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NXP Semiconductors FIFO 14

FIFO
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Maximum Clock Frequency (fCLK) Cycle Time JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Moisture Sensitivity Level (MSL) No. of Functions No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Output Enable Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Qualification Screening Level Maximum Seated Height Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
74HC7403D-Q100,518 by NXP Semiconductors

74HC7403D-Q100,518

NXP Semiconductors

74HC7403D-Q100,518 by NXP is a CMOS FIFO memory with a 64x4 organization, operating asynchronously at up to 12 MHz. It features a wide temperature range from -40 °C to 125 °C and supports automotive applications with AEC-Q100 screening. This compact, surface-mount device ensures efficient data handling in demanding environments.

98 ns

12 MHz

R-PDSO-G16

OTHER FIFO

4

2

16

64 words

64

ASYNCHRONOUS

125 Cel

-40 Cel

64X4

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

260

2/6

Not Qualified

AEC-Q100

FIFOs

1 mA

YES

CMOS

AUTOMOTIVE

GULL WING

1.27 mm

DUAL

30

74HC40105DB,118 by NXP Semiconductors

74HC40105DB,118

NXP Semiconductors

FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

600 ns

71.428 ns

R-PDSO-G16

e4

6.2 mm

64 bit

4

1

1

16

16 words

16

ASYNCHRONOUS

125 Cel

-40 Cel

16X4

YES

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

PARALLEL

260

Not Qualified

2 mm

6 V

2 V

4.5

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.65 mm

DUAL

30

5.3 mm

74HC7030D,652 by NXP Semiconductors

74HC7030D,652

NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2 V;

104 ns

REGISTER BASED; BUBBLE BACK 3US

9.2 MHz

108.7 ns

R-PDSO-G28

e4

17.9 mm

576 bit

OTHER FIFO

9

1

1

28

64 words

64

ASYNCHRONOUS

125 Cel

-40 Cel

64X9

3-STATE

YES

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

PARALLEL

260

2/6

Not Qualified

2.65 mm

FIFOs

1 mA

6 V

2 V

5

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

1.27 mm

DUAL

30

7.5 mm

74HC7030D,653 by NXP Semiconductors

74HC7030D,653

NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;

104 ns

REGISTER BASED; BUBBLE BACK 3US

9.2 MHz

108.7 ns

R-PDSO-G28

e4

17.9 mm

576 bit

OTHER FIFO

9

1

1

28

64 words

64

ASYNCHRONOUS

125 Cel

-40 Cel

64X9

3-STATE

YES

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

PARALLEL

260

2/6

Not Qualified

2.65 mm

FIFOs

1 mA

6 V

2 V

5

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

1.27 mm

DUAL

30

7.5 mm

74HC7030N,652 by NXP Semiconductors

74HC7030N,652

NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

104 ns

REGISTER BASED; BUBBLE BACK 3US

9.2 MHz

108.7 ns

R-PDIP-T28

e3

35.5 mm

576 bit

OTHER FIFO

9

1

28

64 words

64

ASYNCHRONOUS

125 Cel

-40 Cel

64X9

3-STATE

YES

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

PARALLEL

2/6

Not Qualified

5.1 mm

FIFOs

1 mA

6 V

2 V

5

NO

CMOS

AUTOMOTIVE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

15.24 mm

74HC7403D,518 by NXP Semiconductors

74HC7403D,518

NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Current: 1 mA;

98 ns

REGISTER BASED; BUBBLE BACK 2.7US

12 MHz

83.33 ns

R-PDSO-G16

e4

10.3 mm

256 bit

OTHER FIFO

4

1

1

16

64 words

64

ASYNCHRONOUS

125 Cel

-40 Cel

64X4

3-STATE

YES

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

PARALLEL

2/6

Not Qualified

2.65 mm

FIFOs

1 mA

6 V

2 V

5

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

7.5 mm

74HCT40105D,112 by NXP Semiconductors

74HCT40105D,112

NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

120 ns

REGISTER BASED; BUBBLE BACK 750NS

31 MHz

100 ns

R-PDSO-G16

e4

9.9 mm

64 bit

OTHER FIFO

4

1

1

16

16 words

16

ASYNCHRONOUS

125 Cel

-40 Cel

16X4

3-STATE

YES

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

PARALLEL

5

Not Qualified

1.75 mm

FIFOs

5.5 V

4.5 V

5

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

74HCT40105D,118 by NXP Semiconductors

74HCT40105D,118

NXP Semiconductors

FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words Code: 16;

