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FBGA Other Function Interface ICs 5

Other Function Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Built-in Protections Maximum Delay Display Mode Driver No. of Bits Interface IC Type Interface Standard JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Backplanes No. of Bits No. of Channels No. of Digits/Characters No. of Functions No. of Segments No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Output Characteristics Maximum Output Current Output Latch/Register Nominal Output Peak Current Limit Output Polarity Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Maximum Receive Delay Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Maximum Supply Voltage-1 Minimum Supply Voltage-1 Nominal Supply Voltage-1 Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Turn-off Time Turn-on Time Width
MAX3374EEBL by Maxim Integrated

MAX3374EEBL

Maxim Integrated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 8; Package Code: FBGA; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-PBGA-B8

e0

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA8,3X3,20

SQUARE

GRID ARRAY, FINE PITCH

1.8/5

Not Qualified

Other Interface ICs

YES

BICMOS

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

MAX3376EEBL by Maxim Integrated

MAX3376EEBL

Maxim Integrated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 8; Package Code: FBGA; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-PBGA-B8

e0

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA8,3X3,20

SQUARE

GRID ARRAY, FINE PITCH

1.8/5

Not Qualified

Other Interface ICs

YES

BICMOS

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

IP4853CX24/P,135 by NXP Semiconductors

IP4853CX24/P,135

NXP Semiconductors

IP4853CX24/P,135 from NXP Semiconductors is a compact interface IC designed for surface mount applications. It operates at a nominal voltage of 1.8V and features a fine pitch grid array with 24 terminals. This device functions effectively in environments ranging from -30 °C to 85 °C.

S-PBGA-B24

24

85 Cel

-30 Cel

PLASTIC/EPOXY

FBGA

BGA24,5X5,16

SQUARE

GRID ARRAY, FINE PITCH

1.8

Not Qualified

Other Interface ICs

1.8 V

YES

OTHER

BALL

.4 mm

BOTTOM

NTS0104UK-Q100Z by NXP Semiconductors

NTS0104UK-Q100Z

NXP Semiconductors

The NXP Semiconductors NTS0104UK-Q100Z is an AEC-Q100 compliant interface IC with 12 terminals in a grid array package. Operating temperature range from -40 to 125°C, suitable for automotive applications. Features include power supplies of 1.8/3.3V and 2.5/5V, surface mount compatibility, and a rectangular package shape.

INTERFACE CIRCUIT

R-PBGA-B12

12

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8/3.3,2.5/5

Not Qualified

AEC-Q100

Other Interface ICs

YES

AUTOMOTIVE

BALL

.4 mm

BOTTOM

NTB0104UK-Q100Z by NXP Semiconductors

NTB0104UK-Q100Z

NXP Semiconductors

NTB0104UK-Q100Z by NXP Semiconductors is an automotive-grade interface IC with a 12-terminal grid array design. It operates b/w -40 °C to 125 °C and supports power supplies of 1.2/3.6V and 1.8/5V, ideal for automotive applications requiring reliability. Its AEC-Q100 screening ensures high performance in demanding environments.

INTERFACE CIRCUIT

R-PBGA-B12

12

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, FINE PITCH

1.2/3.6,1.8/5

Not Qualified

AEC-Q100

Other Interface ICs

YES

AUTOMOTIVE

BALL

.4 mm

BOTTOM