Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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XC17S30AVO8C
Xilinx
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
COMMON
R-PDSO-G8
e0
4.9 mm
336768 bit
CONFIGURATION MEMORY
1
3
8
336768 words
336768
SYNCHRONOUS
70 Cel
0 Cel
336768X1
3-STATE
PLASTIC/EPOXY
TSOP2
SOP8,.25
RECTANGULAR
SMALL OUTLINE, THIN PROFILE
SERIAL
225
3.3
Not Qualified
1.2 mm
.00005 Amp
OTP ROMs
5 mA
3.6 V
3 V
YES
CMOS
COMMERCIAL
Tin/Lead (Sn85Pb15)
GULL WING
1.27 mm
DUAL
30
3.9 mm
XC17S30AVO8I
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
85 Cel
-40 Cel
INDUSTRIAL
XC17S50APD8C
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
R-PDIP-T8
9.3599 mm
559200 bit
559200 words
559200
559200X1
DIP
DIP8,.3
IN-LINE
4.5974 mm
.001 Amp
15 mA
NO
THROUGH-HOLE
2.54 mm
7.62 mm
XC17S50APD8I
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
XC17S50ASO20C
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G20;
R-PDSO-G20
12.8 mm
20
SOP
SOP20,.4
SMALL OUTLINE
2.65 mm
7.5 mm
XC17S50ASO20I
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP20,.4;
XC17S50AVO8C
The Xilinx XC17S50AVO8C is a 3.3V EEPROM with 559200-bit memory density, operating in synchronous mode. It features a small outline package and Gull Wing terminals, suitable for configuration memory applications. With a max temperature of 70°C, it offers 3-STATE output characteristics and consumes up to 15mA supply current.
XC17S50AVO8I
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
AT18F010-30XU
Atmel
Atmel's AT18F010-30XU is a 1MX1 EEPROM with 1048576 bit memory density. It operates at 3.3V, has a clock frequency of 33 MHz, and supports synchronous mode. Ideal for industrial applications, it offers 100000 Write/Erase cycles endurance in a small outline package with 0.65mm terminal pitch.
33 MHz
100000 Write/Erase Cycles
6.5 mm
1048576 bit
1048576 words
1M
1MX1
TSSOP
TSSOP20,.25
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
EEPROMs
10 mA
.65 mm
4.4 mm
XQ18V04VQ44N
CONFIGURATION MEMORY; Temperature Grade: MILITARY; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE; Maximum Seated Height: 1.2 mm;
20 MHz
10
20000 Write/Erase Cycles
S-PQFP-G44
10 mm
4194304 bit
44
524288 words
512K
125 Cel
-55 Cel
512KX8
TQFP
TQFP44,.47SQ,32
SQUARE
FLATPACK, THIN PROFILE
PARALLEL/SERIAL
240
2.5/3.3
.02 Amp
Flash Memories
50 mA
MILITARY
.8 mm
QUAD
40k Rad(Si)
NOR TYPE
AT17LV010A-10PI
AT17LV010A-10PI by Atmel is a 1MX1 EEPROM with 1048576 bit memory density. It operates at 10 MHz clock frequency and has a max supply voltage of 3.6 V. Ideal for industrial applications requiring configuration memory in synchronous mode with hardware write protection.
ALSO OPERATES AT 5V SUPPLY
10 MHz
9.271 mm
3.3/5
5.334 mm
TIN LEAD
HARDWARE
XCCACE128-I
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 50; Package Shape: RECTANGULAR; Technology: CMOS; Operating Mode: SYNCHRONOUS;
R-XXMA-X50
42.8 mm
134217728 bit
16
50
8388608 words
8M
60 Cel
8MX16
UNSPECIFIED
MICROELECTRONIC ASSEMBLY
3.3 mm
36 mm
AT17LV010-10PI
AT17LV010-10PI by Atmel is a 1MX1 EEPROM with 1048576 bit memory density. It operates at 3.3V, has a clock frequency of 10 MHz, and offers 100000 Write/Erase cycles. Ideal for industrial applications requiring configuration memory with hardware write protection and synchronous operation.
IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
90
.0001 Amp
XC17S15ASO20I
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .00005 Amp;
197696 bit
197696 words
197696
197696X1
XCF01SVO20C
Xilinx XCF01SVO20C is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers 20000 Write/Erase Cycles endurance and supports NOR type technology. Ideal for industrial applications requiring configuration memory in a small outline package.
IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
6.5024 mm
1.8/3.3,3
1.19 mm
XCF02SVO20C
Xilinx XCF02SVO20C is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers 20000 write/erase cycles and supports industrial temperature grade applications. With a small outline package style, it is ideal for configuration memory in devices requiring low standby current and high endurance.
2097152 bit
2097152 words
2M
2MX1
1.8/3.3,3.3
XCF04SVO20C
Xilinx XCF04SVO20C is a 3.3V EEPROM with 4MX1 organization, NOR type, and 33MHz clock frequency. Ideal for industrial applications, it offers 4194304-bit memory density in a small outline package with dual terminals and Gull Wing form factor.
4194304 words
4M
4MX1
XCF08PFS48C
Xilinx XCF08PFS48C is a 1.8V EEPROM with 8388608-bit memory density, suitable for industrial applications. It operates synchronously at up to 33MHz clock frequency and offers 20000 write/erase cycles. With a compact rectangular package style and thin profile, it's ideal for space-constrained designs requiring reliable configuration memory.
R-PBGA-B48
9 mm
8388608 bit
48
8MX1
TFBGA
BGA48,6X8,32
GRID ARRAY, THIN PROFILE, FINE PITCH
1.5/3.3,1.8
40 mA
2 V
1.65 V
1.8
BALL
BOTTOM
8 mm
XCF08PVO48C
Xilinx XCF08PVO48C is a 1.8V EEPROM with 8388608-bit memory density, operating at up to 33MHz clock frequency. Ideal for industrial applications, it offers 20000 write/erase cycles and features a small outline package style.
R-PDSO-G48
18.45 mm
TSSOP48,.8,20
.5 mm
12 mm
XCF16PFS48C
Xilinx XCF16PFS48C is a 1.8V EEPROM with 16MX1 organization and 16777216 bit memory density. It operates in synchronous mode and has a max supply current of 40mA. This configuration memory is commonly used in industrial applications for storing data with endurance of 20000 write/erase cycles.
16777216 bit
16777216 words
16M
16MX1
XCF32PFS48C
Xilinx XCF32PFS48C is a 32MX1 EEPROM with 33554432-bit memory density. It operates at 1.8V, has 48 terminals, and supports industrial temperature grade. Ideal for configuration memory applications, it offers 20000 write/erase cycles and serial interface with NOR type technology.
33554432 bit
33554432 words
32M
32MX1
XC18V02PC44C0936
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Terminal Form: J BEND;
20 ns
S-PQCC-J44
16.5862 mm
262144 words
256K
256KX8
QCCJ
CHIP CARRIER
4.572 mm
J BEND
XCF01SVOG20C
The Xilinx XCF01SVOG20C is a 1MX1 NOR type EEPROM with a memory density of 1048576 bits. It operates at a nominal voltage of 3.3V and has an endurance of 20000 write/erase cycles. This configuration memory is commonly used in industrial applications for storing and retrieving data efficiently.
e3
260
Matte Tin (Sn)
XCF02SVOG20C
Xilinx XCF02SVOG20C is a 2MX1 NOR EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers 20000 write/erase cycles and supports industrial temperature grade applications. With a small outline package style, 0.65mm terminal pitch, and Gull Wing terminals, it's ideal for configuration memory needs in various electronic devices.
XCF08PFSG48C
Xilinx XCF08PFSG48C is a 1.8V EEPROM with 8MX1 organization, NOR type, and 8388608-bit memory density. It operates at -40 to 85°C for industrial applications, featuring a max clock frequency of 33 MHz in a thin profile grid array package.
e2
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
XCF08PVOG48C
Xilinx XCF08PVOG48C is a 1.8V EEPROM with 8MX1 organization, NOR type, and 8388608-bit memory density. Operating at -40 to 85°C, it's ideal for industrial applications requiring a small outline package with thin profile and shrink pitch. With synchronous operation up to 33MHz, this configuration memory offers reliable performance in various electronic systems.
