Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCR3064XL-7CS48I is a 64 macrocell EE PLD with 40 I/O lines, operating at max 119 MHz clock frequency. It has a propagation delay of 7.5 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed logic functions in a compact form factor.
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Provides durability and protection for the internal components of the PLD, ensuring long-term reliability.
Fast propagation delay allows for quick signal processing and efficient operation of the PLD.
Enables easy and secure installation on circuit boards, saving space and facilitating automated assembly processes.
Allows for compatibility with a range of power supplies, providing flexibility in design and integration.
Offers ample resources for implementing complex logic functions and custom configurations in the PLD.
Utilizes CMOS technology for low power consumption, high noise immunity, and reliable performance in various applications.
Square shape allows for efficient use of space on the circuit board and facilitates uniform thermal dissipation.
Ball terminals provide reliable electrical connections, ease of soldering, and improved mechanical strength in the PLD.
Stable nominal supply voltage ensures consistent operation and performance of the PLD under various operating conditions.
Optimized power supply voltage for efficient operation and compatibility with standard power sources.
Sufficient number of terminals for connecting inputs, outputs, and power sources, facilitating easy integration into electronic systems.
EEPROM-based programmability allows for easy reconfiguration of the device without the need for external programming hardware.
Grid array and fine pitch package style provide high density, enhanced electrical performance, and simplified PCB layout.
Supports in-system programming, enabling convenient and efficient updates or modifications to the logic design without removing the PLD from the system.
Macrocell output function allows for flexible logic implementation, data storage, and interfacing capabilities in the PLD.
Wide range of minimum supply voltage allows for operation in low-power applications and compatibility with various power sources.
High maximum operating temperature range ensures reliable performance in demanding industrial environments without overheating.
Fine pitch of terminals enables high-density mounting, precise soldering, and efficient signal routing on the PCB.
Dedicated inputs and a high number of I/O lines provide versatility and flexibility for implementing custom logic functions and interfaces.
Wide minimum operating temperature range ensures reliable operation in extreme cold environments without performance degradation.
Tin lead finishing of terminals provides good solderability, corrosion resistance, and electrical conductivity for reliable connections.
Bottom position of terminals facilitates easy PCB layout and component placement, reducing signal interference and improving signal integrity.
Moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and handling, requiring proper precautions.
Low seated height allows for compact and slim design of the PLD, facilitating integration into space-constrained electronic devices.
Compact width of the PLD enables efficient use of space on the PCB and supports high-density mounting in electronic systems.
High maximum clock frequency allows for fast operation and precise timing control in the PLD, suitable for demanding real-time applications.
Allowing for a maximum time of 30 seconds at peak reflow temperature ensures reliable solder joints and prevents thermal damage during assembly.
High peak reflow temperature of 240°C enables lead-free soldering processes and ensures robust solder joints for long-term reliability.
Compact length of the PLD facilitates space-saving design and efficient placement on the PCB, ideal for compact electronic devices.
Supports JTAG boundary scan testing for easy debugging, programming, and testing of the PLD, enhancing reliability and production efficiency.
High number of I/O lines enables versatile interfacing, signal routing, and connectivity options for complex logic designs and external devices.
Industrial-grade temperature grading ensures reliable performance in harsh operating conditions, making the PLD suitable for industrial applications.
Programmable Logic Devices (PLD) XCR3064XL-7CS48I attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx
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XCR3064XL-7CS48I Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult DEV EOL 01/Jan/2024
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
LM317T
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
Siemens
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N2222A
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
2N7002
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Lite-on Semiconductor
Eic Semiconductor
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
SZNUP2105LT1G
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
C1206C104K5RACTU
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
ATF1502AS-10AU44
Microchip Technology
ATF1502AS-10AU44 by Microchip Technology is a 5.5V PLD with 10ns propagation delay, featuring 32 macro cells and 36 inputs. Ideal for PAL-type applications, it offers in-system programmability, operates b/w -40 to 85°C, and supports JTAG boundary scan testing at up to 83.33MHz clock frequency.
