Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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D-110-0101
TE Connectivity
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
HEAT SHRINK SOLDER SLEEVE
SINGLE WALL
CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE
SOLDER
0
0 AWG
SO63-3-55-24-90
TE Connectivity's SO63-3-55-24-90 heat shrink features single wall construction with polyvinylidene fluoride jacket material. It has a max operating temperature of 150°C, 4.3mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminals in various electrical applications.
4.3 mm
POLYVINYLIDENE FLUORIDE
150 Cel
S02-07-R
HEAT SHRINK SOLDER SLEEVE; Diameter: 2.65 mm; Maximum Wire Size: 22 AWG; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 22; Construction: SINGLE WALL;
2.65 mm
CROSSLINKED POLYVINYLIDENE FLUORIDE
22
22 AWG
S02-13-R
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 24; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Diameter: 4.3 mm; Construction: SINGLE WALL; Maximum Wire Size: 24 AWG;
24
24 AWG
S02-15-R
HEAT SHRINK SOLDER SLEEVE; Diameter: 7 mm; Construction: SINGLE WALL; Wire Gauge (AWG): 24; Maximum Wire Size: 24 AWG; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE;
7 mm
S02-17-R
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 26 AWG; Construction: SINGLE WALL; Diameter: 2.65 mm; Wire Gauge (AWG): 26; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE;
26
26 AWG
S02-19-R
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 26 AWG; Wire Gauge (AWG): 26; Construction: SINGLE WALL; Diameter: 5.95 mm;
5.95 mm
S02-08-R-90CS926
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Construction: SINGLE WALL; Diameter: 4.3 mm;
SO63-4-9036-22
TE Connectivity SO63-4-9036-22 heat shrink features single wall construction with polyvinylidene fluoride jacket material. It has a max operating temperature of 150°C, 5.95mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminal connections in various electrical applications.
SO63-4-9036-22CS2677
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 22 AWG; Maximum Operating Temperature: 150 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 22; Construction: SINGLE WALL;
D-181-1222-90/9CS936
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 22; Maximum Wire Size: 22 AWG;
S02-08-R-90-120
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm;
S03-08-R-100
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 175 Cel; Maximum Wire Size: 0 AWG;
175 Cel
S02-08-R-3CS926
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm; Construction: SINGLE WALL;
ST63-1-55-20-90
TE Connectivity's ST63-1-55-20-90 heat shrink features a single wall construction with Polyvinylidene Fluoride jacket material. It has a max operating temperature of 150°C, 1.9mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminals in various applications requiring reliable insulation and protection.
1.9 mm
SO63-1-01-100
TE Connectivity SO63-1-01-100 heat shrink features single wall construction with Polyvinylidene Fluoride jacket material. Solder terminal type, 150°C max operating temp, 1.9mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
SO63-1-55-22-9
TE Connectivity SO63-1-55-22-9 heat shrink features single wall construction with polyvinylidene fluoride jacket. Solder terminal type, 150°C max operating temp, 1.9mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
SO63-5-55-22-0
TE Connectivity SO63-5-55-22-0 heat shrink features single wall construction with polyvinylidene fluoride jacket. Solder terminal type, 150°C max operating temp, 7mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
S02-03-RCS293
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 4.3 mm; Maximum Wire Size: 20 AWG; Wire Gauge (AWG): 20; Terminal Type: SOLDER;
20
20 AWG
ST63-2-55-24-9
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 24 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 24; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO96-3-01-100
TE Connectivity SO96-3-01-100 heat shrink features single wall construction with Polyvinylidene Fluoride jacket material. Solder terminal type, 175°C max operating temp, 4.3mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
SO96-3-55-22-95
TE Connectivity's SO96-3-55-22-95 is a single wall heat shrink with a polyvinylidene fluoride jacket material. It has a max operating temperature of 175°C and can accommodate wire sizes up to 0 AWG. This heat shrink is commonly used in soldering applications.
ST63-3-55-22-5
TE Connectivity's ST63-3-55-22-5 heat shrink features single wall construction with polyvinylidene fluoride jacket material. It has a max operating temperature of 150°C, 4.3mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminal connections in various electrical applications.
