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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
EP2AGX45DF25C6G by Intel

EP2AGX45DF25C6G

Intel

EP2AGX45DF25C6G by Intel is a FPGA with 42959 logic cells, 1805 CLBs, and 260 inputs/outputs. It operates b/w -40 to 85°C and has a package style of grid array. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

42959

260

260

1805

1805 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

25 mm

25 mm

2.15 mm

BGA572,24X24,40

Bottom

Ball

1 mm

572

S-PBGA-B572

EP2AGX45DF25I5G by Intel

EP2AGX45DF25I5G

Intel

EP2AGX45DF25I5G by Intel is a FPGA with 42959 logic cells, 1805 CLBs, and 260 inputs/outputs. It operates b/w -40 to 100°C, with a supply voltage range of 0.87V to 0.93V. This versatile device in a square package is ideal for applications requiring high-speed data processing and programmable logic capabilities.

FPGA

42959

260

260

1805

1805 CLBS

0.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

25 mm

25 mm

2.15 mm

BGA572,24X24,40

Bottom

Ball

1 mm

572

S-PBGA-B572

EP2AGX45DF25C4G by Intel

EP2AGX45DF25C4G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 572; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

42959

260

260

1805

1805 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

25 mm

25 mm

2.15 mm

BGA572,24X24,40

Bottom

Ball

1 mm

572

S-PBGA-B572