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MICROPROCESSOR Microprocessors 124

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan CPU Family Maximum Clock Frequency DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width Peripheral IC Type Data EEPROM Size Connectivity
S9S08RNA8W2VTGR by NXP Semiconductors

S9S08RNA8W2VTGR

NXP Semiconductors

MICROPROCESSOR; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;

e3

3

260

TIN

40

MICROPROCESSOR

S9S08RNA8W2VTG by NXP Semiconductors

S9S08RNA8W2VTG

NXP Semiconductors

MICROPROCESSOR; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;

e3

3

260

TIN

40

MICROPROCESSOR

S9S08RNA8W2VTJ by NXP Semiconductors

S9S08RNA8W2VTJ

NXP Semiconductors

MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;

e3

3

260

TIN

40

MICROPROCESSOR

FS32R274KSK2MMMR by NXP Semiconductors

FS32R274KSK2MMMR

NXP Semiconductors

MICROPROCESSOR; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40;

e2

3

260

TIN SILVER

40

MICROPROCESSOR

T1023NXE7PQA by NXP Semiconductors

T1023NXE7PQA

NXP Semiconductors

The NXP Semiconductors T1023NXE7PQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications requiring high-speed processing with low power consumption. Package style is grid array with fine pitch terminals for compact design.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSN7KQA by NXP Semiconductors

T1023NSN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7KQA by NXP Semiconductors

T1023NXN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7MQA by NXP Semiconductors

T1023NXN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXE7KQA by NXP Semiconductors

T1023NXE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXE7MQA by NXP Semiconductors

T1023NXE7MQA

NXP Semiconductors

The NXP Semiconductors T1023NXE7MQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with low power mode support. With a package style of grid array and fine pitch, it offers 525 terminals for versatile connectivity.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSE7MQA by NXP Semiconductors

T1013NSE7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSN7KQA by NXP Semiconductors

T1013NSN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSN7MQA by NXP Semiconductors

T1013NSN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7PQA by NXP Semiconductors

T1023NXN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSE7KQA by NXP Semiconductors

T1013NSE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSN7PQA by NXP Semiconductors

T1013NSN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7KQA by NXP Semiconductors

T1013NXE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7MQA by NXP Semiconductors

T1013NXE7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7PQA by NXP Semiconductors

T1013NXE7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSN7PQA by NXP Semiconductors

T1023NSN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSE7PQA by NXP Semiconductors

T1023NSE7PQA

NXP Semiconductors

The NXP Semiconductors T1023NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. Ideal for applications requiring high-speed processing, it operates b/w 0 to 105°C with low power mode support.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSE7KQA by NXP Semiconductors

T1023NSE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7PQA by NXP Semiconductors

T1013NXN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7MQA by NXP Semiconductors

T1013NXN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7KQA by NXP Semiconductors

T1013NXN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSE7PQA by NXP Semiconductors

T1013NSE7PQA

NXP Semiconductors

The NXP Semiconductors T1013NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. It is designed for applications requiring high-speed processing and low power consumption, with integrated cache memory and support for boundary scan testing.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSN7MQA by NXP Semiconductors

T1023NSN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

AD21489WBCPZ4202 by Analog Devices

AD21489WBCPZ4202

Analog Devices

AD21489WBCPZ4202 by Analog Devices is a 40-bit microprocessor with 24-bit address bus width and 16-bit external data bus width. It features integrated cache, operates at speeds up to 400 rpm, and has a max supply current of 500 mA. Ideal for applications requiring high-speed processing in automotive electronics and industrial control systems.

24

40

YES

16

FLOATING POINT

YES

S-XQCC-N88

12 mm

NO

65

3

88

1

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC88,.47SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5242880

AEC-Q100

.9 mm

400 rpm

500 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

NO LEAD

.5 mm

QUAD

12 mm

MICROPROCESSOR