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488 Other Function uPs,uCs & Peripheral ICs 7

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX7D5EVK10SD by NXP Semiconductors

MCIMX7D5EVK10SD

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.2 V;

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3DVK10SC by NXP Semiconductors

MCIMX7D3DVK10SC

NXP Semiconductors

MCIMX7D3DVK10SC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage ranging from 1.045-1.25 V. With 488 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3EVK10SC by NXP Semiconductors

MCIMX7D3EVK10SC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D2DVK12SD by NXP Semiconductors

MCIMX7D2DVK12SD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

85 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3DVK10SD by NXP Semiconductors

MCIMX7D3DVK10SD

NXP Semiconductors

MCIMX7D3DVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating at 0-95°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring thin profile, fine pitch grid arrays in plastic/epoxy packages.

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3EVK10SD by NXP Semiconductors

MCIMX7D3EVK10SD

NXP Semiconductors

MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D7DVK10SD by NXP Semiconductors

MCIMX7D7DVK10SD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP