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W968D6DAGX7I

Winbond Electronics

W968D6DAGX7I by Winbond Electronics

Winbond Electronics' W968D6DAGX7I is a 16Mx16 SRAM with 1.8V supply, 70ns access time, and 3-STATE output. Ideal for industrial applications, it features a very thin profile grid array package with common I/O type and asynchronous operation mode.

Median Price

$6.609

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$6.497

100+ parts

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500

$6.497

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Bristol Electronics

USA . 6 parts In-Stock

1+ parts

$6.720

100+ parts

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6

$6.720

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Vyrian

USA . 7,759 parts In-Stock

1+ parts

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7,759

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NexGen Digital

USA . 162 parts In-Stock

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162

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,756 parts In-Stock

1+ parts

$3.700

100+ parts

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3,756

$3.700

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Corohmni

South Africa . 249 parts In-Stock

1+ parts

$4.876

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249

$4.876

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AZTECH Wire

Italy . 725 parts In-Stock

1+ parts

$5.361

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725

$5.361

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Continental Prestige Electronics

USA . 5,274 parts In-Stock

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5,274

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 3,568 parts In-Stock

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3,568

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$6.367

1k+ parts

$6.172

10k+ parts

$6.042

1,000

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$6.367

$6.172

$6.042

Overview

Experience the ultimate in high-quality memory solutions with the W968D6DAGX7I by Winbond Electronics. As a leading manufacturer in the industry, Winbond Electronics delivers top-notch SRAM technology that guarantees reliability and performance. Ideal for various applications, this product offers unparalleled value with its fast access times and low power consumption. Trust Winbond Electronics to provide you with the memory solution you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring the product will last a long time.

Operating Mode: ASYNCHRONOUS

Allows for independent operation of memory access, increasing efficiency and performance.

Nominal Supply Voltage / Vsup (V): 1.8

Efficient power consumption and compatibility with devices requiring 1.8V supply voltage.

Temperature Grade: INDUSTRIAL

Can operate in a wide range of temperatures, making it suitable for industrial applications.

Memory IC Type: PSEUDO STATIC RAM

Combines the benefits of fast read and write operations of static RAM with the high density of dynamic RAM, making it a versatile choice for memory applications.

Maximum Access Time: 70 ns

Ensures quick access to data, improving overall system performance.

Technical Specifications

SRAM W968D6DAGX7I attributes and parameters. Explore more SRAM devices from Winbond Electronics

Specs

Maximum Access Time:

70 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B54

Length:

8 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX16

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.0004 Amp

Minimum Standby Voltage:

1.7 V

Sub-Category:

Other Memory ICs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

W968D6DAGX7I Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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