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W25Q128FVPIG

Winbond Electronics

W25Q128FVPIG by Winbond Electronics

W25Q128FVPIG by Winbond Electronics is a 128M NOR flash memory with SPI serial bus, operating at 104 MHz. It has a supply voltage of 2.7-3.6 V and endurance of 100K cycles. Ideal for industrial applications requiring fast data transfer and reliable non-volatile storage in compact devices.

Median Price

$1.690

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$1.690

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15

$1.690

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Chip Stock

USA . 16,000 parts In-Stock

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16,000

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Vyrian

USA . 3,017 parts In-Stock

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3,017

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ComSIT Distribution GmbH

Germany . 500 parts In-Stock

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500

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Distributors (Availability)

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Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

$1.690

100+ parts

$1.606

1k+ parts

$1.525

10k+ parts

$1.504

800

$1.690

$1.606

$1.525

$1.504

AZTECH Wire

Italy . 823 parts In-Stock

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$14.183

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823

$14.183

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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Kepictronics

USA . 9,306 parts In-Stock

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Perfect Parts

USA . 5,624 parts In-Stock

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Overview

Enhance your electronics projects with the W25Q128FVPIG by Winbond Electronics, a high-quality flash memory that offers reliable performance and durability. As a leading manufacturer in the industry, Winbond Electronics ensures top-notch products for various applications. With its compact size, low power consumption, and fast operating mode, this flash memory is perfect for industrial-grade projects. Trust Winbond Electronics to provide you with the best memory solution for your needs. Choose W25Q128FVPIG for superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the flash memory, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data transfer and processing speeds.

Nominal Supply Voltage / Vsup (V): 3

Stable supply voltage of 3V ensures consistent performance of the flash memory.

Write Protection: HARDWARE/SOFTWARE

Hardware and software write protection features provide added security for the stored data.

Endurance: 100000 Write/Erase Cycles

High endurance rating of 100,000 write/erase cycles ensures longevity and reliability of the flash memory.

Memory Density: 134217728 bit

High memory density allows for storing a large amount of data in a compact form factor.

Technical Specifications

Flash Memory W25Q128FVPIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

6 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q128FVPIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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