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101 Other Function Interface ICs 4

Other Function Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Built-in Protections Maximum Delay Display Mode Driver No. of Bits Interface IC Type Interface Standard JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Backplanes No. of Bits No. of Channels No. of Digits/Characters No. of Functions No. of Segments No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Output Characteristics Maximum Output Current Output Latch/Register Nominal Output Peak Current Limit Output Polarity Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Maximum Receive Delay Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Maximum Supply Voltage-1 Minimum Supply Voltage-1 Nominal Supply Voltage-1 Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Turn-off Time Turn-on Time Width
DS250DF210ABMT by Texas Instruments

DS250DF210ABMT

Texas Instruments

DS250DF210ABMT by Texas Instruments is a 2-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) and features surface mount capability. Ideal for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

2

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

DS250DF410ABMR by Texas Instruments

DS250DF410ABMR

Texas Instruments

DS250DF410ABMR by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) and has bottom terminal position with tin silver copper finish. Ideal for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

4

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

DS250DF410ABMT by Texas Instruments

DS250DF410ABMT

Texas Instruments

DS250DF410ABMT by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) with peak reflow temperature of 260°C. Suitable for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

4

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

DS250DF210ABMR by Texas Instruments

DS250DF210ABMR

Texas Instruments

DS250DF210ABMR by Texas Instruments is a 2-channel interface IC with a temperature range of -40 to 85°C. It features a grid array package style, 0.5mm terminal pitch, and TSC terminal finish. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

2

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm