Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Add filters
All
Selected
Z8018010PSG
IXYS Corporation
Z8018010PSG by IXYS Corp is an 8-bit microprocessor with 20-bit address bus, operating at 10 rpm. It features a supply voltage range of 4.5-5.5 V and operates in low power mode. Ideal for commercial applications requiring a CMOS technology-based microprocessor with 64 terminals and external data bus width of 8 bits.
DYNAMIC REFRESH CONTROL; 1M BYTE PHYSICAL MEMORY
20
8
NO
FIXED POINT
R-PDIP-T64
e3
57.785 mm
YES
2
3
64
70 Cel
0 Cel
PLASTIC/EPOXY
SDIP
SDIP64,.75
RECTANGULAR
IN-LINE, SHRINK PITCH
Not Qualified
5.01 mm
10 rpm
60 mA
5.5 V
4.5 V
5 V
CMOS
COMMERCIAL
MATTE TIN
THROUGH-HOLE
1.778 mm
DUAL
19.05 mm
MICROPROCESSOR
Z8018010FSG
IXYS Corporation's Z8018010FSG is an 8-bit microprocessor with 20-bit address bus width and external data bus width of 8. It operates at a speed of 10 rpm, suitable for low power mode applications in commercial temperature grade environments.
R-PQFP-G80
20 mm
80
QFP
FLATPACK
3.1 mm
GULL WING
.8 mm
QUAD
14 mm
Z84C0006PEG
Z84C0006PEG by IXYS Corp is an 8-bit microprocessor with 16-bit address bus width, operating at a max clock frequency of 6.17 MHz. It is used in industrial applications due to its CMOS technology, low power mode, and wide temperature range from -40°C to 100°C.
DRAM REFRESH COUNTER
16
6.17 MHz
R-PDIP-T40
52.325 mm
0
40
100 Cel
-40 Cel
DIP
IN-LINE
4.75 mm
6.17 rpm
30 mA
INDUSTRIAL
2.54 mm
15.24 mm
Z84C0008PEG
Z84C0008PEG by IXYS Corp is an 8-bit microprocessor with 16-bit address bus, operating at max 8 MHz clock frequency. Ideal for industrial applications, it has a supply voltage range of 4.5-5.5 V and operates in temperature range -40 to 100 °C.
8 MHz
8 rpm
40 mA
Z84C0010PEG
Z84C0010PEG by IXYS Corp is an 8-bit microprocessor with 16-bit address bus, operating at max 10 MHz. It has a supply voltage range of 4.5-5.5 V and temp range of -40 to 100 °C. Ideal for industrial applications requiring low power consumption and fixed-point processing in a compact IN-LINE package style.
10 MHz
50 mA
Z84C0006VEG
Z84C0006VEG by IXYS Corp is an 8-bit microprocessor with 16-bit address bus, operating at max 6.17 MHz clock frequency. Suitable for industrial applications, it features low power mode and operates b/w -40 to 100 °C temperature range.
DRAM MEMORY REFRESH COUNTER
S-PQCC-J44
16.5862 mm
44
QCCJ
LDCC44,.7SQ
SQUARE
CHIP CARRIER
260
5
4.57 mm
Microprocessors
Matte Tin (Sn)
J BEND
1.27 mm
Z84C0008VEG
Z84C0008VEG by IXYS Corp is an 8-bit microprocessor with 16-bit address bus, operating at a max frequency of 8 MHz. It is used in industrial applications and supports low power mode.
Z84C0010VEG
Z84C0010VEG by IXYS Corp is an 8-bit microprocessor with 16-bit address bus, operating at max 10 MHz. It has a supply voltage range of 4.5-5.5 V and operates in industrial temperature grade. Ideal for low power applications requiring fixed point format and external data bus width of 8 bits.
ADSP-21489KCPZ-4
Analog Devices
ADSP-21489KCPZ-4 by Analog Devices is a 40-bit microprocessor with 24-bit address bus width, 16-bit external data bus width, and 5242880 RAM words. It operates at speeds up to 400 rpm and is ideal for industrial applications requiring high-speed processing in a compact form factor. With features like integrated cache, boundary scan support, and low supply voltage requirements, it offers efficient performance for various embedded systems.
24
FLOATING POINT
S-XQCC-N88
12 mm
65
88
1
115 Cel
UNSPECIFIED
HVQCCN
LCC88,.47SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
5242880
.9 mm
400 rpm
500 mA
1.15 V
1.05 V
1.1 V
NO LEAD
.5 mm
30
MPC8535AVJANGA
NXP Semiconductors
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;
32
S-PBGA-B783
e2
29 mm
783
90 Cel
BGA
GRID ARRAY
2.76 mm
800 rpm
.95 V
1 V
OTHER
TIN SILVER
BALL
1 mm
BOTTOM
MPC8535BVJANGA
105 Cel
FS32R274KBK2MMM
MICROPROCESSOR; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08RN16W2MLFR
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;
TIN
S9S08RN16W2MTJR
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Terminal Finish: TIN;
S9S08RN48W1MLCR
MICROPROCESSOR; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN;
S9S08RN8W2MTGR
MICROPROCESSOR; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MPC8572CLVJAULE
MICROPROCESSOR; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e2;
245
MPC8572LVJAULE
MICROPROCESSOR; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 245; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 30;
MPC8572LVJAVNE
MICROPROCESSOR; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
MPC8572VJATLE
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 245; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER;
MPC8572VJAULE
MICROPROCESSOR; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
MPC8572VJAVNE
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 245;
S9S08RN16W2VLC
MICROPROCESSOR; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
S9S08RN16W2VTG
MICROPROCESSOR; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
S9S08RN16W2VTJR
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
S9S08RN16W2VTJ
MICROPROCESSOR; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08RNA16W2MLCR
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
S9S08RNA16W2MLC
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08RNA16W2MLF
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Terminal Finish: TIN;
S9S08RNA16W2MTGR
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
S9S08RNA16W2MTG
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
S9S08RNA16W2MTJR
MICROPROCESSOR; Terminal Finish: TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
S9S08RNA16W2MTJ
MICROPROCESSOR; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;
S9S08RNA16W2VLCR
MICROPROCESSOR; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
S9S08RNA16W2VLC
S9S08RNA16W2VTGR
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Terminal Finish: TIN;
S9S08RNA16W2VTG
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
S9S08RNA16W2VTJR
MICROPROCESSOR; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08RNA16W2VTJ
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3;
S9S08RNA8W2CLFR
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3;
S9S08RNA8W2CTJR
MICROPROCESSOR; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08RNA8W2CTJ
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08RNA8W2MLC
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
S9S08RNA8W2MLF
MICROPROCESSOR; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
S9S08RNA8W2MTGR
MICROPROCESSOR; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
S9S08RNA8W2MTG
S9S08RNA8W2MTJ
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;
S9S08RNA8W2VLC
MICROPROCESSOR; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
© 2023 All rights reserved
