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W25Q64FVSFIG

Winbond Electronics

W25Q64FVSFIG by Winbond Electronics

W25Q64FVSFIG by Winbond Electronics is an 8MX8 flash memory IC with a memory density of 67108864 bit. It operates in synchronous mode with a max clock frequency of 104 MHz and features hardware/software write protection. This small outline package is ideal for industrial applications requiring reliable data storage and retrieval at temperatures ranging from -40 to 85 °C.

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J2 Sourcing AB

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Nova Conductors

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Cyclops Electronics Ltd

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First Choice Components Inc.

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Aztec Data Supply Inc.

USA . 1,651 parts In-Stock

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Corohmni

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AZTECH Wire

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Overview

Enhance your electronic devices with the high-quality W25Q64FVSFIG flash memory by industry leader Winbond Electronics. Perfect for a wide range of applications, this compact chip offers exceptional value and benefits to customers looking for reliable storage solutions. With advanced technology and superior performance, this flash memory provides fast and efficient data storage while ensuring durability and security. Upgrade your devices with the Winbond W25Q64FVSFIG and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the flash memory, making it a reliable choice for long-term use.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into various devices, providing flexibility in design and space-saving benefits.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient and accurate data transfers, enhancing overall performance and reliability of the flash memory.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this flash memory can withstand various environmental conditions, ensuring stable performance in challenging situations.

Memory Density: 67108864 bit

The high memory density allows for storing a large amount of data in a compact space, making this flash memory suitable for applications requiring high storage capacity.

Technical Specifications

Flash Memory W25Q64FVSFIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

JESD-30 Code:

R-PDSO-G16

Length:

10.31 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00005 Amp

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.49 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q64FVSFIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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