XCF16PFSG48C
Xilinx XCF16PFSG48C is a 1.8V EEPROM with 16MX1 organization, NOR type, and 16777216-bit memory density. It operates in industrial temperature range (-40 to 85 °C) and has a thin profile grid array package suitable for configuration memory applications. With 20000 write/erase cycles endurance, it offers reliable performance in various industrial settings.
XCF16PVOG48C
Xilinx XCF16PVOG48C is a 1.8V EEPROM with 16MX1 organization, NOR type, and 16777216-bit memory density. It operates in industrial temperature range (-40 to 85°C) and offers 20000 write/erase cycles. Ideal for configuration memory applications due to its small outline package style and serial interface.
XCF32PFSG48C
Xilinx XCF32PFSG48C is a 32MX1 EEPROM with 3-STATE output, operating at 50 MHz clock frequency. It has 33554432-bit memory density and supports NOR type technology. Ideal for industrial applications, it offers 20000 Write/Erase cycles endurance and operates in a temperature range of -40 to 85°C.
50 MHz
XCF32PVOG48C
Xilinx XCF32PVOG48C is a 32MX1 EEPROM with 33554432-bit memory density. Operating at 1.8V, it offers 20000 write/erase cycles and supports industrial temperature grade applications. With a small outline package style, it features synchronous operation and GULL WING terminal form for serial configuration memory needs.
XC17S100AVOG8C
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; JESD-609 Code: e3;
781216 bit
781216 words
781216
781216X1
XC17S15AVOG8C
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Equivalence Code: SOP8,.25;
XC17S200AVOG8C
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
1335840 bit
1335840 words
1335840
1335840X1
XC17S200AVOG8I
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
XC17S50AVOG8C
The Xilinx XC17S50AVOG8C is a 559200-bit EEPROM with 3.3V supply voltage, operating in synchronous mode. It features a small outline package and Gull Wing terminals, suitable for configuration memory applications. With a max temperature of 70°C, it offers 3-STATE output characteristics and consumes up to 15mA supply current.
XC1736EVOG8C
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 10 MHz;
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
4.9276 mm
36288 bit
36288 words
36288
36288X1
TSOP8,.25
5
1.1938 mm
5.25 V
4.75 V
3.937 mm
XC1765ELVOG8C
XC1765ELVOG8C by Xilinx is a 64KX1 EEPROM with 3.3V supply, operating at up to 2.5 MHz clock frequency. It features a small outline package suitable for commercial applications, offering 65536 bits of memory density and serial interface for configuration memory tasks.
2.5 MHz
65536 bit
65536 words
64K
64KX1
XC18V04VQG44C
XC18V04VQG44C by Xilinx is a 512Kx8 EEPROM with NOR type technology. Operating at 3.3V, it offers 20MHz clock frequency and 20000 write/erase cycles. Ideal for industrial applications requiring high memory density and fast access times in a compact thin profile package.
2.5/3.3,3.3
.01 Amp
25 mA
XC18V512VQG44C
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
15 ns
524288 bit
64KX8
XC18V01VQG44C
Xilinx XC18V01VQG44C is a 128Kx8 EEPROM with 3.3V nominal voltage, operating at up to 33MHz clock frequency. Ideal for industrial applications, it offers 20000 write/erase cycles and supports parallel/serial operation in a compact square package.
131072 words
128K
128KX8
XC18V02VQG44C
XC18V02VQG44C by Xilinx is a 256Kx8 EEPROM with 20MHz clock frequency, operating at -40 to 85°C. It has NOR type technology, supports parallel/serial mode, and offers 20000 write/erase cycles. Ideal for industrial applications requiring configuration memory with a memory density of 2097152 bits.
XC17128EPDG8C
Xilinx XC17128EPDG8C is a 128Kx1 EEPROM with 15MHz clock frequency, operating at 5V. It features synchronous operation, 3-STATE output, and serial interface. Ideal for configuration memory applications in commercial-grade devices due to its compact size and low standby current of 0.00005A.
15 MHz
131072 bit
128KX1
250
XC17256EPCG20C
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Package Equivalence Code: LDCC20,.4SQ;
S-PQCC-J20
8.9662 mm
262144 bit
256KX1
LDCC20,.4SQ
245
XC17256EPDG8C
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
XC17S200APDG8C
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 1335840X1;
XC17S200APDG8I
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Length: 9.3599 mm;
XC17S50APDG8C
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 250;
XC18V01PCG20C
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
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