SO63-2-55-22-2
TE Connectivity's SO63-2-55-22-2 heat shrink features single wall construction with polyvinylidene fluoride jacket material. It has a max operating temperature of 150°C, 2.65mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminals in various electrical applications.
SO63-5-00CS2677
TE Connectivity SO63-5-00CS2677 heat shrink features single wall construction with polyvinylidene fluoride jacket. Solder terminal type, 150°C max operating temp, 7mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
SO63-4-00CS2567
TE Connectivity SO63-4-00CS2567 heat shrink features single wall construction with Polyvinylidene Fluoride jacket material. Solder terminal type, 150°C max operating temp, and 5.95mm diameter make it ideal for applications requiring protection and insulation of wires up to 0 AWG.
SO63-2-9036-22
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 22; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 22 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
S02-07-R-98
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Construction: SINGLE WALL; Diameter: 2.65 mm;
S02-08-R-6
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Construction: SINGLE WALL; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG;
SO63-4-9036-20
TE Connectivity SO63-4-9036-20 heat shrink features single wall construction with polyvinylidene fluoride jacket. Solder terminal type, 150°C max operating temp, 5.95mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
SO63-2-01CS293
TE Connectivity SO63-2-01CS293 heat shrink features single wall construction with polyvinylidene fluoride jacket material. Solder terminal type, 150°C max operating temp, 2.65mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
S02-07-R-3CS925
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Diameter: 2.65 mm;
S02-15-RCS293
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 24 AWG; Terminal Type: SOLDER; Wire Gauge (AWG): 24; Diameter: 7 mm; Construction: SINGLE WALL;
SO63-4-9036-18
TE Connectivity's SO63-4-9036-18 heat shrink features single wall construction with polyvinylidene fluoride jacket material. It has a max operating temperature of 150°C, diameter of 5.95mm, and supports up to 0 AWG wire size. Ideal for solder terminals in various electrical applications.
SO63-2-9036-18
TE Connectivity SO63-2-9036-18 heat shrink features single wall construction with polyvinylidene fluoride jacket. Solder terminal type, 150°C max operating temp, 2.65mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
S02-07-R-3
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Diameter: 2.65 mm; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
D-128-0028
HEAT SHRINK SOLDER SLEEVE; Minimum Wire Size: 22 AWG; Cross Section Area: .5 mm2; Maximum Operating Temperature: 150 Cel; Wire Gauge (AWG): 20; Maximum Wire Size: 20 AWG;
.5 mm2
S02-07-R-95CS816
HEAT SHRINK SOLDER SLEEVE; Diameter: 2.65 mm; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Construction: SINGLE WALL;
S02-03-W2-24-00-100
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Terminal Type: SOLDER; Diameter: 4.3 mm;
S02-02-RCR293
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 20 AWG; Terminal Type: SOLDER; Construction: SINGLE WALL; Diameter: 2.65 mm; Wire Gauge (AWG): 20;
D-181-1222-90/9CS403
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 22 AWG; Wire Gauge (AWG): 22;
SO63-2-55-24-5
TE Connectivity SO63-2-55-24-5 heat shrink features single wall construction with Polyvinylidene Fluoride jacket. Solder terminal type, 150°C max operating temp, 2.65mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
D-183-0038
HEAT SHRINK SOLDER SLEEVE; Minimum Wire Size: 30 AWG; Wire Gauge (AWG): 24; Maximum Wire Size: 24 AWG; Cross Section Area: .25 mm2;
.25 mm2
30 AWG
SO63-3-00CS2567
TE Connectivity's SO63-3-00CS2567 heat shrink features single wall construction with crosslinked modified PVDF jacket material. With a max operating temp of 150°C, it suits solder terminals and accommodates wires up to 0 AWG. Ideal for electrical applications requiring reliable insulation in tight spaces.
775210-000
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL;
118577-000
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
S02-08-R-3
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Diameter: 4.3 mm; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
D-181-1226-90/9
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
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