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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC5VLX20T-1FF323C by Xilinx

XC5VLX20T-1FF323C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 323; Package Code: BGA; Package Shape: SQUARE;

FPGA

19968

172

172

1560

0.9 ns

CMOS

Field Programmable Gate Arrays

1560 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA323,18X18,40

Bottom

Ball

Tin Lead

1 mm

323

S-PBGA-B323

e0

No

XC5VLX20T-1FF323I by Xilinx

XC5VLX20T-1FF323I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 323; Package Code: BGA; Package Shape: SQUARE;

FPGA

19968

172

172

1560

0.9 ns

CMOS

Field Programmable Gate Arrays

1560 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA323,18X18,40

Bottom

Ball

Tin Lead

1 mm

323

S-PBGA-B323

e0

No

XC5VLX20T-1FFG323C by Xilinx

XC5VLX20T-1FFG323C

Xilinx

Xilinx XC5VLX20T-1FFG323C FPGA features 19968 logic cells, 1560 CLBs, and 172 inputs/outputs. Utilized in applications requiring high-speed processing with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.

FPGA

19968

172

172

1560

0.9 ns

CMOS

Field Programmable Gate Arrays

1560 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA323,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

323

S-PBGA-B323

e1

No

XC5VLX20T-1FFG323I by Xilinx

XC5VLX20T-1FFG323I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 323; Package Code: BGA; Package Shape: SQUARE;

FPGA

19968

172

172

1560

0.9 ns

CMOS

Field Programmable Gate Arrays

1560 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA323,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

323

S-PBGA-B323

e1

No

XC5VLX20T-2FFG323C by Xilinx

XC5VLX20T-2FFG323C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 323; Package Code: BGA; Package Shape: SQUARE;

FPGA

19968

172

172

1560

0.77 ns

CMOS

Field Programmable Gate Arrays

1560 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA323,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

323

S-PBGA-B323

e1

No

XC5VLX30T-1FF323C by Xilinx

XC5VLX30T-1FF323C

Xilinx

Xilinx XC5VLX30T-1FF323C FPGA features 30720 logic cells, 2400 CLBs, and 172 inputs/outputs. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor. Operating temperature range of 0-85°C makes it suitable for various industrial and commercial projects.

FPGA

30720

172

172

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA323,18X18,40

Bottom

Ball

Tin Lead

1 mm

323

S-PBGA-B323

e0

No

XC5VLX30T-1FF323I by Xilinx

XC5VLX30T-1FF323I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 323; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

172

172

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA323,18X18,40

Bottom

Ball

Tin Lead

1 mm

323

S-PBGA-B323

e0

No

XC5VLX30T-1FFG323C by Xilinx

XC5VLX30T-1FFG323C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 323; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

172

172

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA323,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

323

S-PBGA-B323

e1

No

XC5VLX30T-1FFG323I by Xilinx

XC5VLX30T-1FFG323I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 323; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

172

172

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA323,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

323

S-PBGA-B323

e1

No

XC5VLX30T-2FF323I by Xilinx

XC5VLX30T-2FF323I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 323; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

172

172

2400

0.77 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA323,18X18,40

Bottom

Ball

Tin Lead

1 mm

323

S-PBGA-B323

e0

No