Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity SO96-3-01-100 heat shrink features single wall construction with Polyvinylidene Fluoride jacket material. Solder terminal type, 175°C max operating temp, 4.3mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
Median Price
$10.850
Lifecycle Status
Suppliers In-Stock
14
In-Stock Inventory
1k+
Farnell
1+ parts
100+ parts
$9.080
1k+ parts
$8.020
10k+ parts
-
Element14
$19.990
$14.840
$13.440
Mouser Electronics
$21.000
$9.640
$9.030
TTI
$8.200
$5.580
$4.910
Master Electronics
$8.110
$5.250
PEI Genesis
Verical
$9.541
Powell Electronics
$11.320
$10.790
Bristol Electronics
$7.840
$3.397
Nova Conductors
$8.760
Electro Sonic
$8.340
$5.180
Vyrian
FDH Electronics
IBS Electronics
$11.374
$7.363
Netroflash
$8.322
$8.147
Continental Prestige Electronics
Argo Parts USA
Assy Fe
Single wall construction provides good insulation and protection for wires or components, making this heat shrink durable and reliable.
Polyvinylidene fluoride offers excellent chemical and heat resistance, making this heat shrink suitable for a wide range of applications in various environments.
Solder terminals ensure a secure and reliable connection, providing peace of mind when using this heat shrink for electrical applications.
With a high maximum operating temperature of 175°C, this heat shrink can withstand elevated temperatures without compromising performance.
The diameter of 4.3mm allows for a snug fit around wires or components, ensuring proper insulation and protection.
Suitable for up to 0 AWG wire sizes, this heat shrink can accommodate a wide range of wire gauges, making it versatile for different applications.
Heat Shrinks SO96-3-01-100 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Diameter:
Jacket Material:
Maximum Operating Temperature:
Terminal Type:
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
2N2222A
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
MMSZ5245BT1G
Onsemi
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Eic Semiconductor
TCA6424ARGJR
Texas Instruments
TCA6424ARGJR by Texas Instruments is a CMOS parallel I/O port with 24 bits and 3 ports. It operates b/w -40 to 85°C, suitable for industrial applications. With a max clock frequency of 0.4 MHz, it offers low power consumption at only 0.03 mA supply current.
1N4148
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
LM358AN
Samsung
MURS160T3G
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
BAV99
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Kec
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
RNF-100-3/16-BK-SP
TE Connectivity
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
DR-25-1-1/2-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Jacket Material: CROSSLINKED ELASTOMER; Maximum Wire Size: 0 AWG;
RNF-100-3/8-0-FSP
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
202K174-25/225-0
TE Connectivity's 202K174-25/225-0 heat shrink features ELASTOMER jacket material, -75 to 150 °C operating temp range, and 0.618" to 1.378" cable entry. Ideal for applications requiring protection and insulation of cables with up to 0 AWG wire size.
VERSAFIT-3/16-KT2-REFILL
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
ATUM-4/1-0-STK
Commscope
HEAT SHRINK TUBE; Construction: MEDIUM WALL; Jacket Material: POLYOLEFIN;
RT-375-1/4-X-STK
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED FLUOROPOLYMER; Construction: SINGLE WALL;
FIT-221-1/16GR001
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
382A023-25-08-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Construction: DUAL WALL; Material: ELASTOMER;
202D263-25-08/86-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG;
222D232-25-02/86-0
TE Connectivity's 222D232-25-02/86-0 heat shrink features ELASTOMER jacket material, 0.74" min cable entry, and 150°C max operating temp. Ideal for applications requiring -75°C min operating temp, accommodating up to 0 AWG wire size and 1.33" max cable entry.
809S060-3H
Glenair
HEAT SHRINK BOOT; Jacket Material: POLYOLEFIN;
562A011-25/225-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Material: ELASTOMER; Construction: DUAL WALL; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel;
202K121-25-G38/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
RPS-8-4/2.0-4
HEAT SHRINK TUBE; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Construction: SINGLE WALL;
FIT-221-1/8WH002
HEAT SHRINK TUBE; Additional Features: REFERENCE STANDARD: CSA; UL; Jacket Material: POLYOLEFIN;
ATUM-9/3-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 110 Cel;
M83519/1-5
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
878502-006
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG;
LSTT-12.7-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SO96-3-55-22-90
TE Connectivity's SO96-3-55-22-90 heat shrink features a single wall construction with crosslinked modified PVDF jacket material. It has a max operating temperature of 175°C, 4.3mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminals in various applications requiring reliable insulation and protection.
SO96-3-55-22-90-100
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Maximum Operating Temperature: 175 Cel; Diameter: 4.3 mm; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO96-3-55-22-95
TE Connectivity's SO96-3-55-22-95 is a single wall heat shrink with a polyvinylidene fluoride jacket material. It has a max operating temperature of 175°C and can accommodate wire sizes up to 0 AWG. This heat shrink is commonly used in soldering applications.
SO96-4-00
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL; Diameter: 5.95 mm; Terminal Type: SOLDER; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
SO96-2-55-22-95
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO96-1-55-22-95
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 175 Cel; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Jacket Material: POLYVINYLIDENE FLUORIDE; Diameter: 1.9 mm;
SO96-5-00CS2667
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Operating Temperature: 175 Cel; Terminal Type: SOLDER;
SO96-2-55-22-90CS2667
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER;
SO96-4-55-22-95
HEAT SHRINK SOLDER SLEEVE; Diameter: 5.95 mm; Terminal Type: SOLDER; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
SO96-4-00CS227
HEAT SHRINK SOLDER SLEEVE; Diameter: 5.95 mm; Maximum Operating Temperature: 175 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
SO96-1-55-22-90CS786
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO96-5-55-22-90CS2667
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL; Diameter: 7 mm;
SO96-5-55-22-95
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG; Diameter: 7 mm;
SO96-4-55-22-90-100
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 175 Cel; Diameter: 5.95 mm; Terminal Type: SOLDER; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG;
SO96-5-55-22-90-100
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER;
SO96-1-00
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 175 Cel; Wire Gauge (AWG): 0; Terminal Type: SOLDER;
SO96-1-55-22-90
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Maximum Operating Temperature: 175 Cel; Maximum Wire Size: 0 AWG; Diameter: 1.9 mm;
SO96-2-00
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Diameter: 2.65 mm; Maximum Operating Temperature: 175 Cel; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
SO96-4-55-22-90
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Wire Gauge (AWG): 0; Maximum Operating Temperature: 175 Cel; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
SO96-5-00
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Terminal Type: SOLDER; Diameter: 7 mm; Maximum Wire Size: 0 AWG;
Supply Digital Components
$106.00
$54.25
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$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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