Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCR3384XL-10TQ144I is a 384 macrocell EE PLD with 118 I/O lines, operating at up to 102 MHz. It features a propagation delay of 10 ns and supports in-system programmability. Ideal for industrial applications requiring high-speed data processing and flexible logic configurations.
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This material is common for packaging electronic components, ensuring durability and reliability.
Fast propagation delay allows for quick response times in processing signals.
Surface mount technology enables easy and secure placement on PCBs, saving space and improving efficiency.
Higher supply voltage tolerance provides flexibility in power supply options.
With a high number of macro cells, this PLD offers flexibility and customization in logic design.
Complementary Metal-Oxide Semiconductor technology ensures low power consumption and high noise immunity.
Square package shape allows for efficient use of board space and easier placement.
Stable nominal supply voltage ensures consistent performance in various operating conditions.
Dual power supply options provide flexibility in system design and compatibility.
High number of terminals enable connectivity to various components and systems.
Electrically Erasable Programmable Logic Device allows for easy reconfiguration and updates to logic design.
This package style offers space-saving design, easy installation, and reliable connections.
In-system programmability provides flexibility for on-the-fly configuration changes without removing the device.
Macrocell output function enables complex logic operations and customization capabilities.
Low minimum supply voltage allows for operation in low-power applications.
Wide operating temperature range ensures reliability in various environmental conditions.
Fine pitch terminals enable high density and compact design on the PCB.
Dedicated inputs and a high number of I/O lines provide flexibility in connecting to external devices.
Wide temperature range allows for operation in extreme cold environments.
This terminal finishing provides excellent conductivity and corrosion resistance for long-term reliability.
Quad terminal positioning allows for efficient routing and reliable connections on the PCB.
Moisture sensitivity level 3 indicates that the PLD can withstand reflow soldering at higher temperatures without damage.
Low seated height allows for compact placement within the system, saving vertical space.
Compact width enables easy integration into PCB layouts with minimal space requirements.
High maximum clock frequency allows for fast processing and operation in time-critical applications.
Compact length provides a space-efficient design for the PLD within the system.
JTAG boundary scan testing capability enables efficient testing and debugging of the PLD during development and production.
High number of I/O lines offers extensive connectivity options to external devices and components.
Industrial temperature grading ensures reliable performance in harsh industrial environments and operating conditions.
Programmable Logic Devices (PLD) XCR3384XL-10TQ144I attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx
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XCR3384XL-10TQ144I Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Assembly/Origin - Mult Dev LeadFrame Chg 29/Oct/2018
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
SMBJ18CA
Eic Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
General Semiconductor
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
USB3320C-EZK-TR
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
NE555D
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
Changzhou Starsea Electronics
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SLG46538V
Renesas Electronics
SLG46538V by Renesas Electronics is a 17 macrocell OT PLD with 17 inputs/outputs. Operating at 1.71-1.89 V, it's ideal for applications requiring low power consumption and compact design in temperatures ranging from -40 to 85 °C. Package style includes chip carrier, heat sink/slug, very thin profile for versatile integration options.
GAL22V10D-5LJN
Lattice Semiconductor
GAL22V10D-5LJN by Lattice Semiconductor is a CMOS-based PLD with 5 ns propagation delay, 132 product terms, and 142.8 MHz max clock frequency. Ideal for PAL-type applications requiring EE PLDs in commercial extended temperature environments. It features 22 inputs, 10 I/O lines, and a compact chip carrier package with J bend terminals.
EPM3256AQC208-10N
Intel
EPM3256AQC208-10N by Intel is a 256 macrocell EE PLD with 10 ns propagation delay, in-system programmable, and supports up to 95.2 MHz clock frequency. It is used in applications requiring high-speed logic processing, such as telecommunications equipment and industrial automation systems.
EPM570GM100C5N
Altera
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE;
ATF1504ASV-15AU44
Atmel
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
XC95288XL-6FG256C
Xilinx
XC95288XL-6FG256C by Xilinx is a 288 macrocell FLASH PLD with 192 inputs/outputs, operating at up to 208.3 MHz. It features a propagation delay of 6 ns and can be in-system programmable. Ideal for applications requiring high-speed processing and versatile I/O capabilities in commercial-grade environments.
