Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TE Connectivity's ST63-3-55-22-5 heat shrink features single wall construction with polyvinylidene fluoride jacket material. It has a max operating temperature of 150°C, 4.3mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminal connections in various electrical applications.
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Single wall construction provides sufficient protection while allowing flexibility, making it easy to apply to wires of varying sizes.
Polyvinylidene fluoride is known for its excellent chemical resistance and high temperature tolerance, ensuring durability and reliable performance in harsh environments.
Solder terminals provide a secure and reliable connection, ensuring that the heat shrink remains firmly in place during operation.
With a maximum operating temperature of 150°C, this heat shrink can handle high heat environments without degrading or losing effectiveness.
The 4.3mm diameter makes this heat shrink suitable for a wide range of wire sizes, providing versatility in applications.
Capable of accommodating up to 0 AWG wire size, this heat shrink is ideal for use with thicker wires, ensuring a secure and insulated connection.
Heat Shrinks ST63-3-55-22-5 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Diameter:
Jacket Material:
Maximum Operating Temperature:
Terminal Type:
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
STM32H753IIK6
STMicroelectronics
STM32H753IIK6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and peripherals like CAN, ETHERNET, and USB. Ideal for industrial applications requiring high-speed processing and extensive connectivity options.
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
SMBJ18CA
Changzhou Starsea Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148W-7-F
Diodes Incorporated
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
General Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
BAV99
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
MBRA160T3G
Onsemi
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
LD1117S33CTR
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
1N4148
Digitron Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
SS14
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Sensitron Semiconductor
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Formosa Microsemi
Boca Semiconductor
RNF-100-3/8-0-STK
TE Connectivity
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
TMS-SCE-3/8-2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
M83519/2-7
Sumitomo Electric Industries
HEAT SHRINK SOLDER SLEEVE; Jacket Material: POLYVINYLIDENE FLUORIDE;
462A034-12-0
HEAT SHRINK BOOT; Jacket Material: FLUORO ELASTOMER; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 200 Cel; Material: FLUOROELASTOMER;
222A121-25/225-0
TE Connectivity's 222A121-25/225-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temp range, and fits cables up to 19" with 0 AWG wire size. Ideal for applications requiring durable cable protection in extreme temperature environments.
FIT22111/2CL070
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
322A123-25/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER; Construction: DUAL WALL; Maximum Operating Temperature: 150 Cel;
382A023-3-42-0
TE Connectivity's 382A023-3-42-0 heat shrink features dual wall construction with polyolefin jacket material. It has a wide operating temperature range from -55°C to 135°C and accommodates wires up to 0 AWG. Ideal for electrical insulation in various applications.
222K132-25/225-0-CS6940
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel;
462A011-100/86-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel;
204W221-25-G03/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Material: ELASTOMER;
RNF-3000-9/3-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
CGPE-105-1-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -70 Cel; Maximum Operating Temperature: 105 Cel; Construction: SINGLE WALL;
202K121-25-01-0
TE Connectivity's 202K121-25-01-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temperature range, and accommodates up to 0 AWG wire size. Ideal for applications requiring a min cable entry of 5.6" and max of 14", this product ensures reliable insulation and protection.
RW-175-1/16-X-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL; Jacket Material: CROSSLINKED FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel;
RT-375-1-1/2-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUOROPOLYMER;
CGAT-9/3-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 80 Cel; Construction: DUAL WALL;
VERSAFIT-1-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
RNF-100-3/4-0-FSP
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
RNF-100-3/8-X-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
ST63-1-55-20-90
TE Connectivity's ST63-1-55-20-90 heat shrink features a single wall construction with Polyvinylidene Fluoride jacket material. It has a max operating temperature of 150°C, 1.9mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminals in various applications requiring reliable insulation and protection.
ST63-2-55-24-9
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 24 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 24; Jacket Material: POLYVINYLIDENE FLUORIDE;
ST63-3-55-20-5
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Diameter: 4.3 mm; Maximum Operating Temperature: 150 Cel;
ST63-1-55-24-9
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Diameter: 1.9 mm;
ST63-3-55-20-0
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
ST63-1-55-24-90
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Jacket Material: POLYVINYLIDENE FLUORIDE; Diameter: 1.9 mm; Construction: SINGLE WALL;
ST63-3-55-24-9
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Operating Temperature: 150 Cel;
ST63-3-55-24-0
HEAT SHRINK SOLDER SLEEVE; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm;
ST63-3-55-22-9CS670
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Terminal Type: SOLDER; Diameter: 4.3 mm; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG;
ST63-3-55-26-9
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER; Construction: SINGLE WALL;
ST63-3-55-26-90
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Maximum Operating Temperature: 150 Cel; Terminal Type: SOLDER; Jacket Material: POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
ST63-3-55-20-90
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Terminal Type: SOLDER; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel;
ST63-3-55-20-9
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER; Diameter: 4.3 mm;
ST63-2-55-20-90
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Diameter: 2.65 mm; Jacket Material: POLYVINYLIDENE FLUORIDE;
ST63-5-55-22-9
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Operating Temperature: 150 Cel; Diameter: 7 mm;
ST63-3-55-24-90
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG;
ST63-3-55-22-90
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Maximum Operating Temperature: 150 Cel; Terminal Type: SOLDER; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
ST63-3-55-22-9
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
ST63-2-55-20-0
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG; Diameter: 2.65 mm; Maximum Operating Temperature: 150 Cel;
ST63-4-00
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel;
Supply Digital Components
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