Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity's SO96-4-00 heat shrink features single wall construction with crosslinked modified PVDF jacket. Solder terminal type, 175°C max temp, and 5.95mm diameter make it ideal for 0 AWG wire applications in various industries.
Median Price
$3.930
Lifecycle Status
Suppliers In-Stock
22
In-Stock Inventory
1k+
Farnell
1+ parts
$3.490
100+ parts
$2.220
1k+ parts
$1.960
10k+ parts
-
WireMasters
$4.246
$3.919
$3.185
DigiKey
$4.440
$3.206
$2.726
$2.555
Newark
$4.570
$3.210
$2.710
$2.580
Mouser Electronics
$4.630
$3.160
$2.630
$2.500
Element14
$6.440
$4.650
$3.960
TTI
$2.770
$2.210
Chip1Stop
$2.830
RS Americas
Powell Electronics
$3.070
$2.850
$2.360
Master Electronics
$2.800
$2.120
Verical
$3.294
Electro Enterprises
$2.700
$2.298
$1.862
Bristol Electronics
$3.420
$1.607
$1.471
Vyrian
FDH Electronics
Electro Sonic
$2.620
$2.290
$1.480
Nova Conductors
IBS Electronics
$3.927
$3.506
$2.973
Rapid Electronics
Kallista Electronics Ltd
Quittner & Schimek s.r.o.
Continental Prestige Electronics
$4.920
$3.940
Authorized Procurement Solutions
Argo Parts USA
Aranea Global
Assy Fe
Single wall construction provides a strong and durable heat shrink, ensuring reliable protection for wires and terminals.
The crosslinked modified polyvinylidene fluoride jacket material offers excellent resistance to heat, chemicals, and abrasion, enhancing the longevity and performance of the heat shrink.
Solder terminals provide a secure and reliable connection, ensuring a strong bond between the wire and terminal for effective electrical conductivity.
With a maximum operating temperature of 175°C, this heat shrink can handle high temperatures, making it ideal for various applications where heat resistance is crucial.
The diameter of 5.95 mm allows for versatile usage with different wire sizes and terminals, providing flexibility in application.
Suitable for use with 0 AWG wire, this heat shrink accommodates larger wire sizes, making it a versatile and practical choice for various projects.
Heat Shrinks SO96-4-00 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Diameter:
Jacket Material:
Maximum Operating Temperature:
Terminal Type:
Wire Gauge (AWG):
Maximum Wire Size:
SO96-4-00 Connector Accessories trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
MBR1560CT
General Instrument
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
LM2931Z-5.0RPG
Onsemi
LM2931Z-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.1A Max Output Current, and 6V Min Input Voltage. It operates in temperatures ranging from -40 to 125 °C and is ideal for applications requiring stable voltage regulation in electronic circuits.
LM317T
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
LM358DR2G
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358DT
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
1N4148WS
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
Lite-on Semiconductor
SMBJ18CA
Shenzhen Socay Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Siemens
National Semiconductor
TMS-SCE-1/8-2.0-4
TE Connectivity
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0;
ATUM-12/4-0-STK
Commscope
HEAT SHRINK TUBE; Construction: DUAL WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
M83519/2-2
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
RNF-100-3/16-0-20MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
M23053/5-303-0
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Additional Features: REFERENCE STANDARD: CSA; UL; Minimum Operating Temperature: -55 Cel;
RNF-100-1/8-9-STK
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Additional Features: APPROVAL: VDE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
202K132-100-01/180-0
HEAT SHRINK BOOT; Minimum Cable Entry: 5.9 inch; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 15 inch;
222K163-100/180-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 23 inch; Maximum Operating Temperature: 105 Cel; Minimum Cable Entry: 9.9 inch;
202K132-3-0
TE Connectivity's 202K132-3-0 heat shrink features single wall construction with polyolefin jacket material. It has a max operating temp of 135°C and min cable entry of 5.9". Ideal for applications requiring protection against extreme temperatures and secure cable insulation up to 0 AWG wire size.
15106
Pro-power
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
382A046-3-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Construction: DUAL WALL; Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
NB24322001
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL;
202K163-25-01-0
TE Connectivity's 202K163-25-01-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min cable entry of 9.9". Ideal for applications requiring durable insulation in extreme temperature environments.
M23053/5-103-0
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; Assembly Item Name: TAPER SLEEVE; IEC Conformity: NO; MIL Conformity: NO; DIN Conformity: NO;
RNF-100-3/16-9-STK
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
DR-25-1/2-0-SP-CS7143
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: ELASTOMER;
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
M23053/5-108-9
Ls Cable & System
HEAT SHRINK TUBE; DIN Conformity: NO; Assembly Item Name: TAPER SLEEVE; IEC Conformity: NO; Jacket Material: POLYOLEFIN; MIL Conformity: NO;
CGPT-12/4-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
204473-000
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel;
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SO96-3-55-22-90
TE Connectivity's SO96-3-55-22-90 heat shrink features a single wall construction with crosslinked modified PVDF jacket material. It has a max operating temperature of 175°C, 4.3mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminals in various applications requiring reliable insulation and protection.
SO96-3-55-22-90-100
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Maximum Operating Temperature: 175 Cel; Diameter: 4.3 mm; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO96-3-55-22-95
TE Connectivity's SO96-3-55-22-95 is a single wall heat shrink with a polyvinylidene fluoride jacket material. It has a max operating temperature of 175°C and can accommodate wire sizes up to 0 AWG. This heat shrink is commonly used in soldering applications.
SO96-3-01-100
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Construction: SINGLE WALL; Maximum Operating Temperature: 175 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG;
SO96-2-01-100
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 175 Cel; Diameter: 2.65 mm; Terminal Type: SOLDER; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO96-5-01-100
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Maximum Operating Temperature: 175 Cel; Diameter: 7 mm; Jacket Material: POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
SO96-2-55-22-95
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO96-1-55-22-95
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 175 Cel; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Jacket Material: POLYVINYLIDENE FLUORIDE; Diameter: 1.9 mm;
SO96-2-55-22-90-100
HEAT SHRINK SOLDER SLEEVE; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Operating Temperature: 175 Cel; Terminal Type: SOLDER; Construction: SINGLE WALL; Diameter: 2.65 mm;
SO96-2-55-22-90CS2667
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER;
SO96-4-55-22-95
HEAT SHRINK SOLDER SLEEVE; Diameter: 5.95 mm; Terminal Type: SOLDER; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
SO96-4-00CS227
HEAT SHRINK SOLDER SLEEVE; Diameter: 5.95 mm; Maximum Operating Temperature: 175 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
SO96-1-55-22-90CS786
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO96-5-55-22-90CS2667
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL; Diameter: 7 mm;
SO96-4-55-22-90-100
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 175 Cel; Diameter: 5.95 mm; Terminal Type: SOLDER; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG;
SO96-1-55-22-90
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Maximum Operating Temperature: 175 Cel; Maximum Wire Size: 0 AWG; Diameter: 1.9 mm;
SO96-2-00
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Diameter: 2.65 mm; Maximum Operating Temperature: 175 Cel; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
SO96-2-55-22-90
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Maximum Operating Temperature: 175 Cel; Terminal Type: SOLDER; Wire Gauge (AWG): 0; Diameter: 2.65 mm;
SO96-4-55-22-90
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Wire Gauge (AWG): 0; Maximum Operating Temperature: 175 Cel; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
SO96-5-55-22-90
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL; Terminal Type: SOLDER; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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