XC95288XL-6TQG144C
The Xilinx XC95288XL-6TQG144C is a FLASH PLD with 288 macro cells, 117 inputs/outputs, and 208.3 MHz clock frequency. It operates at a max voltage of 3.6V and has a propagation delay of 6ns. Ideal for applications requiring high-speed processing in programmable logic devices.
EP1K30QC208-3N
EP1K30QC208-3N by Intel is a PLD with 1728 logic cells, 0.6 ns propagation delay, and 147 inputs/outputs. It uses CMOS technology and operates at temperatures from 0 to 70 °C. Ideal for applications requiring fast processing speeds and high I/O capabilities in commercial-grade environments.
ATF22V10CQZ-20PI
ATF22V10CQZ-20PI by Microchip Technology is a 24-terminal PLD with 20ns propagation delay and 5.5V max supply voltage. It features CMOS technology, FLASH PLD type, and MACROCELL output function. Ideal for industrial applications requiring high clock frequency up to 38.5MHz in a compact rectangular package.
EPF10K50ETI144-2
EPF10K50ETI144-2 by Intel is a programmable logic device (PLD) with 2880 logic cells and a propagation delay of 0.6 ns. It is used in applications requiring high-speed processing, such as industrial automation and telecommunications.
EPM2210F324I5N
The EPM2210F324I5N by Altera is a programmable logic device with 1700 macro cells and a maximum supply voltage of 2.625V. It is used in applications such as flash PLD, featuring a square package shape with a grid array style. The device has a propagation delay of 11.2ns and can operate at 3.3V.
EPM240T100I3N
Intel's EPM240T100I3N is a PLD with 192 macro cells, 80 inputs/outputs, and 4.7ns propagation delay. Ideal for applications requiring in-system programmability, such as high-speed digital designs or embedded control systems. Features CMOS technology, operates b/w -40 to 100°C, and has a max supply voltage of 2.625V.
XC2C64A-5VQG44C
XC2C64A-5VQG44C by Xilinx is a 64 macrocell FLASH PLD with 5 ns propagation delay, operating at up to 333 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing, it features a max supply voltage of 1.9 V and operates within a temperature range of 0-70°C.
EPM7064SLC44-7N
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
M4A5-32/32-10VNC
M4A5-32/32-10VNC by Lattice Semiconductor is a 32 macrocell EE PLD with 34 inputs and 32 I/O lines. Featuring a propagation delay of 10 ns, it operates at a max clock frequency of 62.5 MHz. Ideal for applications requiring in-system programmability and PAL-type architecture, this PLD has a package style of flatpack, thin profile.
EPM3032ALC44-10N
EPM3032ALC44-10N by Intel is a 32 macrocell EE PLD with 10 ns propagation delay, operating at up to 103.1 MHz clock frequency. It features in-system programmability, 34 I/O lines, and JTAG boundary scan test capability. Ideal for applications requiring fast logic processing and versatile I/O configurations in commercial-grade environments.
XC2C64A-7VQG44I
XC2C64A-7VQG44I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at 200 MHz. Ideal for industrial applications, it features in-system programmability, 33 I/O lines, and JTAG boundary scan test capability.
EPM570M100C4N
Intel's EPM570M100C4N is a 440 macrocell FLASH PLD with 76 I/O lines. It features a propagation delay of 7ns, operates at max supply voltage of 2.625V, and uses CMOS technology. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in a compact square package style.
SLG46120V
SLG46120V by Renesas Electronics is a 12-macrocell OT PLD with 10 inputs and 9 I/O lines. Operating at 1.71-1.89 V, it's ideal for applications requiring low-power consumption in a compact square chip carrier package. With a PLA-type architecture, this device offers versatile programmable logic functions for various electronic designs.
