Loading...

W632GU6NB-11

Winbond Electronics

W632GU6NB-11 by Winbond Electronics

W632GU6NB-11 by Winbond Electronics is a DDR3L DRAM with 128MX16 organization, 1.35V nominal voltage, and 95°C max operating temp. Ideal for applications requiring high memory density and fast access speeds in compact electronic devices.

Median Price

$3.640

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,334 parts In-Stock

1+ parts

$3.640

100+ parts

$3.270

1k+ parts

$3.160

10k+ parts

$3.100

1,334

$3.640

$3.270

$3.160

$3.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TECHDesign

Taiwan . 48,265 parts In-Stock

1+ parts

$4.470

100+ parts

$4.200

1k+ parts

$3.890

10k+ parts

-

48,265

$4.470

$4.200

$3.890

-

Cyclops Electronics Ltd

UK . 15,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,840

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

QUARKTWIN TECHNOLOGY LTD

USA . 26,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,692

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Futuretech Components

Singapore . 222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

222

-

-

-

-

Overview

Unlock the power of cutting-edge technology with Winbond Electronics' W632GU6NB-11 DDR3L DRAM module. Designed for optimal performance and reliability, this memory component boasts a sleek rectangular package body made of durable plastic/epoxy material. With synchronous operation and a nominal supply voltage of 1.35V, this versatile module is perfect for a wide range of applications. Whether you're a gamer, creative professional, or tech enthusiast, the Winbond W632GU6NB-11 offers unbeatable value, speed, and efficiency for all your computing needs. Elevate your system's performance today with Winbond Electronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability, making the product ideal for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort.

Nominal Supply Voltage / Vsup (V): 1.35

Operating at a nominal supply voltage of 1.35V ensures efficient power consumption and optimal performance.

Maximum Operating Temperature: 95 °C

With a maximum operating temperature of 95°C, the product can withstand high temperatures and operate reliably in various environments.

Organization: 128MX16

Organized as 128MX16, the product provides a high memory capacity and data width, suitable for handling large amounts of data efficiently.

Access Mode: MULTI BANK PAGE BURST

The multi-bank page burst access mode allows for faster data retrieval and processing, enhancing overall system performance.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed operation, making the product energy-efficient and reliable.

Memory IC Type: DDR3L DRAM

Being DDR3L DRAM, the memory IC type ensures high-speed data transfer rates and compatibility with a wide range of systems, making it a versatile choice.

Technical Specifications

DRAM W632GU6NB-11 attributes and parameters. Explore more DRAM devices from Winbond Electronics

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PBGA-B96

Length:

13 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

W632GU6NB-11 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.