.44 ns

CMOS

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V1000-4FFG896I by Xilinx

XC2V1000-4FFG896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;

FPGA

1280

1000000

650 MHz

0.44 ns

CMOS

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V1000-5FFG896C by Xilinx

XC2V1000-5FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

1280

1000000

750 MHz

0.39 ns

CMOS

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V1000-6FFG896C by Xilinx

XC2V1000-6FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

1280

1000000

820 MHz

0.35 ns

CMOS

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V1500-4FFG896C by Xilinx

XC2V1500-4FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

1920

1500000

650 MHz

0.44 ns

CMOS

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V1500-6FFG896C by Xilinx

XC2V1500-6FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

1920

1500000

820 MHz

0.35 ns

CMOS

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V2000-4FFG896C by Xilinx

XC2V2000-4FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

624

624

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V2000-5FFG896C by Xilinx

XC2V2000-5FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

624

624

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V2000-5FFG896I by Xilinx

XC2V2000-5FFG896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B896;

FPGA

2688

2000000

750 MHz

0.39 ns

CMOS

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V2000-6FFG896C by Xilinx

XC2V2000-6FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

624

624

2688

2000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2VP20-5FFG896C by Xilinx

XC2VP20-5FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

556

556

2320

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2VP20-5FFG896I by Xilinx

XC2VP20-5FFG896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.5,1.5/3.3,2/2.5,2.5;

FPGA

20880

556

556

2320

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2VP20-6FFG896C by Xilinx

XC2VP20-6FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

556

556

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2VP30-5FFG896C by Xilinx

XC2VP30-5FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

556

556

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2VP30-6FFG896C by Xilinx

XC2VP30-6FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

556

556

3424

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2VP30-6FFG896I by Xilinx

XC2VP30-6FFG896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 30816;

FPGA

30816

556

556

3424

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2VP7-5FFG896C by Xilinx

XC2VP7-5FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2VP7-6FFG896C by Xilinx

XC2VP7-6FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2VP7-7FFG896C by Xilinx

XC2VP7-7FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

5AGXMA5G4F31I5G by Intel

5AGXMA5G4F31I5G

Intel

The Intel 5AGXMA5G4F31I5G is a FPGA with 190,000 logic cells and 7,170 CLBs. It operates at a max supply voltage of 1.13V and has TSMC technology. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

2.7 mm

BGA896,30X30,40

Bottom

Ball

1 mm

896

S-PBGA-B896

5AGXMA5G4F31C4G by Intel

5AGXMA5G4F31C4G

Intel

The Intel 5AGXMA5G4F31C4G is a FPGA with 190,000 logic cells and TSMC technology. It has 7170 CLBs, 544 inputs/outputs, and operates b/w 0-85°C. Ideal for applications requiring high-speed data processing and customizable hardware acceleration in compact designs.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

2.7 mm

BGA896,30X30,40

Bottom

Ball

1 mm

896

S-PBGA-B896

5AGXMA5G4F31I3G by Intel

5AGXMA5G4F31I3G

Intel

The Intel 5AGXMA5G4F31I3G is a Field Programmable Gate Array with 190,000 logic cells and 7170 CLBs. It operates at a max supply voltage of 1.18V and has TSMC technology. Ideal for industrial applications requiring high-performance FPGA solutions in compact form factors.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.15

1.12 V

1.18 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

2.7 mm

BGA896,30X30,40

Bottom

Ball

1 mm

896

S-PBGA-B896

5AGXMA3D4F31C5G by Intel

5AGXMA3D4F31C5G

Intel

Intel's 5AGXMA3D4F31C5G FPGA features 156K logic cells, TSMC technology, and 5890 CLBs. Ideal for applications requiring high-speed processing, such as data centers and telecommunications infrastructure.

FPGA

156000

416

416

5890

TSMC

5890 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

2.7 mm

BGA896,30X30,40

Bottom

Ball

1 mm

896

S-PBGA-B896