ATF22V10CQZ-20SU
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCR3128XL-10VQG100C
Xilinx XCR3128XL-10VQG100C is a 128 macrocell EE PLD with 84 I/O lines, operating at max 95 MHz clock frequency. It has a propagation delay of 10 ns and supports JTAG boundary scan test. Ideal for applications requiring fast processing speeds and high I/O capabilities in commercial temperature environments.
XCR3032XL-7CSG48I
Xilinx XCR3032XL-7CSG48I is a 32 macrocell EE PLD with 7.5ns propagation delay, operating at max clock frequency of 119MHz. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan test capability.
XCR3128XL-10VQG100I
Xilinx XCR3128XL-10VQG100I is a 128 macrocell EE PLD with 84 I/O lines. It operates at max clock frequency of 95 MHz, with propagation delay of 10 ns. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.
XCR3256XL-10TQG144C
Xilinx XCR3256XL-10TQG144C is a 256 macrocell EE PLD with 120 I/O lines, operating at up to 105 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for applications requiring high-speed processing and versatile I/O capabilities in commercial-grade environments.
XCR3256XL-12TQ144I
Xilinx XCR3256XL-12TQ144I is a 256 macrocell EE PLD with 120 I/O lines, operating at max 88 MHz clock frequency. It has in-system programmability and JTAG boundary scan test capability. Ideal for industrial applications requiring fast propagation delay of 12 ns and wide temperature range from -40 to 85 °C.
XCR3032XL-10VQG44I
Xilinx XCR3032XL-10VQG44I is a 32 macrocell EE PLD with 36 I/O lines, operating at up to 95 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed logic functions in a compact form factor.
XCR3032XL-10VQG44C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
XCR3064XL-10VQG44C
Xilinx XCR3064XL-10VQG44C is a 64-macrocell EE PLD with 36 I/O lines, operating at max 95 MHz clock frequency. It features in-system programmability, JTAG boundary scan test, and propagation delay of 10 ns. Ideal for applications requiring fast processing speeds and versatile I/O capabilities in commercial-grade environments.
XCR3064XL-10VQG100C
Xilinx XCR3064XL-10VQG100C is a 64 macrocell EE PLD with 68 I/O lines, operating at max 95 MHz. It features in-system programmability, JTAG boundary scan test, and propagation delay of 10 ns. Ideal for applications requiring fast processing speeds and versatile I/O configurations in commercial-grade environments.
XCR3128XL-10VQ100I
Xilinx XCR3128XL-10VQ100I is a 128 macrocell EE PLD with 84 I/O lines, operating at max 95 MHz clock frequency. It has in-system programmability and JTAG boundary scan test support. Ideal for industrial applications requiring fast processing and high I/O capabilities in compact form factor.
XCR3256XL-10TQG144I
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XCR3128XL-10TQG144C
Xilinx XCR3128XL-10TQG144C is a 128 macrocell EE PLD with 108 I/O lines, operating at max clock freq of 95 MHz. In-system programmable, it has propagation delay of 10 ns and operates within -40 to +85 °C range. Ideal for applications requiring high-speed logic processing in commercial environments.
XCR3256XL-12TQ144C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XCR3128XL-10VQ100C
The Xilinx XCR3128XL-10VQ100C is a programmable logic device with 128 macro cells. It operates on a max supply voltage of 3.6V and has a propagation delay of 10ns. This PLD is commonly used for applications requiring in-system programmability and a clock frequency of up to 95MHz.
XCR3128XL-7TQG144I
XCR3256XL-10TQ144I
Xilinx XCR3256XL-10TQ144I is a 256 macrocell EE PLD with 120 I/O lines, operating at up to 105 MHz. It has a propagation delay of 10 ns and can handle supply voltages from 2.7V to 3.6V. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing in a compact square package.
XCR3064XL-10VQG44I
Xilinx XCR3064XL-10VQG44I is a 64 macrocell EE PLD with 36 I/O lines, operating at max 95 MHz. It has a propagation delay of 10 ns and can handle supply voltages from 2.7 V to 3.6 V. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.
XCR3128XL-7VQ100I
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XCR3064XL-10VQG100I
XCR3512XL-10PQG208C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
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