EPM3032ATC44-4N
Intel
Intel's EPM3032ATC44-4N is a 32 macrocell EE PLD with 4.5 ns propagation delay, operating at up to 227.3 MHz clock frequency. Ideal for applications requiring in-system programmability and featuring 34 I/O lines, this CMOS technology PLD has a max supply voltage of 3.6 V and operates within -40 to +85°C temperature range.
M4A5-192/96-10VNC
Lattice Semiconductor
M4A5-192/96-10VNC by Lattice Semiconductor is a 192 macrocell EE PLD with 96 I/O lines, operating at up to 62.5 MHz. It features a propagation delay of 10 ns and can be in-system programmable for various applications requiring fast processing speeds and high I/O capabilities. The device comes in a square package with gull wing terminals, making it suitable for commercial temperature environments.
SLG46855V
Dialog Semiconductor
OT PLD; Form Of Terminal: NO LEAD; No. of Terminals: 14; Package Code: VQCCN; Package Shape: RECTANGULAR; No. of Inputs: 11;
EPM2210F324I5N
The Intel EPM2210F324I5N is a programmable logic device (PLD) with 1700 macro cells and 272 inputs/outputs. It uses CMOS technology and has a max supply voltage of 2.625V. This PLD is suitable for applications requiring in-system programmability and output functions using macrocells.
5M240ZM100I5N
Altera
The Altera 5M240ZM100I5N is a programmable logic device with 192 macro cells and a maximum clock frequency of 118.3 MHz. It has a propagation delay of 14 ns and operates at a nominal supply voltage of 1.8 V. This device is commonly used in industrial applications requiring high-speed processing and in-system programmability.
EPM1270T144C5N
EPM1270T144C5N by Intel is a Flash PLD with 980 macro cells, 116 inputs/outputs, and a propagation delay of 10 ns. It is ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its low profile package style and CMOS technology.
SLG46826VTR
Renesas Electronics
SLG46826VTR by Renesas Electronics is a programmable logic device (PLD) with 19 macro cells and 13 inputs. It has a max supply voltage of 5.5V and can be used for in-system programming, with an output function of macrocell.
ATF1508ASL-25AU100
Atmel
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EPM7128SQI100-10N
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;
EPF10K200SRC240-3N
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
ATF1502AS-7AX44
ATF1502AS-7AX44 by Microchip Technology is a 32 macrocell EE PLD with 36 inputs and 32 I/O lines. It has a propagation delay of 7.5 ns, operates at max clock frequency of 95.23 MHz, and supports JTAG boundary scan test. Ideal for applications requiring fast processing speeds in programmable logic devices.
LC4064ZE-7TN48I
LC4064ZE-7TN48I by Lattice Semiconductor is a 64 macrocell EE PLD with 7.5 ns propagation delay, ideal for applications requiring in-system programmability and 111 MHz clock frequency. With a square package and GULL WING terminals, it offers 32 I/O lines and JTAG boundary scan test capability.
EPM7128BTC100-4N
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
ATF1504AS-10AU100-T
Microchip Technology's ATF1504AS-10AU100-T is a 5V EE PLD with 64 I/O lines, 10ns propagation delay, and 125MHz clock frequency. Ideal for industrial applications requiring high-speed data processing in a compact square package with gull wing terminals.
ATF22V10C-7JU
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
GAL16V8D-15LPN
GAL16V8D-15LPN by Lattice Semiconductor is a 5.25V CMOS PLD with 15ns propagation delay, ideal for PAL-type applications. Featuring 18 inputs and 8 I/O lines, this EE PLD has a clock frequency of up to 45.5MHz and operates b/w 0-70°C, making it suitable for commercial use in various programmable logic designs.
EPM570GM100C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE;
EPM7160ELC84-15
EPM7160ELC84-15 by Intel is a 160 macrocell EE PLD with 15ns propagation delay, suitable for applications requiring high-speed processing. It operates at a max clock frequency of 100MHz and has 64 I/O lines, making it ideal for commercial-grade programmable logic solutions. With a package style of chip carrier and square shape, this CMOS technology-based PLD offers versatile surface-mount capabilities.