120 ns

REGISTER BASED; BUBBLE BACK 750NS

100 ns

R-PDSO-G16

e4

9.9 mm

64 bit

4

1

1

16

16 words

16

ASYNCHRONOUS

125 Cel

-40 Cel

16X4

3-STATE

YES

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

PARALLEL

260

Not Qualified

1.75 mm

5.5 V

4.5 V

5

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

1.27 mm

DUAL

30

3.9 mm

74HCT40105N,112 by NXP Semiconductors

74HCT40105N,112

NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;

120 ns

REGISTER BASED; BUBBLE BACK 750NS

31 MHz

100 ns

R-PDIP-T16

e4

21.6 mm

64 bit

OTHER FIFO

4

1

16

16 words

16

ASYNCHRONOUS

125 Cel

-40 Cel

16X4

3-STATE

YES

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

PARALLEL

5

Not Qualified

4.7 mm

FIFOs

5.5 V

4.5 V

5

NO

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

74HCT7030D,112 by NXP Semiconductors

74HCT7030D,112

NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 64X9;

117 ns

REGISTER BASED; BUBBLE BACK 3US

10 MHz

116.28 ns

R-PDSO-G28

e4

17.9 mm

576 bit

OTHER FIFO

9

1

1

28

64 words

64

ASYNCHRONOUS

125 Cel

-40 Cel

64X9

3-STATE

YES

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

PARALLEL

260

5

Not Qualified

2.65 mm

FIFOs

5.5 V

4.5 V

5

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

7.5 mm

74HCT7030D,118 by NXP Semiconductors

74HCT7030D,118

NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 576 bit;

117 ns

REGISTER BASED; BUBBLE BACK 3US

10 MHz

116.28 ns

R-PDSO-G28

e4

17.9 mm

576 bit

OTHER FIFO

9

1

1

28

64 words

64

ASYNCHRONOUS

125 Cel

-40 Cel

64X9

3-STATE

YES

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

PARALLEL

260

5

Not Qualified

2.65 mm

FIFOs

5.5 V

4.5 V

5

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

7.5 mm

74HCT7030N,112 by NXP Semiconductors

74HCT7030N,112

NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 10 MHz;

117 ns

REGISTER BASED; BUBBLE BACK 3US

10 MHz

116.28 ns

R-PDIP-T28

e3

35.5 mm

576 bit

OTHER FIFO

9

1

28

64 words

64

ASYNCHRONOUS

125 Cel

-40 Cel

64X9

3-STATE

YES

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

PARALLEL

5

Not Qualified

5.1 mm

FIFOs

5.5 V

4.5 V

5

NO

CMOS

AUTOMOTIVE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

15.24 mm

74HCT7403D,512 by NXP Semiconductors

74HCT7403D,512

NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 83.33 ns;

108 ns

REGISTER BASED; BUBBLE BACK 2.7US

12 MHz

83.33 ns

R-PDSO-G16

e4

10.3 mm

256 bit

OTHER FIFO

4

1

1

16

64 words

64

ASYNCHRONOUS

125 Cel

-40 Cel

64X4

3-STATE

YES

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

PARALLEL

5

Not Qualified

2.65 mm

FIFOs

1 mA

5.5 V

4.5 V

5

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

7.5 mm

74HCT7403D,518 by NXP Semiconductors

74HCT7403D,518

NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Current: 1 mA;

108 ns

REGISTER BASED; BUBBLE BACK 2.7US

12 MHz

83.33 ns

R-PDSO-G16

e4

10.3 mm

256 bit

OTHER FIFO

4

1

1

16

64 words

64

ASYNCHRONOUS

125 Cel

-40 Cel

64X4

3-STATE

YES

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

PARALLEL

5

Not Qualified

2.65 mm

FIFOs

1 mA

5.5 V

4.5 V

5

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

7.5 mm