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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
1SD280PT1F55I1VG by Intel

1SD280PT1F55I1VG

Intel

1SD280PT1F55I1VG by Intel is a Field Programmable Gate Array (FPGA) with 2.8M logic cells, 816 inputs/outputs, and operates in industrial temperature range (-40 to 100°C). It features a square package style with ball terminals suitable for surface mount applications.

FPGA

2800000

816

816

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

55 mm

55 mm

3.881 mm

BGA2912,54X54,40

Bottom

Ball

1 mm

2912

S-PBGA-B2912

1ST280EY2F55E1VG by Intel

1ST280EY2F55E1VG

Intel

The Intel 1ST280EY2F55E1VG FPGA features 2800000 logic cells, 350000 CLBs, and 296 inputs/outputs. Ideal for applications requiring high-performance programmable ICs in a square package with a grid array style, suitable for surface mount assembly.

FPGA

2800000

296

296

350000

350000 CLBS

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

55 mm

55 mm

3.881 mm

BGA2912,54X54,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

2912

S-PBGA-B2912

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