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HBGA Microcontrollers 6

Microcontrollers
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors Digital To Analog Convertors
TC1797512F180EFACKXUMA1 by Infineon Technologies

TC1797512F180EFACKXUMA1

Infineon Technologies

Infineon's TC1797512F180EFACKXUMA1 microcontroller features 32-bit address and external data bus width, with a max clock frequency of 90 MHz. Ideal for automotive applications, it offers 416 terminals in a grid array package style, operating b/w -40 to 125 °C temperature range.

YES

32

32

90 MHz

NO

YES

32

S-PBGA-B416

27 mm

221

416

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

NOT SPECIFIED

FLASH

2.4 mm

180 rpm

1.58 V

1.42 V

1.5 V

YES

CMOS

AUTOMOTIVE

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

MICROCONTROLLER, RISC

SPC5674FAMVY3R by NXP Semiconductors

SPC5674FAMVY3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: HBGA; Package Shape: SQUARE;

YES

MS-034AAL-1

0

32

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

FLASH

2.55 mm

270 rpm

5.5 V

4.5 V

5 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

TC1796256F150EBEKDUMA2 by Infineon Technologies

TC1796256F150EBEKDUMA2

Infineon Technologies

Infineon's TC1796256F150EBEKDUMA2 microcontroller features 32-bit architecture, 24-bit address bus, and 40 MHz clock frequency. Ideal for automotive applications, it offers 16 ADC channels, 128K data EEPROM size, and connectivity options like CAN and Ethernet.

YES

24

32

40 MHz

NO

YES

32

S-PBGA-B416

e1

27 mm

3

127

416

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

65536

2097152

FLASH

2.5 mm

150 rpm

1.58 V

1.42 V

1.5 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

1 mm

BOTTOM

27 mm

MICROCONTROLLER

128K

ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)

DMA(16), TIMER(2)

16 Ch 12-Bit(2), FADC 4 Ch 10-Bit

TC1796256F150EBEKXUMA2 by Infineon Technologies

TC1796256F150EBEKXUMA2

Infineon Technologies

Infineon Technologies' TC1796256F150EBEKXUMA2 microcontroller features 32-bit architecture, 24-bit address bus width, and 40 MHz clock frequency. Ideal for automotive applications with connectivity options like CAN, ETHERNET, and MSC. Operating temperature ranges from -40 to 125 °C.

YES

24

32

40 MHz

NO

YES

32

S-PBGA-B416

27 mm

3

127

416

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

65536

2097152

FLASH

2.5 mm

150 rpm

1.58 V

1.42 V

1.5 V

YES

CMOS

AUTOMOTIVE

BALL

1 mm

BOTTOM

30

27 mm

MICROCONTROLLER

128K

ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)

DMA(16), TIMER(2)

16 Ch 12-Bit(2), FADC 4 Ch 10-Bit

SPC5674FAMVR3R by NXP Semiconductors

SPC5674FAMVR3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: HBGA; Package Shape: SQUARE;

YES

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

262144

4194304

FLASH

2.55 mm

264 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(4), SCI(3), SPI(4)

DMA(96), POR, PWM(32), TIMER(64)

64-Ch 12-Bit

SPC5674FAMVR3 by NXP Semiconductors

SPC5674FAMVR3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: HBGA; Package Shape: SQUARE;

YES

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

262144

4194304

FLASH

2.55 mm

264 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(4), SCI(3), SPI(4)

DMA(96), POR, PWM(32), TIMER(64)

64-Ch 12-Bit