EPM240T100I3N
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Additional Features: IT CAN ALSO OPERATE AT 3.3V;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCR3128XL-10VQG100C
Xilinx
Xilinx XCR3128XL-10VQG100C is a 128 macrocell EE PLD with 84 I/O lines, operating at max 95 MHz clock frequency. It has a propagation delay of 10 ns and supports JTAG boundary scan test. Ideal for applications requiring fast processing speeds and high I/O capabilities in commercial temperature environments.
XCR3032XL-7CSG48I
Xilinx XCR3032XL-7CSG48I is a 32 macrocell EE PLD with 7.5ns propagation delay, operating at max clock frequency of 119MHz. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan test capability.
XCR3128XL-10VQG100I
Xilinx XCR3128XL-10VQG100I is a 128 macrocell EE PLD with 84 I/O lines. It operates at max clock frequency of 95 MHz, with propagation delay of 10 ns. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.
XCR3256XL-10TQG144C
Xilinx XCR3256XL-10TQG144C is a 256 macrocell EE PLD with 120 I/O lines, operating at up to 105 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for applications requiring high-speed processing and versatile I/O capabilities in commercial-grade environments.
XCR3256XL-12TQ144I
Xilinx XCR3256XL-12TQ144I is a 256 macrocell EE PLD with 120 I/O lines, operating at max 88 MHz clock frequency. It has in-system programmability and JTAG boundary scan test capability. Ideal for industrial applications requiring fast propagation delay of 12 ns and wide temperature range from -40 to 85 °C.
XCR3032XL-10VQG44I
Xilinx XCR3032XL-10VQG44I is a 32 macrocell EE PLD with 36 I/O lines, operating at up to 95 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed logic functions in a compact form factor.
XCR3032XL-10VQG44C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
XCR3064XL-10VQG44C
Xilinx XCR3064XL-10VQG44C is a 64-macrocell EE PLD with 36 I/O lines, operating at max 95 MHz clock frequency. It features in-system programmability, JTAG boundary scan test, and propagation delay of 10 ns. Ideal for applications requiring fast processing speeds and versatile I/O capabilities in commercial-grade environments.
XCR3064XL-10VQG100C
Xilinx XCR3064XL-10VQG100C is a 64 macrocell EE PLD with 68 I/O lines, operating at max 95 MHz. It features in-system programmability, JTAG boundary scan test, and propagation delay of 10 ns. Ideal for applications requiring fast processing speeds and versatile I/O configurations in commercial-grade environments.
XCR3128XL-10VQ100I
Xilinx XCR3128XL-10VQ100I is a 128 macrocell EE PLD with 84 I/O lines, operating at max 95 MHz clock frequency. It has in-system programmability and JTAG boundary scan test support. Ideal for industrial applications requiring fast processing and high I/O capabilities in compact form factor.
XCR3256XL-10TQG144I
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XCR3128XL-10TQG144C
Xilinx XCR3128XL-10TQG144C is a 128 macrocell EE PLD with 108 I/O lines, operating at max clock freq of 95 MHz. In-system programmable, it has propagation delay of 10 ns and operates within -40 to +85 °C range. Ideal for applications requiring high-speed logic processing in commercial environments.
XCR3256XL-12TQ144C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XCR3128XL-10VQ100C
The Xilinx XCR3128XL-10VQ100C is a programmable logic device with 128 macro cells. It operates on a max supply voltage of 3.6V and has a propagation delay of 10ns. This PLD is commonly used for applications requiring in-system programmability and a clock frequency of up to 95MHz.
XCR3128XL-7TQG144I
XCR3256XL-10TQ144I
Xilinx XCR3256XL-10TQ144I is a 256 macrocell EE PLD with 120 I/O lines, operating at up to 105 MHz. It has a propagation delay of 10 ns and can handle supply voltages from 2.7V to 3.6V. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing in a compact square package.
XCR3064XL-10VQG44I
Xilinx XCR3064XL-10VQG44I is a 64 macrocell EE PLD with 36 I/O lines, operating at max 95 MHz. It has a propagation delay of 10 ns and can handle supply voltages from 2.7 V to 3.6 V. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.
XCR3128XL-7VQ100I
XCR3064XL-10VQG100I
XCR3512XL-10PQG208C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
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