Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IC SOCKET; Device Type Used On: QFP48; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 700VAC; Housing Material: POLYSULPHONE;
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Chip Carrier IC & Component Sockets IC51-0484-831-1 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Yamaichi Electronics
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IC51-0484-831-1 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Yamaichi Electronics USA, Inc. (YEU) is a wholly owned subsidiary division of Yamaichi Electronics Company, LTD. (YEC). This sub-division, referred to as “YEU”, serves as a Corporate Sales Office representing Yamaichi products in North America. Yamaichi’s parent corporation, YEC, has subsidiaries and manufacturing in over 11 different countries. Other subsidiaries are located in China (YEZ), England (YGB), Germany (YED), Hong Kong (YEH), Italy (YEI), Korea (AYE), Philippines (PMI & TSS), Shanghai (YEHS), Singapore (YES), and Taiwan (YEST). YEU was founded and incorporated as a business on November 1, 1983, when it opened its first office in Palo Alto, California. Steady growth of the Yamaichi products line in the United States includes our Test & Burn-In sockets and Production connectors, as well as standard and high density connectors. In addition to our Headquarters in San Jose, California, YEU has a number of sale offices and representatives at key locations throughout the United States. By continuing to develop and manufacture products of the highest quality and reliability, we are in a position to make major contributions to the development of the Industries that are fulfilling today’s wide-ranging information technology requirements.
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
EU2B-YS3103F
Idec
ROTARY SWITCH;
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
BAV99
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
Electronic Devices
Cheng-yi Electronic
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SDR0604-101KL
Bourns
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
BSS138
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Eic Semiconductor
LM107H/883C
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SJG022100
Amphenol
Amphenol SJG022100 is a 20-contact relay socket with gold mating and tin termination finish. Made of polyetherimide, it's designed for SJG20 devices. Ideal for chip carrier ICs & components, this socket offers reliable connectivity in various electronic applications.
SS-104-TT-2-N
Samtec
SS-104-TT-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, BE-CU contact material, and SN mating finish. It has a rectangular PCB contact pattern and glass-filled polyester housing. Ideal for SIP4 devices, it operates b/w -65°C to 125°C, making it suitable for various electronic applications.
1SVR405651R3100
Abb
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2T-1811-N
Omron
IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10);
SS5-20-3.50-L-D-K-TR
IC SOCKET;
116-93-314-41-008000
Mill-max Mfg
116-93-314-41-008000 by Mill-max Mfg is a PLASTIC Chip Carrier IC Socket for DIP14 devices with 14 contacts. It features GOLD (30) OVER NICKEL (100) mating finish and Tin/Lead (Sn/Pb) termination with Nickel (Ni) barrier. Ideal for applications requiring reliable connections in electronic circuits.
APA-320-G-A1
Samtec APA-320-G-A1 is a 20-contact IC socket with brass contacts finished in gold over nickel. Its polyester housing makes it suitable for DIP20 devices. The rectangular contact configuration and gold termination enhance its performance in chip carrier applications.
350-90-142-00-001000
350-90-142-00-001000 by Mill-max Mfg is a Chip Carrier IC Socket with POLYETHYLENE housing material. It features 42 contacts with TIN LEAD (200) mating finish over NICKEL (150). Designed for SIP42 devices, it has RECTANGLE contact configuration and Tin/Lead termination finish for various electronic applications.
12-1508-30
Aries Electronics
Aries Electronics 12-1508-30 is a DIP12 IC socket with 2.54mm terminal pitch, gold over nickel contact finish, and nylon46 housing material. It has 12 contacts rated at 3A for wire wrap termination, suitable for chip carrier applications on PCBs with rectangular contact pattern spacing of 0.1 inch.
390261-4
TE Connectivity
TE Connectivity's 390261-4 is a Chip Carrier IC Socket with 16 contacts, rated at 1A current. It features a PCB contact row spacing of 7.62mm and operates b/w -40°C to 105°C. Ideal for DIP16 devices, it has a rectangular contact pattern and glass-filled PBT housing material.
PGA-280
Robinson Nugent
IC SOCKET; Device Type Used On: PGA280; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 280; Manufacturer Series: PGA;
2-1571586-9
TE Connectivity 2-1571586-9 is a DIP28 IC socket with 28 contacts. It features a PCB contact row spacing of 15.24mm, rectangular contact pattern, and thermoplastic housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and current rating of 3A in temperatures ranging from -55 to 105°C.
PY11-Y1
RELAY SOCKET;
315-43-103-41-001000
The Mill-max Mfg 315-43-103-41-001000 is a PLASTIC IC SOCKET for SIP3 devices with 3 TIN contacts. It features RECTANGLE contact configuration and is ideal for Chip Carrier IC & Component Sockets applications.
54020-44030LF
Amphenol Communications Solutions
The Amphenol Communications Solutions 54020-44030LF is a PLCC44 IC socket with a housing made of POLYPHENYLENE SULFIDE. It has 44 contacts and can handle a current rating of 1A. With a temperature range from -40°C to 105°C, it is suitable for various electronic applications.
228-1371-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 228-1371-00-0602J is a DIP28 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 28 gold-plated contacts for reliable connections. Ideal for chip carrier ICs, this socket ensures secure component mounting in electronic devices.
218-7223-55-1902
218-7223-55-1902 by 3M Electronic Products Division is a SOIC18 IC socket with POLYETHERSULFONE housing and BERYLLIUM COPPER contacts. It features 18 gold-over-nickel contacts for mating and termination, making it ideal for chip carrier IC applications.
M12883/54-04
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Termination): GOLD; JESD-609 Code: e4; No. of Contacts: 13; Contact Finish (Mating): GOLD;
PF113A
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
8420-21B1-RK-TP
8420-21B1-RK-TP by 3M Electronic Products Division is a PLCC20 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. It features 20 contacts made of PHOSPHOR BRONZE with MATTE TIN finish over NICKEL. Operating temperature ranges from -40°C to 105°C, ideal for chip carrier applications.
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Yamaichi Electronics
Supply Digital Components
1+ parts
$106.00
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$54.25
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$11.90
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$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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